专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08873920B2 Light-guiding cover structure 有权
标题翻译：导光罩结构
公开(公告)号：US08873920B2
公开(公告)日：2014-10-28
申请号：US13425829
申请日：2012-03-21
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Cheng-Chin Chiu
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Cheng-Chin Chiu
IPC分类号： G02B6/00
CPC分类号： G02B6/4298 , G01J2001/4252 , G01R31/2635 , G02B6/3616 , G02B6/3644
摘要： A light-guiding cover structure includes a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a plurality of light-guiding groups, wherein each light-guiding group includes a plurality of optical fiber cables received in the corresponding receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit. Therefore, the optical fiber cables received in the corresponding receiving space, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.
摘要翻译：导光罩结构包括顶盖单元和导光单元。顶盖单元具有形成在其中的多个接收空间。导光单元包括多个导光组，其中每个导光组包括容纳在相应接收空间中的多根光纤电缆，并且每根光纤电缆具有两个相对端从第并且分别面向至少一个发光装置和已经设置在顶盖单元下的至少一个光感测装置。因此，光纤电缆在相应的接收空间中被接收，因此当导光盖结构被应用于LED封装芯片分类系统时，可以提高LED封装芯片分类系统的方面。

2. 发明授权

US08686310B2 Packaged chip detection and classification device 有权
标题翻译：封装芯片检测和分类装置
公开(公告)号：US08686310B2
公开(公告)日：2014-04-01
申请号：US13170705
申请日：2011-06-28
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen
IPC分类号： B07C5/344
CPC分类号： B07C5/00 , B07C5/344 , G01R31/01 , G01R31/2893
摘要： A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.
摘要翻译：封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元，封装芯片检测单元和封装芯片分类单元。旋转单元包括旋转转盘，形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。每个接收部分用于选择性地接收至少一个封装的芯片。封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块，用于对封装芯片进行分类。因此，封装芯片检测和分类装置可以通过匹配旋转单元，封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。

3. 发明授权

US08421884B2 GPS device with a display function and method for using the same 有权
标题翻译：具有显示功能的GPS装置及其使用方法
公开(公告)号：US08421884B2
公开(公告)日：2013-04-16
申请号：US12554924
申请日：2009-09-07
申请人： Bily Wang , Yuan-Hsiu Yang
发明人： Bily Wang , Yuan-Hsiu Yang
IPC分类号： H04N5/225 , H04N5/76
CPC分类号： H04N5/772 , G01S19/13 , H04N9/8205
摘要： A GPS device with a display function includes a GPS recorder and a display screen. The GPS recorder has a GPS casing that encloses one part of the display screen and only a display area of the display screen is exposed. The display screen is electrically disposed on the GPS recorder, and the display screen displays pattern in order to show time information and the position information that have been captured by the GPS recorder. In addition, the GPS recorder has a memory disposed therein for storing the time information and the position information.
摘要翻译：具有显示功能的GPS装置包括GPS记录器和显示屏。 GPS记录器具有GPS壳体，其包围显示屏幕的一部分，并且仅显示屏幕的显示区域被暴露。显示屏电气地设置在GPS记录器上，并且显示屏幕显示图案以便显示由GPS记录器捕获的时间信息和位置信息。此外，GPS记录器具有设置在其中的存储时间信息和位置信息的存储器。

4. 发明申请

US20120106171A1 LED PACKAGE STRUCTURE 审中-公开
标题翻译： LED封装结构
公开(公告)号：US20120106171A1
公开(公告)日：2012-05-03
申请号：US13176799
申请日：2011-07-06
申请人： BILY WANG , SUNG-YI HSIAO , YU-JEN CHENG , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , YU-JEN CHENG , JACK CHEN
IPC分类号： F21V15/00
CPC分类号： H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： An LED package structure includes a conductive substrate unit, a first insulative unit, a second insulative unit, a light-emitting unit and a package unit. The conductive substrate unit includes at least two conductive bases and at least one gap is formed between the two conductive bases. The first insulative unit includes at least one first insulative layer filled in the gap to join the two conductive bases. The second insulative unit includes at least one second insulative layer disposed on the conductive substrate unit and a plurality of openings passing through the second insulative layer for exposing one part of the top surface of each conductive base. The light-emitting unit includes at least one light-emitting element passing one of the openings and electrically connected between the two conductive bases. The package unit includes a package resin body disposed on the second insulative unit to cover the light-emitting element.
摘要翻译： LED封装结构包括导电基板单元，第一绝缘单元，第二绝缘单元，发光单元和封装单元。导电基板单元包括至少两个导电基底，并且在两个导电基底之间形成至少一个间隙。第一绝缘单元包括填充在间隙中以连接两个导电基底的至少一个第一绝缘层。第二绝缘单元包括设置在导电基板单元上的至少一个第二绝缘层和穿过第二绝缘层的多个开口，用于暴露每个导电基底的顶表面的一部分。发光单元包括通过其中一个开口并电连接在两个导电基底之间的至少一个发光元件。封装单元包括设置在第二绝缘单元上以覆盖发光元件的封装树脂体。

5. 发明申请

US20120096710A1 CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY USING A TWO-SIDED CUT APPROACH AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有通过使用双面切割方法形成的导电通道的导电基板结构及其制造方法
公开(公告)号：US20120096710A1
公开(公告)日：2012-04-26
申请号：US13338410
申请日：2011-12-28
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H05K3/02
CPC分类号： B26D3/06 , H05K3/0044 , H05K3/0052 , H05K3/107 , H05K3/403 , Y10T29/49155 , Y10T29/49156 , Y10T83/0524
摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.
摘要翻译：导电基板结构包括基板单元，导电焊盘单元和导电层单元。基板单元具有顶表面，底表面，两个相对的侧表面和前表面。导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层到两个第二导电焊盘的两个相对的侧面。两个第一导电层分别与两个第二导电层电连接。

6. 发明授权

US08162514B2 Illumination device with a fire-fighting function 有权
标题翻译：具有消防功能的照明装置
公开(公告)号：US08162514B2
公开(公告)日：2012-04-24
申请号：US12243215
申请日：2008-10-01
申请人： Bily Wang
发明人： Bily Wang
IPC分类号： F21V5/00 , F21V9/12
CPC分类号： F21V33/0064 , A62C31/00 , A62C35/02 , F21S9/022 , F21V23/0442 , F21Y2115/10 , G02B6/0081
摘要： An illumination device with a fire-fighting function includes a transparent hollow casing, fire-fighting water, a light-emitting unit, and a light-guiding unit. The transparent hollow casing has a receiving space. The fire-fighting water is filled into the receiving space of the transparent hollow casing. The light-emitting unit has a plurality of light-emitting elements disposed beside one or more lateral sides of the transparent hollow casing. The light-guiding unit is disposed over the transparent hollow casing. Hence, when fire accident happens, the transparent hollow casing will melt and crack due to the developed over-heat, and the fire-fighting water is sprayed out from the receiving spaces in order to extinguish one part of flames. Therefore, the present invention can be used as a lighting device or can be used as a fire-fighting device when fire accident happens.
摘要翻译：具有消防功能的照明装置包括透明中空壳体，消防水，发光单元和导光单元。透明中空壳体具有容纳空间。消防水被填充到透明中空壳体的接收空间中。发光单元具有设置在透明中空壳体的一个或多个侧面旁边的多个发光元件。导光单元设置在透明中空壳体的上方。因此，当发生火灾事故时，透明中空套管由于发热过热而熔化和裂开，消防水从接收空间喷出以熄灭一部分火焰。因此，本发明可以用作照明装置，也可以在火灾事故发生时用作消防装置。

7. 发明授权

US08107720B2 Detection system for detecting appearances of many electronic elements and methods of using the same 有权
标题翻译：用于检测许多电子元件外观的检测系统及其使用方法
公开(公告)号：US08107720B2
公开(公告)日：2012-01-31
申请号：US12453636
申请日：2009-05-18
申请人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou , Ren-Chun Ni
发明人： Bily Wang , Kuei-Pao Chen , Hsin-Cheng Chen , Ming-Hao Chou , Ren-Chun Ni
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G06T2207/30164
摘要： A detection system for detecting appearances of many electronic elements includes a rotary module, a feeding module and a detection module. The rotary module has a base structure and a hollow transparent rotary structure disposed on the base structure. The feeding module is disposed beside one side of the hollow transparent rotary structure in order to sequentially guide the electronic elements to the top surface of the hollow transparent rotary structure. The detection module has a plurality of detection units sequentially disposed around the hollow transparent rotary structure. Each detection unit is composed of an image-sensing element for sensing the electronic elements, an image-capturing element for capturing surface images of the electronic elements and a classifying element for classifying the electronic elements.
摘要翻译：用于检测许多电子元件的外观的检测系统包括旋转模块，馈送模块和检测模块。旋转模块具有底座结构和设置在基座结构上的中空透明旋转结构。馈送模块设置在中空透明旋转结构的一侧旁边，以便顺序地将电子元件引导到中空透明旋转结构的顶表面。检测模块具有多个依次设置在中空透明旋转结构周围的检测单元。每个检测单元由用于感测电子元件的图像感测元件，用于捕获电子元件的表面图像的图像捕获元件和用于分类电子元件的分类元件组成。

8. 发明申请

US20120003765A1 LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKING THE SAME 有权
标题翻译： LED芯片包装结构及其制作方法
公开(公告)号：US20120003765A1
公开(公告)日：2012-01-05
申请号：US13232391
申请日：2011-09-14
申请人： BILY WANG , SHIH-YU WU , CHAO-YUAN HUANG , PING-CHOU YANG , CHENG-YEN CHIANG
发明人： BILY WANG , SHIH-YU WU , CHAO-YUAN HUANG , PING-CHOU YANG , CHENG-YEN CHIANG
IPC分类号： H01L33/52
CPC分类号： H01L33/52 , H01L33/508 , H01L2224/48091 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
摘要翻译：使用沉淀的LED芯片封装结构包括封装体，至少两个导电基板，至少一个发光元件和封装单元。包装体具有接收空间。两个导电基板被接收在接收空间中。发光元件被容纳在接收空间中并与两个导电基板电连接。包装单元具有包装胶体层和混合到包装胶体层中的粉末，并且包装单元填充到容纳空间中。首先将包装单元保持在室温下，将粉末均匀地沉积在接收空间中，并通过加热到预定温度使粉末在接收空间中固化。

9. 发明申请

US20120001203A1 LED CHIP PACKAGE STRUCTURE 审中-公开
标题翻译： LED芯片包装结构
公开(公告)号：US20120001203A1
公开(公告)日：2012-01-05
申请号：US13235585
申请日：2011-09-19
申请人： BILY WANG , JONNIE CHUANG , WEN-KUEI WU
发明人： BILY WANG , JONNIE CHUANG , WEN-KUEI WU
IPC分类号： H01L27/15 , H01L33/50
CPC分类号： G02B6/0073 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： A LED chip package structure includes a substrate unit, a light-emitting unit, and a package unit. The substrate unit includes a strip substrate body. The light-emitting unit includes a plurality of LED chips disposed on the strip substrate body and electrically connected to the strip substrate body. The package unit includes a strip package colloid body disposed on the strip substrate body to cover the LED chips, wherein the strip package colloid body has an exposed top surface and an exposed surrounding peripheral surface connected between the exposed top surface and the strip substrate body, and the strip package colloid body has at least one exposed lens portion projected upwardly from the exposed top surface thereof and corresponding to the LED chips. Hence, light beams generated by the LED chips pass through the strip package colloid body to form a strip light-emitting area on the strip package colloid body.
摘要翻译： LED芯片封装结构包括基板单元，发光单元和封装单元。基板单元包括带状基板主体。发光单元包括设置在带状基板主体上并电连接到带状基板主体的多个LED芯片。包装单元包括：带状包装胶体，其设置在带状基材主体上以覆盖LED芯片，其中带状包装胶体具有暴露的顶表面和连接在暴露的顶表面和带状基片主体之间的暴露的外围表面，并且带状包装胶体具有从其暴露的顶表面向上突出并对应于LED芯片的至少一个露出的透镜部分。因此，由LED芯片产生的光束通过条带封装胶体，在带状封装胶体上形成带状发光区域。

10. 发明授权

US08053885B2 Wafer level vertical diode package structure and method for making the same 有权
标题翻译：晶圆级垂直二极管封装结构及制作方法
公开(公告)号：US08053885B2
公开(公告)日：2011-11-08
申请号：US12318876
申请日：2009-01-12
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L23/485
CPC分类号： H01L29/0657 , H01L21/6836 , H01L23/31 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/96 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05 , H01L2224/12105 , H01L2224/13099 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01046 , H01L2924/0107 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00015 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of the first semiconductor layer. The insulative unit is disposed around a lateral side of the first semiconductor layer and a lateral side of the second semiconductor layer. The first conductive structure is formed on a top surface of the first semiconductor layer and on one lateral side of the insulative layer. The second conductive structure is formed on a top surface of the second semiconductor layer and on another opposite lateral side of the insulative layer.
摘要翻译：晶圆级垂直二极管封装结构包括第一半导体层，第二半导体层，绝缘单元，第一导电结构和第二导电结构。第二半导体层与第一半导体层的一个表面连接。绝缘单元围绕第一半导体层的侧面和第二半导体层的横向侧设置。第一导电结构形成在第一半导体层的顶表面和绝缘层的一个侧面上。第二导电结构形成在第二半导体层的顶表面上，在绝缘层的另一个相对的侧面上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式