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1. 发明授权

US08338262B2 Dual wavelength exposure method and system for semiconductor device manufacturing 有权
标题翻译：双波长曝光方法和半导体器件制造系统
公开(公告)号：US08338262B2
公开(公告)日：2012-12-25
申请号：US12478426
申请日：2009-06-04
申请人： Heng-Jen Lee , Jui-Chun Peng , I-Hsiung Huang
发明人： Heng-Jen Lee , Jui-Chun Peng , I-Hsiung Huang
IPC分类号： H01L21/336
CPC分类号： G03F7/203 , G03F7/7045 , G03F7/70458 , G03F7/70466
摘要： A dual wavelength exposure system provides for patterning a resist layer formed on a wafer for forming semiconductor devices, using two exposure operations, one including a first radiation having a first wavelength and the other including a second radiation including a second wavelength. Different or the same lithography tool may be used to generate the first and second radiation. For each die formed on the semiconductor device, a critical portion of the pattern is exposed using a first exposure operation that uses a first radiation with a first wavelength and a non-critical portion of the pattern is exposed using a second exposure operation utilizing the second radiation at a second wavelength. The resist material is chosen to be sensitive to both the first radiation having a first wavelength and the second radiation having the second wavelength.
摘要翻译：双波长曝光系统提供了使用两个曝光操作来形成在晶片上形成的晶片上的抗蚀剂层，一个包括具有第一波长的第一辐射，另一个包括包括第二波长的第二辐射。可以使用不同或相同的光刻工具来产生第一和第二辐射。对于形成在半导体器件上的每个裸片，使用第一曝光操作曝光图案的关键部分，该第一曝光操作使用第一波长的第一辐射，并且使用第二曝光操作曝光图案的非关键部分第二波长的辐射。抗蚀剂材料被选择为对具有第一波长的第一辐射和具有第二波长的第二辐射都敏感。

2. 发明申请

US20100321660A1 METHOD AND APPARATUS FOR REDUCING DOWN TIME OF A LITHOGRAPHY SYSTEM 有权
标题翻译：降低刻蚀系统下降时间的方法和装置
公开(公告)号：US20100321660A1
公开(公告)日：2010-12-23
申请号：US12486565
申请日：2009-06-17
申请人： Jui-Chun Peng , Heng-Jen Lee , Tung-Li Wu , I-Hsiung Huang
发明人： Jui-Chun Peng , Heng-Jen Lee , Tung-Li Wu , I-Hsiung Huang
IPC分类号： G03B27/54
CPC分类号： G03B27/54 , G03F7/70033 , G03F7/70916 , H05G2/005 , H05G2/008
摘要： An apparatus includes a radiation source that emits a radiation beam that causes substantially all of a quantity of material to evaporate; and structure having first and second surface portions, a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion, and a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion. A different aspect involves emitting a radiation beam toward a quantity of material, the radiation beam causing substantially all of the quantity of material to evaporate; operating a structure having first and second surface portions in a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion; and thereafter operating the structure in a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion.
摘要翻译：一种装置包括辐射源，辐射源发射基本上所有的一定量物质蒸发的辐射束; 以及具有第一和第二表面部分的结构，第一操作模式，其中更大量的蒸发副产物撞击在第一表面部分上，以及第二操作模式，其中较大量的副产物撞击在第二表面部分上。不同的方面涉及朝向一定数量的材料发射辐射束，所述辐射束导致基本上所有量的材料蒸发; 在第一操作模式中操作具有第一和第二表面部分的结构，其中更大量的蒸发副产物撞击在第一表面部分上; 然后以第二操作模式操作该结构，其中较大量的副产物撞击在第二表面部分上。

3. 发明授权

US09632426B2 In-situ immersion hood cleaning 有权
公开(公告)号：US09632426B2
公开(公告)日：2017-04-25
申请号：US13008605
申请日：2011-01-18
申请人： Jui-Chun Peng , Heng-Jen Lee
发明人： Jui-Chun Peng , Heng-Jen Lee
IPC分类号： B08B3/00 , G03F7/20 , H01L21/67
CPC分类号： G03F7/70341 , G03F7/70925 , H01L21/67057
摘要： An apparatus includes a wafer stage configured to secure a wafer; and a cleaning module including a tank adjacent to the wafer stage, and is positioned outside the region occupied by the wafer. The cleaning module is configured to receive de-ionized (DI) water into the tank and extract the DI water out of the tank. The tank is configured to hold DI water with a top surface of the DI water substantially level with a top surface of the wafer.

4. 发明授权

US08955530B2 System and method for cleaning a wafer chuck 有权
标题翻译：用于清洁晶片卡盘的系统和方法
公开(公告)号：US08955530B2
公开(公告)日：2015-02-17
申请号：US13008707
申请日：2011-01-18
申请人： Jui-Chun Peng , Heng-Jen Lee
发明人： Jui-Chun Peng , Heng-Jen Lee
IPC分类号： B08B7/00 , H01L21/67
CPC分类号： H01L21/67028
摘要： A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.
摘要翻译：使用清洁盖清洁晶片卡盘以除去加工残留物和颗粒物质。清洁盖被配置成覆盖并与晶片卡盘对准，并且包括底座和连接到基座并在其周围缠绕清洁布的第一滚子。清洁帽还包括连接到基座并且附接有清洁布的自由端的第二辊。在使用期间，当第二辊围绕其轴旋转时，清洁布从第一辊滚动到第二辊上。清洁盖可以通过操纵器相对于晶片卡盘定位，以确保清洁布以足够的力与晶片卡盘接触。清洁布用平移运动和旋转运动擦拭晶片卡盘。

5. 发明授权

US08237132B2 Method and apparatus for reducing down time of a lithography system 有权
标题翻译：降低光刻系统时间的方法和装置
公开(公告)号：US08237132B2
公开(公告)日：2012-08-07
申请号：US12486565
申请日：2009-06-17
申请人： Jui-Chun Peng , Heng-Jen Lee , Tung-Li Wu , I-Hsiung Huang
发明人： Jui-Chun Peng , Heng-Jen Lee , Tung-Li Wu , I-Hsiung Huang
IPC分类号： G21K5/00
CPC分类号： G03B27/54 , G03F7/70033 , G03F7/70916 , H05G2/005 , H05G2/008
摘要： An apparatus includes a radiation source that emits a radiation beam that causes substantially all of a quantity of material to evaporate; and structure having first and second surface portions, a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion, and a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion. A different aspect involves emitting a radiation beam toward a quantity of material, the radiation beam causing substantially all of the quantity of material to evaporate; operating a structure having first and second surface portions in a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion; and thereafter operating the structure in a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion.
摘要翻译：一种装置包括辐射源，辐射源发射基本上所有的一定量物质蒸发的辐射束; 以及具有第一和第二表面部分的结构，第一操作模式，其中更大量的蒸发副产物撞击在第一表面部分上，以及第二操作模式，其中较大量的副产物撞击在第二表面部分上。不同的方面涉及朝向一定数量的材料发射辐射束，所述辐射束导致基本上所有量的材料蒸发; 在第一操作模式中操作具有第一和第二表面部分的结构，其中更大量的蒸发副产物撞击在第一表面部分上; 然后以第二操作模式操作该结构，其中较大量的副产物撞击在第二表面部分上。

6. 发明申请

US20120180823A1 In-Situ Immersion Hood Cleaning 有权
标题翻译：原位浸入式清洁罩
公开(公告)号：US20120180823A1
公开(公告)日：2012-07-19
申请号：US13008605
申请日：2011-01-18
申请人： Jui-Chun Peng , Heng-Jen Lee
发明人： Jui-Chun Peng , Heng-Jen Lee
IPC分类号： B08B3/00
CPC分类号： G03F7/70341 , G03F7/70925 , H01L21/67057
摘要： An apparatus includes a wafer stage configured to secure a wafer; and a cleaning module including a tank adjacent to the wafer stage, and is positioned outside the region occupied by the wafer. The cleaning module is configured to receive de-ionized (DI) water into the tank and extract the DI water out of the tank. The tank is configured to hold DI water with a top surface of the DI water substantially level with a top surface of the wafer.
摘要翻译：一种装置包括晶片台，其被配置为固定晶片; 以及清洁模块，其包括与晶片台相邻的罐，并且位于晶片占据的区域的外部。清洁模块被配置为将去离子（DI）水接收到罐中并将DI水从罐中提取出来。该罐配置成保持去离子水，其中DI水的顶表面与晶片的顶表面基本一致。

7. 发明申请

US20120180813A1 System and Method for Cleaning a Wafer Chuck 有权
标题翻译：清洁晶片卡盘的系统和方法
公开(公告)号：US20120180813A1
公开(公告)日：2012-07-19
申请号：US13008707
申请日：2011-01-18
申请人： Jui-Chun Peng , Heng-Jen Lee
发明人： Jui-Chun Peng , Heng-Jen Lee
IPC分类号： B08B7/00 , A47L9/04 , A47L13/10
CPC分类号： H01L21/67028
摘要： A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.
摘要翻译：使用清洁盖清洁晶片卡盘以除去加工残留物和颗粒物质。清洁盖被配置成覆盖并与晶片卡盘对准，并且包括底座和连接到基座并在其周围缠绕清洁布的第一滚子。清洁帽还包括连接到基座并且附接有清洁布的自由端的第二辊。在使用期间，当第二辊围绕其轴旋转时，清洁布从第一辊滚动到第二辊上。清洁盖可以通过操纵器相对于晶片卡盘定位，以确保清洁布以足够的力与晶片卡盘接触。清洁布用平移运动和旋转运动擦拭晶片卡盘。

8. 发明申请

US20130156947A1 Track Spin Wafer Chuck 有权
标题翻译：轨道旋转晶片卡盘
公开(公告)号：US20130156947A1
公开(公告)日：2013-06-20
申请号：US13328254
申请日：2011-12-16
申请人： Wei-Hsiang Tseng , Jui-Chun Peng , Kai-Fa Ho , Ho-Ping Chen , Chia-Yun Lee
发明人： Wei-Hsiang Tseng , Jui-Chun Peng , Kai-Fa Ho , Ho-Ping Chen , Chia-Yun Lee
IPC分类号： H01L21/683 , B05D3/12
CPC分类号： H01L21/6838
摘要： The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas.
摘要翻译：本公开涉及一种配置成在工件上提供均匀光致抗蚀剂层的晶片卡盘。在一些实施例中，晶片卡盘包括多个真空孔。多个真空孔（即多于一个）与沿着真空孔之间的顶表面连续延伸的空腔流体连通。连接到每个真空孔的真空源构造成从位于工件下方的空腔去除气体分子，留下低压真空。使用多个真空孔增加真空的均匀性，从而防止在任何特定的真空孔附近形成高真空区域。高真空区域的减少减少了与高真空区域相关联的晶片弯曲。

9. 发明申请

US20100219175A1 ROTATABLE PLATE AND HEATING/COOLING ELEMENT IN PROXIMITY THERETO 有权
标题翻译：可旋转板和加热/冷却元件
公开(公告)号：US20100219175A1
公开(公告)日：2010-09-02
申请号：US12686276
申请日：2010-01-12
申请人： Jui-Chun Peng , Jacky Chung , Heng-Hsin Liu , Chun-Hung Lin
发明人： Jui-Chun Peng , Jacky Chung , Heng-Hsin Liu , Chun-Hung Lin
IPC分类号： H05B3/68
CPC分类号： H05B3/143 , H01L21/67098 , H01L21/67103 , H01L21/67115 , H01L21/67132 , H01L21/67259 , H01L21/681 , H05B1/0233 , H05B3/148 , H05B3/68
摘要： An apparatus for selectively heating/cooling one or more substrates and establishing an approximately uniform temperature in the one or more substrates during a heating or cooling event is described. In one embodiment, the apparatus comprises a rotatable hot/cold plate onto which the one or more substrates are placed and a heating/cooling element disposed in close proximity to the rotatable hot/cold plate for selectively elevating/lowering the temperature of the one or more substrates.
摘要翻译：描述了一种用于在加热或冷却事件期间选择性地加热/冷却一个或多个基底并且在一个或多个基底中建立大致均匀的温度的装置。在一个实施例中，该设备包括一个可旋转的热/冷板，一个或多个基板被放置在该可旋转的热/冷板上，以及靠近可旋转的热/冷板设置的加热/冷却元件，用于选择性地升高/降低一个或多个更多的底物。

10. 发明授权

US09081297B2 Lithography apparatus having dual reticle edge masking assemblies and method of use 有权
标题翻译：具有双重掩模版边缘掩蔽组件的光刻设备及其使用方法
公开(公告)号：US09081297B2
公开(公告)日：2015-07-14
申请号：US13461500
申请日：2012-05-01
申请人： Tung-Li Wu , Chin-Hsiang Lin , Heng-Hsin Liu , Jui-Chun Peng
发明人： Tung-Li Wu , Chin-Hsiang Lin , Heng-Hsin Liu , Jui-Chun Peng
IPC分类号： G03B27/54 , G03B27/42 , G03F7/20
CPC分类号： G03F7/70725 , G03F7/70066 , G03F7/70283 , G03F7/70341 , G03F7/70641
摘要： A lithography apparatus includes at least two reticle edge masking assemblies (REMAs). The lithography apparatus further includes a light source configured to emit a light beam having a wavelength and a beam separating element configured to divide the light beam into more than one collimated light beam. Each REMA is positioned to receive one of the more than one collimating light beams and each REMA comprises a movable slit for passing the one collimated light beam therethrough. The lithography apparatus further includes at least one mask having a pattern, where the at least one mask is configured to receive light from at least one of the REMA and a projection lens configured to receive light from the at least one mask. A method of using a lithography apparatus is also discussed.
摘要翻译：光刻设备包括至少两个掩模版边缘掩蔽组件（REMA）。光刻设备还包括被配置为发射具有波长的光束的光源和被配置为将光束分成多于一个准直光束的光束分离元件。每个REMA被定位成接收多于一个准直光束中的一个，并且每个REMA包括用于使一个准直光束通过的可移动狭缝。光刻设备还包括具有图案的至少一个掩模，其中所述至少一个掩模被配置为接收来自REMA和配置为接收来自所述至少一个掩模的光的投影透镜中的至少一个的光。还讨论了使用光刻设备的方法。

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