会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Enhanced scanner throughput system and method
    • 增强扫描仪吞吐量系统和方法
    • US08906599B2
    • 2014-12-09
    • US13473695
    • 2012-05-17
    • Yu-Mei LiuChin-Hsiang LinHeng-Hsin LiuHeng-Jen LeeI-Hsiung HuangChih-Wei Lin
    • Yu-Mei LiuChin-Hsiang LinHeng-Hsin LiuHeng-Jen LeeI-Hsiung HuangChih-Wei Lin
    • G03F7/20
    • G03F7/70358
    • A method and system to improve scanner throughput is provided. An image from a reticle is projected onto a substrate using a continuous linear scanning procedure in which an entire column of die or cells of die is scanned continuously, i.e. without stepping to a different location. Each scan includes translating a substrate with respect to a fixed beam. While the substrate is translated, the reticle is also translated. When a first die or cell of die is projected onto the substrate, the reticle translates along a direction opposite the scan direction and as the scan continues along the same direction, the reticle then translates in the opposite direction of the substrate thereby forming an inverted pattern on the next die or cell. The time associated with exposing the substrate is minimized as the stepping operation only occurs after a complete column of cells is scanned.
    • 提供了一种提高扫描仪吞吐量的方法和系统。 使用连续线性扫描程序将来自掩模版的图像投影到基板上,其中连续扫描整列管芯或裸片的单元,即不进入不同的位置。 每个扫描包括相对于固定光束平移衬底。 当底物被翻译时,掩模版也被翻译。 当模具的第一裸片或裸片投影到衬底上时,标线沿着与扫描方向相反的方向平移,并且随着扫描沿着相同的方向继续,标线片然后沿着衬底的相反方向平移,从而形成倒置图案 在下一个死亡或细胞。 与曝光底物相关的时间最小化,因为步进操作仅在扫描完整的单元格列之后才发生。
    • 8. 发明授权
    • System and method for cleaning a wafer chuck
    • 用于清洁晶片卡盘的系统和方法
    • US08955530B2
    • 2015-02-17
    • US13008707
    • 2011-01-18
    • Jui-Chun PengHeng-Jen Lee
    • Jui-Chun PengHeng-Jen Lee
    • B08B7/00H01L21/67
    • H01L21/67028
    • A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.
    • 使用清洁盖清洁晶片卡盘以除去加工残留物和颗粒物质。 清洁盖被配置成覆盖并与晶片卡盘对准,并且包括底座和连接到基座并在其周围缠绕清洁布的第一滚子。 清洁帽还包括连接到基座并且附接有清洁布的自由端的第二辊。 在使用期间,当第二辊围绕其轴旋转时,清洁布从第一辊滚动到第二辊上。 清洁盖可以通过操纵器相对于晶片卡盘定位,以确保清洁布以足够的力与晶片卡盘接触。 清洁布用平移运动和旋转运动擦拭晶片卡盘。