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1. 发明授权

US5528083A Thin film chip capacitor for electrical noise reduction in integrated circuits 失效
标题翻译：用于集成电路中电噪声降低的薄膜片式电容器
公开(公告)号：US5528083A
公开(公告)日：1996-06-18
申请号：US317900
申请日：1994-10-04
申请人： Deviprasad Malladi , Eric L. Bogatin , Bahram Zand
发明人： Deviprasad Malladi , Eric L. Bogatin , Bahram Zand
IPC分类号： H01G4/33 , H01L21/60 , H01L21/822 , H01L23/495 , H01L23/50 , H01L23/64 , H01L27/04 , H01L23/12 , H01L23/14 , H01L23/522
CPC分类号： H01L24/06 , H01L23/49589 , H01L23/50 , H01L23/642 , H01L24/49 , H01L2223/6611 , H01L2224/04042 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/48253 , H01L2224/48472 , H01L2224/48624 , H01L2224/49175 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , Y10S257/924
摘要： An integrated circuit chip and flat capacitor assembly are connected with short bonding wires to reduce electrical noise. A flat chip capacitor is coupled to the chip and includes a first electrode, a second electrode and a dielectric layer disposed between the electrodes. The ground and power bonding pads of an integrated circuit chip are coupled to a number of terminals arranged in a row near the outer edge of the capacitor, where each of the terminals is coupled to one of the electrodes. The terminals of the capacitor are connected to a number of package leads of a lead frame or a other integrated circuit package. The invention includes embodiments in which the chip is placed on top of the capacitor, the capacitor is placed on top of the chip, and a flex circuit of a micro ball grid array is placed on a capacitor which is positioned on a chip.
摘要翻译：集成电路芯片和扁平电容器组件与短接合线连接以减少电气噪声。扁平电容器耦合到芯片，并且包括设置在电极之间的第一电极，第二电极和介电层。集成电路芯片的接地和电源接合焊盘被耦合到靠近电容器的外边缘排列成行的多个端子，其中每个端子耦合到电极中的一个。电容器的端子连接到引线框架或其他集成电路封装的多个封装引线。本发明包括其中将芯片放置在电容器顶部上的实施例，电容器放置在芯片的顶部，微球栅阵列的柔性电路放置在位于芯片上的电容器上。

2. 发明授权

US4816811A Compliant overlay for use as an optically-based touch-sensitive screen 失效
标题翻译：兼容的叠加层，用作基于光学的触摸屏
公开(公告)号：US4816811A
公开(公告)日：1989-03-28
申请号：US715280
申请日：1985-03-15
申请人： Eric L. Bogatin , Xina S. Quan , Thomas A. Schwartz , Wesley P. Townsend
发明人： Eric L. Bogatin , Xina S. Quan , Thomas A. Schwartz , Wesley P. Townsend
IPC分类号： G06F3/041 , G06F3/033 , G06F3/042 , G09G1/00
CPC分类号： G06F3/042 , G06F3/0421
摘要： A resilient and deformable touch screen that is adapted to be overlaid on the surface of a CRT screen is formed from a semi-rigid plastic frame attached to a flexible plastic pouch filled with a soft resilient material which adheres to the surface of the pouch.
摘要翻译：适于覆盖在CRT屏幕的表面上的弹性和可变形的触摸屏由连接到柔性塑料袋的半刚性塑料框架形成，该柔性塑料袋填充有柔软的弹性材料，该弹性材料粘附到袋的表面。

3. 发明申请

US20080068034A1 Probe array wafer 有权
标题翻译：探头阵列晶圆
公开(公告)号：US20080068034A1
公开(公告)日：2008-03-20
申请号：US11511061
申请日：2006-08-25
申请人： Eric L. Bogatin , David W. Henry , Donald A. Marx
发明人： Eric L. Bogatin , David W. Henry , Donald A. Marx
IPC分类号： G01R31/02
CPC分类号： G01R1/07328 , G01R1/07364
摘要： A probe array wafer includes a substrate upon which a plurality of compliant probes are mounted. Pairs of axially aligned probes may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes may be electrically connected together to provide a ground connection from the test equipment to the device under test.
摘要翻译：探针阵列晶片包括其上安装有多个柔性探针的基底。一对轴向对准的探针可以电连接在一起，以提供通过从测试设备到被测设备的电力连接。类似地，成对的轴向对准的探针可以电连接在一起，以提供从测试设备到被测设备的接地连接。

4. 发明授权

US07498826B2 Probe array wafer 有权
标题翻译：探针阵列晶圆
公开(公告)号：US07498826B2
公开(公告)日：2009-03-03
申请号：US11511061
申请日：2006-08-25
申请人： Eric L. Bogatin , David W. Henry , Donald A. Marx
发明人： Eric L. Bogatin , David W. Henry , Donald A. Marx
IPC分类号： G01R31/02
CPC分类号： G01R1/07328 , G01R1/07364
摘要： A probe array wafer includes a substrate upon which a plurality of compliant probes are mounted. Pairs of axially aligned probes may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes may be electrically connected together to provide a ground connection from the test equipment to the device under test.
摘要翻译：探针阵列晶片包括其上安装有多个柔性探针的基底。一对轴向对准的探针可以电连接在一起，以提供通过从测试设备到被测设备的电力连接。类似地，成对的轴向对准的探针可以电连接在一起，以提供从测试设备到被测设备的接地连接。

5. 发明授权

US07049670B2 Electro ceramic components 有权
公开(公告)号：US07049670B2
公开(公告)日：2006-05-23
申请号：US09919038
申请日：2001-07-30
申请人： Bryan P. Staker , Douglas L. Teeter , Eric L. Bogatin
发明人： Bryan P. Staker , Douglas L. Teeter , Eric L. Bogatin
IPC分类号： H01L27/14
CPC分类号： B81B7/0006 , G02B6/3518 , G02B6/357 , G02B6/3582 , G02B6/3584 , G02B2006/12104
摘要： An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

6. 发明授权

US06764881B2 Method for manufacturing electro ceramic components 有权
标题翻译：电陶瓷部件的制造方法
公开(公告)号：US06764881B2
公开(公告)日：2004-07-20
申请号：US10193972
申请日：2002-07-12
申请人： Bryan P. Staker , Douglas L. Teeter, Jr. , Eric L. Bogatin
发明人： Bryan P. Staker , Douglas L. Teeter, Jr. , Eric L. Bogatin
IPC分类号： H01L2144
CPC分类号： B81B7/0006 , G02B6/3518 , G02B6/357 , G02B6/3582 , G02B6/3584 , G02B2006/12104
摘要： An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.
摘要翻译：阵列装置具有微机械加工SOI结构，例如MEMS阵列，其直接安装在一类绝缘基底上，例如低温共烧陶瓷或热膨胀系数匹配玻璃，其中嵌入静电电极与各个MEMS元件对准，其中静电电极被配置为实质上扇出。在一个具体实施例中，为了补偿SOI和陶瓷之间的热膨胀特性的差异，通过柱，桥和/或机械元件实现柔性安装，其允许x和y中的不均匀膨胀，同时保持z轴稳定性。根据本发明的方法包括制造步骤，其中电极被制造成后烧制陶瓷衬底，并且经由陶瓷衬底的迹线耦合到驱动器模块。

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