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    • 2. 发明申请
    • Memory cell having a shared programming gate
    • 具有共享编程门的存储单元
    • US20080258200A1
    • 2008-10-23
    • US11785608
    • 2007-04-19
    • Shih Wei WangTe-Hsun HsuHung-Cheng Sung
    • Shih Wei WangTe-Hsun HsuHung-Cheng Sung
    • H01L29/788
    • H01L29/7883H01L27/115H01L29/42336
    • A semiconductor memory device includes a substrate, and a trench formed in the substrate. First and second floating gates, each associated with corresponding first and second memory cells, extend into the trench. Since the trench can be made relatively deep, the floating gates may be made relatively large while the lateral dimensions of the floating gates remains small. Moreover, the insulator thickness between the floating gate and a sidewall of the trench where a channel region is formed can be made relatively thick, even though the lateral extent of the memory cell is reduced. A programming gate extends into the trench between the first and second floating gates, and is shared, along with a source region, by the two memory cells.
    • 半导体存储器件包括衬底和形成在衬底中的沟槽。 每个与对应的第一和第二存储器单元相关联的第一和第二浮动栅极延伸到沟槽中。 由于可以使沟槽相对较深,所以可以使浮动栅极相对较大,同时浮动栅极的横向尺寸保持较小。 此外,尽管存储单元的横向范围减小,浮栅和形成沟道区的沟槽的侧壁之间的绝缘体厚度可以做得相对较厚。 编程门延伸到第一和第二浮栅之间的沟槽中,并且与源区域一起被两个存储单元共享。
    • 6. 发明申请
    • METHODS AND DEVICES FOR DETERMINING WRITING CURRENT FOR MEMORY CELLS
    • 用于确定记忆细胞的写入电流的方法和装置
    • US20060203537A1
    • 2006-09-14
    • US11078171
    • 2005-03-11
    • Hung-Cheng SungDer-Shin Shyu
    • Hung-Cheng SungDer-Shin Shyu
    • G11C11/00
    • G11C11/16
    • Methods for determining writing current for memory cells. A first reference current is applied to a first operative line to switch the memory cell to a first state. A second reference current is applied to a second operative line crossing the first operative line to switch the memory cell to a second state. A first writing current is obtained according to a first ratio and the first reference current. A second writing current is obtained according to a second ratio and the second reference current. The memory cell is programmed by applying the first writing current to the first operative line and applying the second writing current to the second operative line.
    • 确定存储单元写入电流的方法。 将第一参考电流施加到第一操作线以将存储器单元切换到第一状态。 第二参考电流被施加到穿过第一操作线的第二操作线,以将存储器单元切换到第二状态。 根据第一比率和第一参考电流获得第一写入电流。 根据第二比例和第二参考电流获得第二写入电流。 通过将第一写入电流施加到第一操作线并将第二写入电流施加到第二操作线来编程存储器单元。
    • 7. 发明申请
    • Uniform channel programmable erasable flash EEPROM
    • 统一通道可编程可擦除闪存EEPROM
    • US20060014345A1
    • 2006-01-19
    • US10890673
    • 2004-07-14
    • Te-Hsun HsuHung-Cheng Sung
    • Te-Hsun HsuHung-Cheng Sung
    • H01L21/336
    • H01L29/66833H01L21/28282H01L29/792
    • A new method to form a split gate for a flash device in the manufacture of an integrated circuit device is achieved. The method comprises providing a substrate. A film is deposited overlying the substrate. The film comprises a second dielectric layer overlying a first dielectric layer with an electronic-trapping layer therebetween. A masking layer is deposited overlying the film. The masking layer and the film are patterned to expose a part of the substrate and to form a floating gate electrode comprising the electronic-trapping layer. An oxide layer is grown overlying the exposed part of the substrate. The masking layer is removed. A conductive layer is deposited overlying the oxide layer and the second dielectric layer. The conductive layer and the oxide layer are patterned to complete a control gate electrode comprising the conductive layer. The control gate electrode has a first part overlying the floating gate electrode and a second part not overlying the floating gate electrode.
    • 实现了在制造集成电路器件中形成用于闪存器件的分离栅极的新方法。 该方法包括提供基底。 覆盖在衬底上的膜被沉积。 膜包括覆盖在第一电介质层之间的电子捕获层的第二电介质层。 掩模层沉积在膜上。 图案化掩模层和膜以暴露基板的一部分并形成包括电子捕获层的浮栅电极。 生长在衬底的暴露部分上的氧化物层。 去除掩模层。 沉积覆盖氧化物层和第二介电层的导电层。 图案化导电层和氧化物层以完成包括导电层的控制栅电极。 控制栅电极具有覆盖浮置栅电极的第一部分和不覆盖浮置栅电极的第二部分。
    • 8. 发明申请
    • High write and erase efficiency embedded flash cell
    • 高写入和擦除效率嵌入式闪存单元
    • US20050282337A1
    • 2005-12-22
    • US10870774
    • 2004-06-17
    • Der-Shin ShyuHung-Cheng SungChen-Ming Huang
    • Der-Shin ShyuHung-Cheng SungChen-Ming Huang
    • H01L21/336H01L21/4763H01L21/8247H01L27/115H01L29/423H01L29/788
    • H01L27/11521H01L27/115H01L29/42324H01L29/7885
    • An embedded flash cell structure comprising a structure, a first floating gate having an exposed side wall over the structure, a second floating gate having an exposed side wall over the structure and spaced apart from the first floating gate, a first pair of spacers over the respective first floating gate and the second floating gate, a second pair of spacers at least over the respective exposed side walls of the first and second floating gates, a source area in the structure between the second pair of spacers, a plug over the source implant, and first and second control gates outboard of the first pair of spacers and exposing outboard portions of the structure and respective drain areas in the exposed outboard portions of the structure is provided. A method of forming the embedded flash cell structure is also provided.
    • 一种嵌入式闪存单元结构,其包括结构,第一浮动栅极,其具有在所述结构上方的暴露侧壁,第二浮动栅极,具有在所述结构上并与所述第一浮动栅极间隔开的暴露的侧壁; 相应的第一浮动栅极和第二浮动栅极,至少在第一和第二浮动栅极的相应暴露的侧壁上方的第二对间隔物,在第二对间隔物之间​​的结构中的源极区域,源极植入物 并且设置在第一对间隔件外侧的第一和第二控制门,并且暴露在结构的暴露的外侧部分中的结构的外侧部分和相应的漏极区域。 还提供了一种形成嵌入式闪存单元结构的方法。