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    • 7. 发明授权
    • Method of fabricating polysilicon emitters for solar cells
    • 制造太阳能电池用多晶硅发射极的方法
    • US5057439A
    • 1991-10-15
    • US478616
    • 1990-02-12
    • Richard M. SwansonJon-Yiew Gan
    • Richard M. SwansonJon-Yiew Gan
    • H01L31/0224H01L31/068H01L31/18
    • H01L31/022425H01L31/068H01L31/0747H01L31/1804Y02E10/547Y02P70/521
    • Polysilicon contacts for silicon devices such as bipolar junction transistors and silicon solar cells are fabricated in a two step anneal process to improve contact resistance and emitter saturation current density. After a silicon oxide layer is formed on a surface of a silicon substrate, a plurality of openings are formed there through to expose a plurality of contact surfaces on the surface of the silicon substrate. A thin thermally grown silicon oxide layer is then formed on the contact surfaces after which an undoped layer of polysilicon material is formed over the silicon oxide layers. The structure is then annealed at approximately 1050.degree. C. to break the thermally grown silicon oxide layer. Thereafter, a first layer of doped glass is formed over the silicon oxide surface and selectively etched to remove the first layer of glass from a first group of contact surfaces. A second layer of doped glass is then formed over the first group of contact surfaces and over the first layer of doped glass. Thereafter, the silicon substrate is annealed at a temperature of approximately 900.degree. C. thereby driving in dopants from said first and second layers of glass into said polysilicon layer over said first and second groups of contact surfaces. Finally, the layers of glass are removed and the polysilicon layer is patterned to define first and second polysilicon contacts.
    • 在两步退火工艺中制造用于诸如双极结晶体管和硅太阳能电池的硅器件的多晶硅接触,以改善接触电阻和发射极饱和电流密度。 在硅衬底的表面上形成氧化硅层之后,在其上形成多个开口以暴露硅衬底表面上的多个接触表面。 然后在接触表面上形成薄的热生长氧化硅层,之后在氧化硅层上形成未掺杂的多晶硅材料层。 然后将结构在约1050℃退火以破坏热生长的氧化硅层。 此后,在氧化硅表面上形成第一层掺杂玻璃,并选择性地蚀刻以从第一组接触表面去除第一层玻璃。 然后在第一组接触表面上并在第一掺杂玻璃层之上形成第二层掺杂玻璃。 此后,硅衬底在大约900℃的温度下进行退火,从而将所述第一和第二层玻璃的掺杂剂驱动到所述第一和第二组接触表面上的所述多晶硅层中。 最后,去除玻璃层,并且将多晶硅层图案化以限定第一和第二多晶硅接触。