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1. 发明授权

US07675147B1 Methods and apparatus for providing a power signal to an area array package 有权
标题翻译：用于向区域阵列封装提供功率信号的方法和装置
公开(公告)号：US07675147B1
公开(公告)日：2010-03-09
申请号：US11936577
申请日：2007-11-07
申请人： Kenneth Hubbard , Jie Xue , Yida Zou , Zhiping Yang
发明人： Kenneth Hubbard , Jie Xue , Yida Zou , Zhiping Yang
IPC分类号： H01L23/495
CPC分类号： H01L23/50 , H01L23/49816 , H01L23/49838 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0263 , H05K3/3436 , H05K2201/094 , H05K2201/10734 , Y02P70/613
摘要： An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary electrical contacts coupled to the coupling surface of the device and configured to carry power signals between the area array package and the circuit board. The additional series of secondary electrical contacts provides a relatively large amount of power to the area array package while allowing a manufacturer to maintain the number of primary electrical contacts of the grid array configured to carrying data signals and therefore maintain the overall performance of the area array package.
摘要翻译：区域阵列器件具有耦合到器件的耦合表面并被配置为在区域阵列封装和电路板之间传送数据信号的主要电触点的栅格阵列。区域阵列器件还具有耦合到器件的耦合表面的另外的一系列辅助电触点，并被配置为在区域阵列封装和电路板之间承载功率信号。附加的一系列次级电触点为区域阵列封装提供相对大量的电力，同时允许制造商保持配置为承载数据信号的电网阵列的初级电触点的数量，并因此保持区域阵列的整体性能包。

2. 发明授权

US07303941B1 Methods and apparatus for providing a power signal to an area array package 有权
标题翻译：用于向区域阵列封装提供功率信号的方法和装置
公开(公告)号：US07303941B1
公开(公告)日：2007-12-04
申请号：US10799479
申请日：2004-03-12
申请人： Kenneth Hubbard , Jie Xue , Yida Zou , Zhiping Yang
发明人： Kenneth Hubbard , Jie Xue , Yida Zou , Zhiping Yang
IPC分类号： H01L21/44
CPC分类号： H01L23/50 , H01L23/49816 , H01L23/49838 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0263 , H05K3/3436 , H05K2201/094 , H05K2201/10734 , Y02P70/613
摘要： An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary electrical contacts coupled to the coupling surface of the device and configured to carry power signals between the area array package and the circuit board. The additional series of secondary electrical contacts provides a relatively large amount of power to the area array package while allowing a manufacturer to maintain the number of primary electrical contacts of the grid array configured to carrying data signals and therefore maintain the overall performance of the area array package.
摘要翻译：区域阵列器件具有耦合到器件的耦合表面并被配置为在区域阵列封装和电路板之间传送数据信号的主要电触点的栅格阵列。区域阵列器件还具有耦合到器件的耦合表面的另外的一系列辅助电触点，并被配置为在区域阵列封装和电路板之间承载功率信号。附加的一系列次级电触点为区域阵列封装提供相对大量的电力，同时允许制造商保持配置为承载数据信号的电网阵列的初级电触点的数量，并因此保持区域阵列的整体性能包。

3. 发明授权

US07019976B1 Methods and apparatus for thermally coupling a heat sink to a circuit board component 有权
标题翻译：将散热器热耦合到电路板部件的方法和装置
公开(公告)号：US07019976B1
公开(公告)日：2006-03-28
申请号：US10454705
申请日：2003-06-04
申请人： Mudasir Ahmad , Kenneth Hubbard
发明人： Mudasir Ahmad , Kenneth Hubbard
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2224/0401
摘要： A heat sink has a flexure member attached to a base of the heat sink and located between the base and an associated circuit board component. As the heat sink attaches to a circuit board carrying the circuit board component, the flexure member conforms to the surface of the circuit board component, thereby thermally contacting the circuit board component. The flexure member absorbs local tolerance differences on the circuit board component to provide a relatively uniform stress across the surface of the circuit board component. The flexure member further limits the amount of stress generated by the heat sink on the circuit board component. When used in conjunction with a heat sink spanning several circuit board components, the flexure member absorbs global tolerance differences among the circuit board components, thereby providing relatively uniform stresses to all of the circuit board components and limiting the amount of stress experienced by any one circuit board component.
摘要翻译：散热器具有附接到散热器的基座并位于基座和相关联的电路板部件之间的挠曲部件。当散热器附接到承载电路板部件的电路板时，挠曲部件符合电路板部件的表面，从而与电路板部件热接触。弯曲构件吸收电路板部件上的局部公差差，以在电路板部件的表面上提供相对均匀的应力。弯曲构件进一步限制由电路板部件上的散热器产生的应力的量。当与散热器组合使用时，挠曲构件吸收电路板部件之间的总体公差差，从而对所有电路板部件提供相对均匀的应力，并限制任何一个电路所经受的应力量板组件。

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