会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • SINGLE SIDE WORKPIECE PROCESSING
    • 单面工件加工
    • US20070137679A1
    • 2007-06-21
    • US11678931
    • 2007-02-26
    • Jason RyeKyle Hanson
    • Jason RyeKyle Hanson
    • B08B3/00
    • H01L21/6719C25D17/001C25D17/06H01L21/67051H01L21/67748H01L21/67751
    • A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins or surfaces on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.
    • 用于处理半导体晶片和类似工件的离心工件处理器包括保持和旋转工件的头部。 头包括具有气体系统的转子。 气体从转子中的入口喷射或喷射以产生旋转气流。 旋转气流导致压力条件,其保持工件的第一面的边缘抵靠转子上的接触销或表面。 转子和工件一起旋转。 与周边相邻的导销可能有助于将工件与转子对准。 有角度的表面有助于将废工艺液体偏离工件。 头部可以与碗一起移动到多个不同的接合位置。 当工件旋转时,碗中的喷嘴将工艺液体喷射到工件的第二面上,以处理工件。 可以使用移动端点检测器来检测处理的终点。
    • 7. 发明申请
    • Apparatus and methods for electrochemical processing of microelectronic workpieces
    • 微电子工件电化学处理的装置和方法
    • US20050205409A1
    • 2005-09-22
    • US11096965
    • 2005-03-29
    • Kyle HansonThomas RitzdorfGregory WilsonPaul McHugh
    • Kyle HansonThomas RitzdorfGregory WilsonPaul McHugh
    • C25D7/12C10B1/00C25C7/00C25D3/00C25D5/00C25D17/00C25D21/00H01L21/00
    • H01L21/6719C25D7/123C25D17/001H01L21/67103H01L21/6723
    • An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.
    • 用于反应容器中微电子工件的电化学处理的装置和方法。 在一个实施例中,反应容器包括:具有外壁的外容器; 分配器,其耦合到所述外部容器,所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流,所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分,以及 所述场成形单元具有至少一个电极室,所述二次流可以通过所述至少一个电极室,而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件,所述界面构件与所述电极室中的所述次流体流体连通,并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流 流。