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    • 5. 发明申请
    • SEMICONDUCTOR STRUCTURE AND TESTING METHOD THEREOF
    • 半导体结构及其测试方法
    • US20060091383A1
    • 2006-05-04
    • US11160689
    • 2005-07-06
    • Kun-Fu ChuangFu-Chien ChiuRuey-Way LinJenn-Chang Hwang
    • Kun-Fu ChuangFu-Chien ChiuRuey-Way LinJenn-Chang Hwang
    • H01L23/58
    • G01R31/2858H01L22/10
    • A semiconductor structure and a testing method thereof are provided. The semiconductor structure comprises a substrate, a well, an isothermal heating layer, a first dielectric layer, an interconnection material layer and a second dielectric layer. Wherein, the well is disposed in the substrate, the isothermal heating layer is disposed over the well, the first dielectric layer is disposed between the well and the isothermal heating layer, the interconnection material layer is disposed over the isothermal heating layer, and the second dielectric layer is disposed between the isothermal heating layer and the interconnection material layer. The isothermal heating layer is adapted for maintaining the interconnection metal layer at a predetermined testing temperature so that the testing result can be precise and the testing time can be reduced. Moreover, a low level current can be used as the testing current.
    • 提供了一种半导体结构及其测试方法。 半导体结构包括基板,阱,等温加热层,第一介电层,互连材料层和第二介电层。 其中,井设置在基板中,等温加热层设置在井上,第一介电层设置在井和等温加热层之间,互连材料层设置在等温加热层上,第二介质层设置在等温加热层上, 介电层设置在等温加热层和互连材料层之间。 等温加热层适于将互连金属层保持在预定的测试温度,使得测试结果可以精确并且可以减少测试时间。 此外,可以使用低电平电流作为测试电流。