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1. 发明申请

US20120001203A1 LED CHIP PACKAGE STRUCTURE 审中-公开
标题翻译： LED芯片包装结构
公开(公告)号：US20120001203A1
公开(公告)日：2012-01-05
申请号：US13235585
申请日：2011-09-19
申请人： BILY WANG , JONNIE CHUANG , WEN-KUEI WU
发明人： BILY WANG , JONNIE CHUANG , WEN-KUEI WU
IPC分类号： H01L27/15 , H01L33/50
CPC分类号： G02B6/0073 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： A LED chip package structure includes a substrate unit, a light-emitting unit, and a package unit. The substrate unit includes a strip substrate body. The light-emitting unit includes a plurality of LED chips disposed on the strip substrate body and electrically connected to the strip substrate body. The package unit includes a strip package colloid body disposed on the strip substrate body to cover the LED chips, wherein the strip package colloid body has an exposed top surface and an exposed surrounding peripheral surface connected between the exposed top surface and the strip substrate body, and the strip package colloid body has at least one exposed lens portion projected upwardly from the exposed top surface thereof and corresponding to the LED chips. Hence, light beams generated by the LED chips pass through the strip package colloid body to form a strip light-emitting area on the strip package colloid body.
摘要翻译： LED芯片封装结构包括基板单元，发光单元和封装单元。基板单元包括带状基板主体。发光单元包括设置在带状基板主体上并电连接到带状基板主体的多个LED芯片。包装单元包括：带状包装胶体，其设置在带状基材主体上以覆盖LED芯片，其中带状包装胶体具有暴露的顶表面和连接在暴露的顶表面和带状基片主体之间的暴露的外围表面，并且带状包装胶体具有从其暴露的顶表面向上突出并对应于LED芯片的至少一个露出的透镜部分。因此，由LED芯片产生的光束通过条带封装胶体，在带状封装胶体上形成带状发光区域。

2. 发明授权

US07803641B2 Mold structure for packaging LED chips and method thereof 有权
标题翻译：包装LED芯片的模具结构及其方法
公开(公告)号：US07803641B2
公开(公告)日：2010-09-28
申请号：US11854066
申请日：2007-09-12
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/66 , H01L21/00
CPC分类号： H01L21/565 , H01L21/561 , H01L2224/97 , H01L2224/85
摘要： A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.
摘要翻译：用于封装LED芯片的模具结构包括顶模和底模。底模与上模相配。底模具有主流道，在主流路旁边形成有多个接收空间，分别形成多个用于使接收空间相互横向连通的二次流动通道，以及贯穿底模的多个排出销。

3. 发明授权

US07701124B2 White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blend 有权
标题翻译：具有由硅和荧光体共混物的混合物形成的盖层的白色发光器件
公开(公告)号：US07701124B2
公开(公告)日：2010-04-20
申请号：US11711840
申请日：2007-02-28
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Shan Yu
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Shan Yu
IPC分类号： H01J61/02 , H01J29/06
CPC分类号： C09K11/7731 , C09K11/7734 , H01J1/62 , H01L33/502 , H01L33/504 , H01L2224/48091 , Y02B20/181 , H01L2924/00014
摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.
摘要翻译：白光源具有放置在其上的蓝色发光二极管的基板和包围蓝色发光二极管的盖层。盖层包括硅和磷掺合物的混合物，其比例为1:0.2-0.5。荧光体掺合物包括红色荧光体，绿色荧光体和黄色荧光体。

4. 发明授权

US07671374B2 LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same 有权
标题翻译：具有多个厚引导针的LED芯片封装结构及其制造方法
公开(公告)号：US07671374B2
公开(公告)日：2010-03-02
申请号：US11861757
申请日：2007-09-26
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L29/205 , H01L23/495
CPC分类号： H01L25/0753 , H01L24/97 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01082 , H01L2924/12041 , H01L2224/85 , H01L2924/00014
摘要： An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.
摘要翻译：具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并且与不同的导电针电连接。此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

5. 发明授权

US07655997B2 Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same 有权
标题翻译：晶圆级电光半导体制造机构及其制造方法
公开(公告)号：US07655997B2
公开(公告)日：2010-02-02
申请号：US11041952
申请日：2005-01-26
申请人： Bily Wang , Jonnie Chuang , Chuan-Fa Lin , Chi-Wen Hung
发明人： Bily Wang , Jonnie Chuang , Chuan-Fa Lin , Chi-Wen Hung
IPC分类号： H01L27/14
CPC分类号： H01L23/60 , H01L23/544 , H01L24/48 , H01L25/167 , H01L27/0248 , H01L2223/54493 , H01L2224/16145 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer, this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.
摘要翻译：一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。本发明将半导体晶粒与晶片的顶表面上的晶粒电连接，这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上进行。之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。使用这种方法提高了生产率，同时降低了生产时间和成本。晶圆级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

6. 发明申请

US20080246397A1 MANUFACTURING METHOD OF WHITE LIGHT LED AND STRUCTURE THEREOF 审中-公开
标题翻译：白光LED及其结构的制造方法
公开(公告)号：US20080246397A1
公开(公告)日：2008-10-09
申请号：US11696220
申请日：2007-04-04
申请人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
发明人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
IPC分类号： H01J99/00 , H01J9/26
CPC分类号： H01L33/505 , H01L33/486 , H01L33/507 , H01L33/52 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A manufacturing method of white light LED and a structure thereof include first, a substrate being prepared to be formed as a consecutively connected holder, on a first electrode of which non-conductive fluorescent glue is coated to form a fluorescent layer, on which a blue light chip is fixed; second, two conducting wires being welded onto the chip and electrically connected to both the first electrode and the second electrode of the holder respectively, finally, glue body encapsulating the holder, the fluorescent layer, the chip, and the two conducting wires to form a photic zone, over which a frame body encloses; furthermore, a window being formed on the frame body and provided for making the photic zone exposed. When blue light chip is excited to generate blue light, which will further excite the fluorescent layer to emit yellow light, then both blue light and yellow light will be dispersed through the photic zone to generate a uniform light source, which may output light longitudinally and collectively, making the output power promoted notably and the lightness enhanced significantly.
摘要翻译：白光LED的制造方法及其结构首先在准备形成为连续保持器的基板上，在其上涂布非导电荧光胶的第一电极上形成荧光层，蓝色光芯片固定; 第二，将两根导线焊接在芯片上，分别与保持器的第一电极和第二电极两者电连接，最后将胶体封装在保持器，荧光层，芯片和两根导线上，形成一个框架主体围绕着它; 此外，窗框形成在框架体上并被设置用于使光区暴露。当蓝光芯片被激发以产生蓝光，这将进一步激发荧光层发出黄光，则蓝光和黄光将通过光区分散以产生均匀的光源，其可以纵向输出光，共同推动输出功率显着提升，亮度明显增强。

7. 发明申请

US20080099778A1 LED package structure for increasing light-emitting effiency and method of packaging the same 有权
标题翻译： LED封装结构，提高发光效率和封装方法
公开(公告)号：US20080099778A1
公开(公告)日：2008-05-01
申请号：US11588399
申请日：2006-10-27
申请人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
发明人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
IPC分类号： H01L33/00 , G09F9/33
CPC分类号： H01L33/56 , H01L25/167 , H01L33/505 , H01L33/54 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An LED package structure for increasing light-emitting efficiency includes: a substrate unit, and a plurality of fluorescence colloid units, LED units, conductive units and opaque units. The substrate unit has a main body and a plurality of through holes passing through the main body. Each fluorescence colloid unit is received in the corresponding through hole and having an installed surface. Each LED unit has a light-emitting surface disposed on the corresponding fluorescence colloid unit and facing the installed surface of the corresponding fluorescence colloid units. Each conductive unit is electrically connected between each two electrode areas that have the same pole and are respectively arranged on each LED unit and the main body. Each opaque unit is disposed on two corresponding lateral faces of the main body for covering the installed surface of the corresponding fluorescence colloid unit, the corresponding LED unit, and the corresponding conductive units.
摘要翻译：用于提高发光效率的LED封装结构包括：基板单元和多个荧光胶体单元，LED单元，导电单元和不透明单元。基板单元具有主体和穿过主体的多个通孔。每个荧光胶体单元被接收在相应的通孔中并具有安装表面。每个LED单元具有设置在相应的荧光胶体单元上并面对相应的荧光胶体单元的安装表面的发光表面。每个导电单元电连接在具有相同极点并且分别布置在每个LED单元和主体上的每个两个电极区域之间。每个不透明单元设置在主体的两个对应的侧面上，用于覆盖相应的荧光胶体单元的安装表面，相应的LED单元和相应的导电单元。

8. 发明授权

US07303984B2 Semiconductor substrate structure and processing method thereof 有权
标题翻译：半导体衬底结构及其加工方法
公开(公告)号：US07303984B2
公开(公告)日：2007-12-04
申请号：US11081527
申请日：2005-03-17
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/4763
CPC分类号： H05K3/445 , H05K1/056 , H05K3/0052 , H05K2201/09881 , H05K2203/0228 , H05K2203/0278 , H05K2203/1536
摘要： A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: providing a substrate forming a trench thereon, supplying a polymer composite material into the trench, polishing a surface of the substrate and forming a covering material on the surface of the substrate. Therefore, the method is provided for combining the polymer composite material into the substrate, thereby to raise cutting precision and strength of the semiconductor substrate structure.
摘要翻译：半导体衬底结构包括其上形成有沟槽的衬底，提供到沟槽中的聚合物复合材料和形成在衬底上的电镀导电层。此外，半导体衬底处理方法包括以下步骤：提供在其上形成沟槽的衬底，将聚合物复合材料供应到沟槽中，抛光衬底的表面并在衬底的表面上形成覆盖材料。因此，提供了将聚合物复合材料组合到基板中的方法，从而提高半导体基板结构的切割精度和强度。

9. 发明申请

US20070152562A1 White light-emitting device 有权
标题翻译：白色发光装置
公开(公告)号：US20070152562A1
公开(公告)日：2007-07-05
申请号：US11711840
申请日：2007-02-28
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： C09K11/7731 , C09K11/7734 , H01J1/62 , H01L33/502 , H01L33/504 , H01L2224/48091 , Y02B20/181 , H01L2924/00014
摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.
摘要翻译：白光源具有放置在其上的蓝色发光二极管的基板和包围蓝色发光二极管的盖层。盖层包括硅和磷掺合物的混合物，其比例为1:0.2-0.5。荧光体掺合物包括红色荧光体，绿色荧光体和黄色荧光体。

10. 发明授权

US07211882B2 LED package structure and method for making the same 有权
标题翻译： LED封装结构及制作方法
公开(公告)号：US07211882B2
公开(公告)日：2007-05-01
申请号：US11085100
申请日：2005-03-22
申请人： Bily Wang , Jonnie Chuang , Heng-Yen Lee , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Heng-Yen Lee , Hui-Yen Huang
IPC分类号： H01L23/02
CPC分类号： H01L33/62 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.
摘要翻译：描述了LED封装结构及其制造方法。 LED封装结构具有至少一个LED管芯，至少一个与LED管芯相关的金属框架，以及封装LED管芯和金属框架的绝缘体。金属框架具有对应于LED管芯的第一接触件和相对于第一接触件的第二接触件。绝缘体内的第一和第二触点彼此电隔离。第一接触件具有围绕LED管芯的至少一个凹部，并且第二接触件具有形成在其上的至少一个凹槽。

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