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1. 发明授权

US09425112B2 Calibration kits for RF passive devices 有权
标题翻译： RF无源器件校准套件
公开(公告)号：US09425112B2
公开(公告)日：2016-08-23
申请号：US13491364
申请日：2012-06-07
申请人： Jie Chen , Hao-Yi Tsai , Hsien-Wei Chen , Hung-Yi Kuo
发明人： Jie Chen , Hao-Yi Tsai , Hsien-Wei Chen , Hung-Yi Kuo
IPC分类号： G06F17/00 , G06F17/50 , H01L23/48 , H01L21/66 , H01L21/768 , H01L23/522 , H01L49/02
CPC分类号： H01L23/66 , G01R1/07328 , G01R35/005 , G06F17/5009 , H01L21/76822 , H01L22/34 , H01L23/522 , H01L23/5226 , H01L23/5227 , H01L23/528 , H01L24/13 , H01L28/10 , H01L2223/6627 , H01L2224/0401 , H01L2224/131 , H01L2224/13147 , H01L2924/19011 , H01L2924/1903 , H01L2924/19042 , H01L2924/00014 , H01L2924/014
摘要： A method includes measuring a first calibration kit in a wafer to obtain a first performance data. The wafer includes a substrate, and a plurality of dielectric layers over the substrate. The first calibration kit includes a first passive device over the plurality of dielectric layers, wherein substantially no metal feature is disposed in the plurality of dielectric layers and overlapped by the first passive device. The method further includes measuring a second calibration kit in the wafer to obtain a second performance data. The second calibration kit includes a second passive device identical to the first device and over the plurality of dielectric layers, and dummy patterns in the plurality of dielectric layers and overlapped by the second passive device. The first performance data and the second performance data are de-embedded to determine an effect of metal patterns in the plurality of dielectric layers to overlying passive devices.
摘要翻译：一种方法包括测量晶片中的第一校准套件以获得第一性能数据。晶片包括衬底，以及在衬底上的多个电介质层。第一校准套件包括多个电介质层上的第一无源器件，其中在多个电介质层中基本上没有金属特征被布置在第一无源器件中。该方法还包括测量晶片中的第二校准套件以获得第二性能数据。第二校准套件包括与第一器件相同并且在多个电介质层上相同的第二无源器件，以及多个电介质层中的虚设图案并且被第二无源器件重叠。第一性能数据和第二性能数据被去嵌入以确定多个介电层中的金属图案对覆盖无源器件的影响。

2. 发明授权

US09013199B2 Contact-connection unit for a test apparatus for testing printed circuit boards 有权
标题翻译：用于测试印刷电路板的测试设备的接触连接单元
公开(公告)号：US09013199B2
公开(公告)日：2015-04-21
申请号：US13262625
申请日：2010-04-01
申请人： Rüdiger Dehmel , Andreas Gülzow
发明人： Rüdiger Dehmel , Andreas Gülzow
IPC分类号： G01R31/20 , G01R1/073
CPC分类号： G01R1/07328 , G01R1/07378
摘要： The invention relates to a contacting unit for a test apparatus for testing printed circuit boards. The contacting unit comprises a full grid cassette and an adapter. The full grid cassette is provided with a plurality of spring contact pins arranged in the grid of contact points of a basic grid of a test apparatus. The adapter is provided with test needles for electrically connecting each of the spring contact pins of the full grid cassette to a circuit board test point of a printed circuit board to be tested, the spring contact pins being secured in the full grid cassette against falling out on the side remote from the adapter and the test needles being secured in the adapter on the side remote from the full grid cassette. The adapter and the full grid cassette are releasably joined to each other. In this way, both the spring contact pins and the test needles are secured against falling out of the contacting unit in the assembled state of the adapter and the full grid cassette.
摘要翻译：本发明涉及用于测试印刷电路板的测试装置的接触单元。接触单元包括全格栅盒和适配器。全格栅盒设置有布置在测试装置的基本格栅的接触点的格栅中的多个弹簧接触销。适配器设有用于将全格栅盒的每个弹簧接触针电连接到要测试的印刷电路板的电路板测试点的测试针，弹簧触针固定在全格栅盒中以防掉落在远离适配器的一侧，测试针固定在远离全格栅盒的一侧的适配器中。适配器和全格栅盒可释放地彼此连接。以这种方式，在适配器和全格栅盒的装配状态下，弹簧接触销和测试针都被固定而不被接触单元掉出。

3. 发明申请

US20140253159A1 HIGH ACCURACY ELECTRICAL TEST INTERCONNECTION DEVICE AND METHOD FOR ELECTRICAL CIRCUIT BOARD TESTING 审中-公开
标题翻译：高精度电气测试互连装置及电路板测试方法
公开(公告)号：US20140253159A1
公开(公告)日：2014-09-11
申请号：US14201304
申请日：2014-03-07
申请人： Donald DeMille
发明人： Donald DeMille
IPC分类号： G01R1/067
CPC分类号： G01R1/07328 , G01R31/2808
摘要： A high accuracy electrical test interconnect method employs a tester interface transfer block to enable the transfer of electrical contact from less accurate tester resource probes to target probes which are contained in the tester interface transfer block and can be positioned with high accuracy using the three dimensional printing to enable reliable contact with smaller test pads. The target probes can directly contact the tester resource probes or a transfer plate can be interposed between the target probes and the tester resource probes to allow positional adjustment of the target probes relative to the tester resource probes. This invention also includes the use of specialized shape target probes that can contact circuit board objects, such as vertical conductive surfaces and irregular shape test pads that have not been accessible with traditional methods.
摘要翻译：高精度电气测试互连方法采用测试仪接口传输块，以便能够将电气接触从不太准确的测试者资源探测器转移到测试仪接口传输块中包含的目标探头，并可使用三维打印以便与较小的测试垫进行可靠的接触。目标探针可以直接接触测试者资源探测器，或者可以在目标探针和测试者资源探测器之间插入转移板，以允许目标探针相对于测试者资源探针进行位置调整。本发明还包括使用可以接触电路板物体的特殊形状靶探针，例如垂直导电表面和不能用传统方法接近的不规则形状测试垫。

4. 发明授权

US08648616B2 Loaded printed circuit board test fixture and method for manufacturing the same 有权
标题翻译：负载印刷电路板测试夹具及其制造方法
公开(公告)号：US08648616B2
公开(公告)日：2014-02-11
申请号：US12963322
申请日：2010-12-08
申请人： Gary F. St. Onge , Scott F. Gold , Matthew T. Miczek
发明人： Gary F. St. Onge , Scott F. Gold , Matthew T. Miczek
IPC分类号： G01R1/067
CPC分类号： G01R1/07328 , G01R1/07378 , G01R31/31905
摘要： A test fixture for testing loaded printed circuit boards having a plurality of test points having a probe plate including an array of widely spaced high force spring test probes in compliant contact with solid translator pins located in a translator fixture removably positioned over the probe plate. The test fixture includes optimization software wherein translation of the test signals are optimized by providing the shortest interconnect distance in the x-y plane between the test points on the printed circuit board and the test probes in the probe plate. The fixture further includes an unpowered opens device for testing components on the loaded printed circuit board.
摘要翻译：一种用于测试装载的印刷电路板的测试夹具，其具有多个测试点，所述测试点具有探针板，所述探针板包括广泛间隔开的大力弹簧测试探针的阵列，所述多个测试点与位于所述探针板上的可移动地定位的转换器固定器中的固体平移器销接触。测试夹具包括优化软件，其中通过在印刷电路板上的测试点和探针板中的测试点之间的x-y平面中提供最短的互连距离来优化测试信号的平移。夹具还包括用于测试装载的印刷电路板上的部件的无动力打开装置。

5. 发明申请

US20130009658A1 INSPECTION JIG AND CONTACT 审中-公开
标题翻译：检查和联系
公开(公告)号：US20130009658A1
公开(公告)日：2013-01-10
申请号：US13635243
申请日：2011-08-24
申请人： Hideo Nishikawa
发明人： Hideo Nishikawa
IPC分类号： G01R1/067
CPC分类号： G01R1/06722 , G01R1/06738 , G01R1/07328 , G01R31/2808
摘要： In an inspection jig (1) for electrical inspection of printed circuit boards, an electrode section (40) has an electrode (41) disposed on a surface of an electrode plate (42), and a contact (10) includes a conductive contact needle (11), a compression coil spring (12), and an intermediate member (13) that are arranged coaxially for use. The contact needle (11) has a distal end (111), a projection (112), a larger diameter portion (113), and an intermediate portion (114), and the intermediate member (13) has a cylindrical intermediate end (131), a guide portion (132), and an electrode end (133). The electrode end (133) has a cut section at an oblique angle, is bent to have a proximal end (133a) in the vicinity of a central portion, and is held by a contact holder (30) to have an initial load. The electrode (41) is smaller in diameter than the contact (10). Thus obtained are an inspection jig and a contact allowing for facilitated fabrication and maintenance, with internal inductance improved and reliable conductive contact achieved by use of simple components.
摘要翻译：在用于印刷电路板的电气检查的检查夹具（1）中，电极部分（40）具有设置在电极板（42）的表面上的电极（41），并且触点（10）包括导电接触针（11），压缩螺旋弹簧（12）和中间构件（13），其同轴布置使用。接触针（11）具有远端（111），突起（112），较大直径部分（113）和中间部分（114），中间部件（13）具有圆柱形中间端），引导部（132）和电极端（133）。电极端部133具有倾斜角度的切断部，弯曲为在中央部附近具有基端133a，并由触点保持架30保持起始负荷。电极（41）的直径小于触点（10）的直径。这样获得的是检查夹具和允许便于制造和维护的触点，内部电感改善并且通过使用简单部件实现可靠的导电接触。

6. 发明申请

US20090251161A1 Module for Test Device for Testing Circuit Boards 失效
标题翻译：用于测试电路板的测试设备模块
公开(公告)号：US20090251161A1
公开(公告)日：2009-10-08
申请号：US12484510
申请日：2009-06-15
申请人： Andreas Guelzow , Viktor Romanov , Volker Goldschmitt , Werner Muller , Rudiger Dehmel , Uwe Rothaug
发明人： Andreas Guelzow , Viktor Romanov , Volker Goldschmitt , Werner Muller , Rudiger Dehmel , Uwe Rothaug
IPC分类号： G01R31/02
CPC分类号： G01R31/2808 , G01R1/07328
摘要： A module for a tester for the testing of circuit boards is described. Such testers have a basic grid on which an adapter and/or a translator may be arranged in order to connect contact points of the basic grid with circuit board test points of a circuit board to be tested. The module comprises a support plate and a contact board. The contact board is formed by a rigid circuit board section which is described as the basic grid element, and at least one flexible circuit board section. Provided on the basic grid element are contact points which each form part of the contact points of the basic grid. The basic grid element is mounted at an end face of the support plate, and the flexible circuit board section is bent in such a way that at least part of the other section of the contact board is parallel to the support plate. Each of the contact points of the basic grid element is in electrical contact with conductor paths running in the contact board and extending from the basic grid element into the flexible circuit board section.
摘要翻译：描述了用于测试电路板的测试器的模块。这样的测试器具有基本网格，可以布置适配器和/或转换器，以便将基本格栅的接触点与要测试的电路板的电路板测试点相连接。该模块包括支撑板和接触板。接触板由描述为基本网格元件的刚性电路板部分和至少一个柔性电路板部分形成。在基本网格元件上提供的是每个形成基本网格的接触点的一部分的接触点。基本栅格元件安装在支撑板的端面，并且柔性电路板部弯曲成使得接触板的另一部分的至少一部分平行于支撑板。基本栅格元件的每个接触点与在接触板中运行的导体路径电接触并且从基本栅格元件延伸到柔性电路板部分中。

7. 发明授权

US07339386B2 Probe, printed circuit board testing device and printed circuit board testing method 有权
标题翻译：探头，印刷电路板测试装置和印刷电路板测试方法
公开(公告)号：US07339386B2
公开(公告)日：2008-03-04
申请号：US11289452
申请日：2005-11-30
申请人： Susumu Miyazawa , Mikio Hara , Syuji Kagiyama , Yasuo Mori , Kyosuke Yoshizu , Shigenori Makita , Yoshino Miyazawa
发明人： Susumu Miyazawa , Mikio Hara , Syuji Kagiyama , Yasuo Mori , Kyosuke Yoshizu , Shigenori Makita , Yoshino Miyazawa
IPC分类号： G01R31/02
CPC分类号： G01R31/2808 , G01R1/07328
摘要： A probe is mountable to a printed circuit board testing device which performs a test on a predetermined land and/or a predetermined via hole of a printed circuit board. The probe includes a probe tip and a protrusion. The probe tip is contactable with the land and/or the via hole and projectable from the probe. The protrusion is disposed at a surface of the probe, the surface of the probe being disposed opposite to where the probe tip is projectable. The protrusion is grounded by a reaction pressure that is generated when the probe tip contacts the land and/or the via hole.
摘要翻译：探针可安装到印刷电路板测试装置上，该印刷电路板测试装置在印刷电路板的预定焊盘和/或预定通孔上进行测试。探头包括探针尖端和突起。探针尖端可与脊和/或通孔相接触，并可从探头投射。突起设置在探针的表面处，探针的表面设置成与探针尖端可投射的位置相对。突起通过当探针尖端接触平台和/或通孔时产生的反作用压力接地。

8. 发明授权

US07323892B1 Probe having a frame to align spring pins perpendicularly to a printed circuit board, and method of making same 失效
标题翻译：探针具有将弹簧销垂直于印刷电路板对准的框架及其制造方法
公开(公告)号：US07323892B1
公开(公告)日：2008-01-29
申请号：US11448700
申请日：2006-06-07
申请人： Brock J. LaMeres , Brent Holcombe
发明人： Brock J. LaMeres , Brent Holcombe
IPC分类号： G01R31/02
CPC分类号： G01R1/07328 , G01R31/2808
摘要： In one embodiment, a probe for probing test points on a target board includes a printed circuit board, a frame, and a plurality of spring pins. The printed circuit board (PCB) has a first side with a plurality of solder pads thereon, and a plurality of signal routes that are electrically coupled to the solder pads for routing signals to a test instrument. The frame is mechanically coupled to the PCB and has a main body portion with a plurality of holes therein. The holes in the frame are aligned with the plurality of solder pads on the first side of the PCB. The plurality of spring pins are provided for probing the test points on the target board, with each spring pin being i) disposed in one of the holes in the frame, perpendicularly abutting the first side of the PCB, and ii) electrically coupled to one of the solder pads. Other embodiments, including a method of making a probe, are also disclosed.
摘要翻译：在一个实施例中，用于探测目标板上的测试点的探针包括印刷电路板，框架和多个弹簧销。印刷电路板（PCB）具有在其上具有多个焊盘的第一侧和与焊料焊盘电耦合以将信号路由到测试仪器的多条信号路线。框架机械地联接到PCB并且具有其中具有多个孔的主体部分。框架中的孔与PCB的第一侧上的多个焊盘对齐。多个弹簧销用于探测目标板上的测试点，每个弹簧销i设置在框架的一个孔中，垂直地邻接PCB的第一侧，并且ii）电耦合到一个的焊盘。还公开了包括制作探针的方法的其它实施例。

9. 发明授权

US07208967B2 Socket connection test modules and methods of using the same 失效
标题翻译：套接字连接测试模块及使用方法
公开(公告)号：US07208967B2
公开(公告)日：2007-04-24
申请号：US11223248
申请日：2005-09-06
申请人： Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
发明人： Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
IPC分类号： G01R31/02
CPC分类号： G01R31/2806 , G01R1/07328 , G01R31/048 , G01R31/2896
摘要： Test modules, systems, and methods employing capacitors for the testing of the solder joint connections between a printed circuit board (PCB) and a socket of a device are presented in embodiments of the current invention. A test module having capacitors in parallel, and in particular embedded capacitors, can be used to test tied traces and their solder joint connections by measuring the total capacitance of the capacitors. Embodiments of the current invention present no-power tests that can be used with a variety of testing platforms and test fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA.) Additionally, the test module can be used with a variety of sockets, such as a ball grid array, a pinned grid array, and a land grid array.
摘要翻译：在本发明的实施例中给出了使用电容器测试印刷电路板（PCB）和器件插座之间的焊点连接的测试模块，系统和方法。可以使用具有并联电容器，特别是嵌入式电容器的测试模块，通过测量电容器的总电容来测试连接迹线及其焊点连接。本发明的实施例提出了可以与各种测试平台和测试夹具一起使用的无功功率测试，例如在线测试（ICT）和制造缺陷分析（MDA）。另外，测试模块可以与各种插座，例如球栅阵列，钉扎网格阵列和平台网格阵列。

10. 发明授权

US07129729B2 Socket connection test modules and methods of using the same 失效
标题翻译：套接字连接测试模块及使用方法
公开(公告)号：US07129729B2
公开(公告)日：2006-10-31
申请号：US11223249
申请日：2005-09-06
申请人： Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
发明人： Swee Cheng Ho , Teik Sean Toh , Tzyy Haw Tan
IPC分类号： G01R31/02
CPC分类号： G01R31/2806 , G01R1/07328 , G01R31/048 , G01R31/2896
摘要： Test modules, systems, and methods employing capacitors for the testing of the solder joint connections between a printed circuit board (PCB) and a socket of a device are presented in embodiments of the current invention. A test module having capacitors in parallel, and in particular embedded capacitors, can be used to test tied traces and their solder joint connections by measuring the total capacitance of the capacitors. Embodiments of the current invention present no-power tests that can be used with a variety of testing platforms and test fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA.) Additionally, the test module can be used with a variety of sockets, such as a ball grid array, a pinned grid array, and a land grid array.
摘要翻译：在本发明的实施例中给出了使用电容器测试印刷电路板（PCB）和设备的插座之间的焊点连接的测试模块，系统和方法。可以使用具有并联电容器，特别是嵌入式电容器的测试模块，通过测量电容器的总电容来测试连接迹线及其焊点连接。本发明的实施例提出了可以与各种测试平台和测试夹具一起使用的无功功率测试，例如在线测试（ICT）和制造缺陷分析（MDA）。另外，测试模块可以与各种插座，例如球栅阵列，钉扎网格阵列和平台网格阵列。

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