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1. 发明授权

US09129908B2 Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package 有权
标题翻译：制造包括在封装的支撑结构内的嵌入式电路部件的半导体封装
公开(公告)号：US09129908B2
公开(公告)日：2015-09-08
申请号：US13296707
申请日：2011-11-15
申请人： Jovica Savic , Zhiping Yang , Jie Xue , Li Li
发明人： Jovica Savic , Zhiping Yang , Jie Xue , Li Li
IPC分类号： H01L21/00 , H01L23/31 , H01L23/24
CPC分类号： H05K1/183 , H01L23/24 , H01L23/3107 , H01L23/49838 , H01L2224/16225 , H01L2924/0002 , H05K1/115 , H05K1/181 , H05K2201/095 , H05K2201/10492 , H05K2201/10507 , H01L2924/00
摘要： A method and apparatus are provided in which a cavity is formed in a support structure, the support structure being operable to support a semiconductor device, disposing at least a portion of a circuit element in the cavity in the support structure, filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material, and electrically connecting the semiconductor device to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.
摘要翻译：提供了一种方法和装置，其中空腔形成在支撑结构中，支撑结构可操作以支撑半导体器件，将电路元件的至少一部分设置在支撑结构中的空腔中，将空腔填充在支撑结构，其具有不导电的填充材料，以至少部分地围绕电路元件与非导电填充材料，并将半导体器件电连接到电路元件。在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。

2. 发明申请

US20120032693A1 Crack detection in a semiconductor die and package 审中-公开
标题翻译：半导体芯片和封装中的裂纹检测
公开(公告)号：US20120032693A1
公开(公告)日：2012-02-09
申请号：US12849426
申请日：2010-08-03
申请人： Jie Xue , ShiJie Wen
发明人： Jie Xue , ShiJie Wen
IPC分类号： G01R27/08 , H01L23/498
CPC分类号： G01R31/2896 , H01L23/562 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16251 , H01L2924/00
摘要： A method is provided in which an impedance is measured between a first of a plurality of seal ring contact pads and a ground contact pad coupled to a semiconductor substrate of a semiconductor device. The first impedance value is obtained from the measured impedance, and the first impedance value is compared with a reference impedance value to determine whether a structural defect is present in the semiconductor device based on whether the first impedance value is greater than the reference impedance value.
摘要翻译：提供了一种方法，其中在多个密封环接触焊盘中的第一个与耦合到半导体器件的半导体衬底的接地焊盘之间测量阻抗。从测量的阻抗获得第一阻抗值，并且将第一阻抗值与参考阻抗值进行比较，以基于第一阻抗值是否大于参考阻抗值来确定半导体器件中是否存在结构缺陷。

3. 发明授权

US07675147B1 Methods and apparatus for providing a power signal to an area array package 有权
标题翻译：用于向区域阵列封装提供功率信号的方法和装置
公开(公告)号：US07675147B1
公开(公告)日：2010-03-09
申请号：US11936577
申请日：2007-11-07
申请人： Kenneth Hubbard , Jie Xue , Yida Zou , Zhiping Yang
发明人： Kenneth Hubbard , Jie Xue , Yida Zou , Zhiping Yang
IPC分类号： H01L23/495
CPC分类号： H01L23/50 , H01L23/49816 , H01L23/49838 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0263 , H05K3/3436 , H05K2201/094 , H05K2201/10734 , Y02P70/613
摘要： An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary electrical contacts coupled to the coupling surface of the device and configured to carry power signals between the area array package and the circuit board. The additional series of secondary electrical contacts provides a relatively large amount of power to the area array package while allowing a manufacturer to maintain the number of primary electrical contacts of the grid array configured to carrying data signals and therefore maintain the overall performance of the area array package.
摘要翻译：区域阵列器件具有耦合到器件的耦合表面并被配置为在区域阵列封装和电路板之间传送数据信号的主要电触点的栅格阵列。区域阵列器件还具有耦合到器件的耦合表面的另外的一系列辅助电触点，并被配置为在区域阵列封装和电路板之间承载功率信号。附加的一系列次级电触点为区域阵列封装提供相对大量的电力，同时允许制造商保持配置为承载数据信号的电网阵列的初级电触点的数量，并因此保持区域阵列的整体性能包。

4. 发明授权

US07303941B1 Methods and apparatus for providing a power signal to an area array package 有权
标题翻译：用于向区域阵列封装提供功率信号的方法和装置
公开(公告)号：US07303941B1
公开(公告)日：2007-12-04
申请号：US10799479
申请日：2004-03-12
申请人： Kenneth Hubbard , Jie Xue , Yida Zou , Zhiping Yang
发明人： Kenneth Hubbard , Jie Xue , Yida Zou , Zhiping Yang
IPC分类号： H01L21/44
CPC分类号： H01L23/50 , H01L23/49816 , H01L23/49838 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0263 , H05K3/3436 , H05K2201/094 , H05K2201/10734 , Y02P70/613
摘要： An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary electrical contacts coupled to the coupling surface of the device and configured to carry power signals between the area array package and the circuit board. The additional series of secondary electrical contacts provides a relatively large amount of power to the area array package while allowing a manufacturer to maintain the number of primary electrical contacts of the grid array configured to carrying data signals and therefore maintain the overall performance of the area array package.
摘要翻译：区域阵列器件具有耦合到器件的耦合表面并被配置为在区域阵列封装和电路板之间传送数据信号的主要电触点的栅格阵列。区域阵列器件还具有耦合到器件的耦合表面的另外的一系列辅助电触点，并被配置为在区域阵列封装和电路板之间承载功率信号。附加的一系列次级电触点为区域阵列封装提供相对大量的电力，同时允许制造商保持配置为承载数据信号的电网阵列的初级电触点的数量，并因此保持区域阵列的整体性能包。

5. 发明授权

US07254032B1 Techniques for providing EMI shielding within a circuit board component 有权
标题翻译：在电路板部件内提供EMI屏蔽的技术
公开(公告)号：US07254032B1
公开(公告)日：2007-08-07
申请号：US10792101
申请日：2004-03-03
申请人： Jie Xue , Zhiping Yang , Yida Zou
发明人： Jie Xue , Zhiping Yang , Yida Zou
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： H01L23/3675 , H01L23/49816 , H01L23/49822 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H01L2924/16251 , H05K9/0039 , H01L2924/00
摘要： A circuit board component includes a substrate having non-conductive material and conductive material supported by the non-conductive material. The conductive material defines a circuit board interface, a die interface, a heat spreader interface, and (iv) a set of connections which interconnects the circuit board interface, the die interface and the heat spreader interface. The component further includes a die coupled to the die interface. The die includes integrated circuitry which is configured to electrically communicate with a circuit board when the circuit board couples to the circuit board interface. The component further includes a heat spreader coupled to the heat spreader interface. The heat spreader is configured to dissipate heat from the die. The heat spreader in combination with the heat spreader interface forms an electromagnetic interference shield when a portion of the circuit board interface connects to a ground reference of the circuit board.
摘要翻译：电路板部件包括具有非导电材料的基板和由非导电材料支撑的导电材料。导电材料限定了电路板接口，管芯接口，散热器接口，以及（iv）连接电路板接口，管芯接口和散热器接口的一组连接。该组件还包括耦合到管芯接口的管芯。芯片包括集成电路，其被配置为当电路板耦合到电路板接口时与电路板电连通。该部件还包括耦合到散热器接口的散热器。散热器配置成从模具中散热。散热器与散热器接口相结合形成电磁干扰屏蔽，当电路板接口的一部分连接到电路板的接地基准时。

6. 发明授权

US06581069B1 Automated activation and deactivation of operational data logging on medical imaging device 失效
标题翻译：自动启动和停用医疗成像设备上的操作数据记录
公开(公告)号：US06581069B1
公开(公告)日：2003-06-17
申请号：US09585218
申请日：2000-06-01
申请人： Naja S. Robinson , Lawrence E. Ploetz , Jie Xue
发明人： Naja S. Robinson , Lawrence E. Ploetz , Jie Xue
IPC分类号： G06F1730
CPC分类号： G06F19/3418 , G06F19/00 , G06F19/324 , G16H15/00 , G16H40/63 , Y10S707/922 , Y10S707/99945
摘要： A method and a system for automatically activating and deactivating a data logging function on a remotely located medical imaging device from a central service facility in response to acquisition of updated service contract information. Customer profiling and service contract data are automatically processed at a central facility to detect that a medical imaging device is now under contract to receive regular scanner utilization reports. The scanner data logging function is then automatically turned on from the central facility. The central facility then monitors the receipt of scanner data log files to ensure that the first data log file has been successfully transmitted from activated medical imaging device, for processing and subsequent utilization report delivery. In the case of an expired service contract, the data logging feature on the medical imaging device is automatically deactivated from the central facility.
摘要翻译：一种方法和系统，用于响应于获取更新的服务契约信息，从中央服务设施自动激活和停用位于远程位置的医疗成像设备上的数据记录功能。客户分析和服务合同数据在中央设施自动处理，以检测医疗成像设备现在正在合同中以接收常规的扫描仪利用率报告。然后，扫描仪数据记录功能将从中央设备自动打开。中央设施然后监视扫描仪数据日志文件的接收，以确保已经从激活的医学成像设备成功传送第一个数据日志文件，以进行处理和随后的使用报告传送。在过期的服务合同的情况下，医疗成像设备上的数据记录功能将从中央设施自动停用。

7. 发明授权

US06071476A Exhaust gas sensor 失效
标题翻译：废气传感器
公开(公告)号：US06071476A
公开(公告)日：2000-06-06
申请号：US970259
申请日：1997-11-14
申请人： Daniel Young , Jeffrey Naber , Neil Adams , Edward Balko , Patrick Blosser , Linda Hratko , Gerald Koermer , Jie Xue , Adam Moya , Chowdary Koripella
发明人： Daniel Young , Jeffrey Naber , Neil Adams , Edward Balko , Patrick Blosser , Linda Hratko , Gerald Koermer , Jie Xue , Adam Moya , Chowdary Koripella
IPC分类号： G01N25/30 , G01N27/16 , G01N25/20
CPC分类号： G01N25/30 , G01N27/16
摘要： A differential calorimetric gas sensor (10) which includes a sensing element (12) having a catalytic layer (14) disposed on a multi-layered substrate (26). Catalytic layer (14) includes an active catalyst region (14a) which oxidizes total combustibles within an exhaust gas stream and a reference catalyst region (14b) which oxidizes selective combustibles within the exhaust gas stream. An electrochemical oxygen source (18) is disposed on an opposite side of multi-layer substrate (26) from sensing element (12). An oxygen sensor cell (170) may be incorporated into electrochemical oxygen source (18). The multi-layered substrate (26) includes a plurality of overlaying insulating layers in which an intermediate layer (60) and a bottom layer (64) support primary heaters (58, 62), and in which another intermediate layer (52) supports compensation heaters (50a, 50b). The primary heaters (58, 62) function to maintain sensor (10) at a substantially constant temperature, while the compensation heaters (50a, 50b) function to restore temperature deviations determined by temperature-sensitive elements (46a, 46b) located on an inner layer (48) overlaying the compensation heaters (50a, 50b) resulting from the catalytic reactions taking place at the surfaces (34a, 34b) of the catalyst regions (14a, 14b). The control circuitry (300) operates to control the primary heater (58, 62) and the compensation heaters (50a, 50b), as well as to minimize the response variations of the temperature-sensitive elements (46a, 46b).
摘要翻译：一种差压量气体传感器（10），其包括具有设置在多层基板（26）上的催化层（14）的感测元件（12）。催化层（14）包括氧化废气流内的总可燃物的活性催化剂区域（14a）和在排气流中氧化选择性可燃物的参考催化剂区域（14b）。电化学氧源（18）设置在多层基板（26）的与感测元件（12）相对的一侧上。氧传感器单元（170）可以结合到电化学氧源（18）中。多层基板（26）包括多个覆盖绝缘层，其中中间层（60）和底层（64）支撑主加热器（58,62），并且其中另一中间层（52）支撑补偿加热器（50a，50b）。主加热器（58,62）用于将传感器（10）保持在基本上恒定的温度，而补偿加热器（50a，50b）起到恢复由位于内部的温度敏感元件（46a，46b）确定的温度偏差的作用覆盖在催化剂区域（14a，14b）的表面（34a，34b）处发生的催化反应产生的补偿加热器（50a，50b）的层（48）。控制电路（300）操作以控制主加热器（58,62）和补偿加热器（50a，50b），以及使温度敏感元件（46a，46b）的响应变化最小化。

8. 发明授权

US08689081B2 Techniques for embedded memory self repair 有权
标题翻译：嵌入式内存自我修复技术
公开(公告)号：US08689081B2
公开(公告)日：2014-04-01
申请号：US13304838
申请日：2011-11-28
申请人： Andy Yu , Pierre Chor-Fung Chia , ShiJie Wen , Jie Xue
发明人： Andy Yu , Pierre Chor-Fung Chia , ShiJie Wen , Jie Xue
IPC分类号： G11C29/00
CPC分类号： G06F11/1048
摘要： Techniques are provided for classifying and correcting errors in a bit sequence. At a memory control device, access is requested to a first bit sequences that is stored in a bit sequence database of a memory component and associated with an address. An error is detected in the first bit sequence, and the address associated with the bit sequence is compared to addresses stored in an address database of a content addressable memory component to determine if there is a match. When there is a match, the error is classified as a hard bit error. When there is not a match, the error is classified as a soft bit error.
摘要翻译：提供技术用于对位序列中的错误进行分类和纠正。在存储器控制装置中，请求访问存储在存储器组件的位序列数据库中并与地址相关联的第一位序列。在第一比特序列中检测到错误，并且将与比特序列相关联的地址与存储在内容可寻址存储器组件的地址数据库中的地址进行比较，以确定是否存在匹配。当有匹配时，错误被分类为硬比特错误。当没有匹配时，错误被分类为软比特错误。

9. 发明申请

US20130122658A1 MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED CIRCUIT COMPONENT WITHIN A SUPPORT STRUCTURE OF THE PACKAGE 有权
标题翻译：在包装的支持结构中制造包括嵌入式电路组件的半导体封装
公开(公告)号：US20130122658A1
公开(公告)日：2013-05-16
申请号：US13296707
申请日：2011-11-15
申请人： Jovica Savic , Zhiping Yang , Jie Xue , Li Li
发明人： Jovica Savic , Zhiping Yang , Jie Xue , Li Li
IPC分类号： H01L21/56
CPC分类号： H05K1/183 , H01L23/24 , H01L23/3107 , H01L23/49838 , H01L2224/16225 , H01L2924/0002 , H05K1/115 , H05K1/181 , H05K2201/095 , H05K2201/10492 , H05K2201/10507 , H01L2924/00
摘要： A method and apparatus are provided in which a cavity is formed in a support structure, the support structure being operable to support a semiconductor device, disposing at least a portion of a circuit element in the cavity in the support structure, filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material, and electrically connecting the semiconductor device to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.
摘要翻译：提供了一种方法和装置，其中空腔形成在支撑结构中，支撑结构可操作以支撑半导体器件，将电路元件的至少一部分设置在支撑结构中的空腔中，将空腔填充在支撑结构，其具有不导电的填充材料，以至少部分地围绕电路元件与非导电填充材料，并将半导体器件电连接到电路元件。在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。

10. 发明授权

US08093921B2 Monitoring of interconnect reliability using a programmable device 有权
标题翻译：使用可编程器件监控互连可靠性
公开(公告)号：US08093921B2
公开(公告)日：2012-01-10
申请号：US12370607
申请日：2009-02-13
申请人： Nandakumar Krishnan , Xinli Gu , Li Li , Jie Xue , Jonathan M. Parlan
发明人： Nandakumar Krishnan , Xinli Gu , Li Li , Jie Xue , Jonathan M. Parlan
IPC分类号： G01R31/304 , G01R31/02
CPC分类号： G01R31/026 , G01R31/2894
摘要： In one embodiment, the reliability of the L2 power and/or ground sub-arrays of contacts of a functional integrated circuit device is verified by applying a reference voltage to a selected contact in sub-array and sequentially measuring the voltage at other contacts in the sub-array. If the voltage levels are greater than a threshold voltage level then the functional integrated circuit device is verified as being reliable.
摘要翻译：在一个实施例中，功能集成电路器件的L2电源和/或接地子阵列的可靠性通过将参考电压施加到子阵列中的所选择的触点并且顺序地测量其中的触点的电压来验证子阵列如果电压电平大于阈值电压电平，则功能集成电路器件被验证为可靠的。

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