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1. 发明授权

US07701124B2 White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blend 有权
标题翻译：具有由硅和荧光体共混物的混合物形成的盖层的白色发光器件
公开(公告)号：US07701124B2
公开(公告)日：2010-04-20
申请号：US11711840
申请日：2007-02-28
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Shan Yu
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Shan Yu
IPC分类号： H01J61/02 , H01J29/06
CPC分类号： C09K11/7731 , C09K11/7734 , H01J1/62 , H01L33/502 , H01L33/504 , H01L2224/48091 , Y02B20/181 , H01L2924/00014
摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.
摘要翻译：白光源具有放置在其上的蓝色发光二极管的基板和包围蓝色发光二极管的盖层。盖层包括硅和磷掺合物的混合物，其比例为1:0.2-0.5。荧光体掺合物包括红色荧光体，绿色荧光体和黄色荧光体。

2. 发明授权

US06919584B2 White light source 有权
标题翻译：白光源
公开(公告)号：US06919584B2
公开(公告)日：2005-07-19
申请号：US10677783
申请日：2003-10-03
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin
IPC分类号： H01L25/075 , H01L33/50 , H01L29/06
CPC分类号： H01L25/0753 , F21Y2113/17 , F21Y2115/10 , H01L33/504 , H01L2924/0002 , Y10S257/918 , H01L2924/00
摘要： A colorless light approaching that of white light in nature, is produced by using a blue color LEDs and a green color LED are covered with a red color phosphorescent glue and a yellow phosphorescent glue in separate layers or a mixed layer.
摘要翻译：通过使用蓝色LED产生白色光的无色光，绿色LED由分开的层或混合层中的红色磷光胶和黄色磷光胶覆盖。

3. 发明申请

US20060215387A1 Backlight module 有权
标题翻译：背光模组
公开(公告)号：US20060215387A1
公开(公告)日：2006-09-28
申请号：US11088791
申请日：2005-03-25
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin
IPC分类号： G01D11/28
CPC分类号： G02B6/0018 , G02B6/005 , G02B6/0083 , G02F1/133615
摘要： A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being parallel to the printed circuit board. The reflection portion includes an orientation wall parallel to the reflection wall and an outlet with a direction parallel to the printed circuit board. The guide light plate has an end connecting inside the outlet of the reflection portion, a light delivering surface adjacent to the flat display, and a reflection surface arranged at a bottom thereof.
摘要翻译：布置在平坦显示器下方的背光模块包括平行于平面显示器并包括多个LED的印刷电路板，反射部分是从LED的边缘弯曲以在LED上延伸的反射壁，以及引导光板平行于印刷电路板。反射部分包括平行于反射壁的定向壁和具有平行于印刷电路板的方向的出口。引导光板具有连接在反射部分的出口内部的端部，与平面显示器相邻的光输送表面和布置在其底部的反射表面。

4. 发明申请

US20050264173A1 White light emitting diode light source and method for manufacturing the same 审中-公开
标题翻译：白光发光二极管光源及其制造方法
公开(公告)号：US20050264173A1
公开(公告)日：2005-12-01
申请号：US10855419
申请日：2004-05-28
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin
IPC分类号： C09K11/77 , H01L33/50 , H05B33/00 , H05B33/14
CPC分类号： C09K11/7731 , C09K11/7721 , C09K11/7734 , H01L25/0753 , H01L33/502 , H01L2924/0002 , H05B33/14 , Y02B20/181 , H01L2924/00
摘要： A while light emitting diode light source and method for manufacturing the same are proposed. The while light emitting diode light source has a printed circuit board, and a plurality of LED units on one face of the PCB, each of the LED units comprising a substrate, a blue LED on the substrate and a red-green-yellow phosphor mixture enclosing the blue LED. The red-green-yellow phosphor mixture is a mixture of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor is CaS:Eu or SrS:Eu. The green phosphor is SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12. The yellow phosphor is YAG:Ce or ThAG:Ce. The light emitted from the phosphors are mixed with blue light into white light with a satisfactory color rendering property.
摘要翻译：提出一种发光二极管光源及其制造方法。同时发光二极管光源具有印刷电路板和PCB的一个面上的多个LED单元，每个LED单元包括基板，基板上的蓝色LED和红 - 绿 - 黄色荧光体混合物封闭蓝色LED。红绿色荧光体混合物是红色荧光体，绿色荧光体和黄色荧光体的混合物。红色荧光体为CaS：Eu或SrS：Eu。绿色荧光体是SrGa 2 S 4：Eu或Ca 8 O 5 MnMg（SiO 4）4 12 。黄色荧光体是YAG：Ce或ThAG：Ce。从荧光体发射的光与蓝色光混合，成为具有令人满意的显色性的白光。

5. 发明申请

US20060038485A1 Laminated light-emitting diode display device and manufacturing method thereof 审中-公开
公开(公告)号：US20060038485A1
公开(公告)日：2006-02-23
申请号：US10920306
申请日：2004-08-18
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
IPC分类号： H05B33/08 , H05B33/00
CPC分类号： G09F9/302 , G09F9/33 , H05K1/0306 , H05K1/0393 , H05K1/181 , H05K2201/0108 , H05K2201/10106 , Y02P70/611
摘要： A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.

6. 发明申请

US20050236958A1 White light-emitting device 审中-公开
标题翻译：白色发光装置
公开(公告)号：US20050236958A1
公开(公告)日：2005-10-27
申请号：US10830009
申请日：2004-04-23
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
IPC分类号： C09K11/77 , H01L33/50 , H05B33/00
CPC分类号： C09K11/7734 , C09K11/7731 , H01L33/502 , H01L33/504 , Y02B20/181
摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a phosphor mixture coated on the blue light-emitting diode and made of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor can be CaS:Eu or SrS:Eu; the green phosphor can be SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12; and the yellow phosphor can be YAG:Ce or ThAG:Ce. The red phosphor, the green phosphor and the yellow phosphor emit, respectively, red light, green light and yellow light after receiving blue light from the blue light-emitting diode to mix a white light with a good color-rendering property.
摘要翻译：白色光源具有放置在其上的蓝色发光二极管的基板和涂布在蓝色发光二极管上并由红色荧光体，绿色荧光体和黄色荧光体构成的荧光体混合物。红色荧光体可以是CaS：Eu或SrS：Eu; 绿色荧光体可以是SrGa 2 S 4：Eu或Ca 8 O 5 MnMg（SiO 4） 4 12 黄色荧光体可以是YAG：Ce或ThAG：Ce。在从蓝色发光二极管接收蓝光后，红色荧光体，绿色荧光体和黄色荧光体分别发出红色光，绿色光和黄色光，以混合具有良好显色性能的白色光。

7. 发明申请

US20070152562A1 White light-emitting device 有权
标题翻译：白色发光装置
公开(公告)号：US20070152562A1
公开(公告)日：2007-07-05
申请号：US11711840
申请日：2007-02-28
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： C09K11/7731 , C09K11/7734 , H01J1/62 , H01L33/502 , H01L33/504 , H01L2224/48091 , Y02B20/181 , H01L2924/00014
摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.
摘要翻译：白光源具有放置在其上的蓝色发光二极管的基板和包围蓝色发光二极管的盖层。盖层包括硅和磷掺合物的混合物，其比例为1:0.2-0.5。荧光体掺合物包括红色荧光体，绿色荧光体和黄色荧光体。

8. 发明申请

US20070072506A1 Laminated light-emitting diode display device and manufacturing method thereof 有权
标题翻译：层压发光二极管显示装置及其制造方法
公开(公告)号：US20070072506A1
公开(公告)日：2007-03-29
申请号：US11605425
申请日：2006-11-29
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
IPC分类号： H01J9/00 , H01J9/24
CPC分类号： G09F9/302 , G09F9/33 , H05K1/0306 , H05K1/0393 , H05K1/181 , H05K2201/0108 , H05K2201/10106 , Y02P70/611
摘要： A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
摘要翻译：对层叠型发光二极管显示装置及其制造方法进行说明。层叠发光二极管显示装置具有绝缘体，放置在绝缘体上并具有彼此互连的多个电路的电路装置，以及电连接到电路的电路的多个SMT型发光二极管单元。

9. 发明授权

US07049639B2 LED packaging structure 有权
标题翻译： LED封装结构
公开(公告)号：US07049639B2
公开(公告)日：2006-05-23
申请号：US10855417
申请日：2004-05-28
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Heng-Yen Lee
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Heng-Yen Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H05K3/3442 , H05K2201/10106 , H05K2201/10636 , H05K2201/10666 , Y02P70/611 , Y02P70/613 , H01L2924/00014
摘要： An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the holes to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.
摘要翻译： LED封装结构具有形成有两个孔的基板。两个导电元件中的一个延伸穿过两个孔，以电连接到衬底的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过孔连接到导电条和上，下表面上的第二电极焊盘。发光芯片电连接到导电焊盘和导电条。发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。

10. 发明申请

US20050274957A1 LED packaging structure 有权
标题翻译： LED封装结构
公开(公告)号：US20050274957A1
公开(公告)日：2005-12-15
申请号：US10855417
申请日：2004-05-28
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Heng-Yen Lee
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Heng-Yen Lee
IPC分类号： H01L27/15 , H01L33/48 , H01L33/62 , H05K3/34
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H05K3/3442 , H05K2201/10106 , H05K2201/10636 , H05K2201/10666 , Y02P70/611 , Y02P70/613 , H01L2924/00014
摘要： An LED packaging structure has a substrate having two drills formed thereon. One of two conductive elements extends through the two drills to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the drills to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.
摘要翻译： LED封装结构具有形成有两个钻头的基板。两个导电元件中的一个延伸穿过两个钻头，以电连接到基板的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过钻头以连接到导电条和上，下表面上的第二电极焊盘。发光芯片电连接到导电焊盘和导电条。发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。

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