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1. 发明授权

US07245007B1 Exposed lead interposer leadframe package 有权
标题翻译：裸露引线插入式引线框封装
公开(公告)号：US07245007B1
公开(公告)日：2007-07-17
申请号：US10667226
申请日：2003-09-18
申请人： Donald Craig Foster
发明人： Donald Craig Foster
IPC分类号： H01L23/02
CPC分类号： H01L23/49861 , H01L23/49527 , H01L23/49531 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2224/85207 , H01L2225/1029 , H01L2225/1041 , H01L2924/01005 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An interposer for use in an external lead or land pattern semiconductor package. The interposer includes an interposer body which is molded from a dielectric material. The interposer body defines opposed top and bottom surfaces, an outer peripheral edge, and an inner peripheral edge. Embedded within the interposer body is a die pad which itself defines opposed top and bottom surfaces and a peripheral edge. The bottom surface of the die pad is exposed in and substantially flush with the bottom surface of the interposer body, with the inner peripheral edge of the interposer body and the top surface of the die pad collectively defining a cavity of the interposer. A plurality of electrically conductive interposer leads are embedded within the top surface of the interposer body and at least partially exposed therein. The interposer body forms a nonconductive barrier between each of the interposer leads and between the interposer leads and the die pad.
摘要翻译：一种用于外部引线或焊盘图案半导体封装的插入器。插入器包括由电介质材料模制的插入体。插入器主体限定相对的顶表面和底表面，外周边缘和内周边缘。嵌入在插入体内部的是一个芯片焊盘，其本身限定相对的顶表面和底表面以及外围边缘。芯片焊盘的底表面暴露在插入件主体的底表面上并基本上与内插器主体的底表面齐平，插入件主体的内周边缘和管芯焊盘的顶表面共同限定了插入件的空腔。多个导电插入器引线嵌入到插入体的顶表面内并且至少部分地暴露在其中。插入器主体在每个插入器引线之间以及插入器引线和芯片焊盘之间形成非导电屏障。

2. 发明申请

US20050062464A1 Apparatus for planarizing a probe card and method using same 有权
标题翻译：用于平面化探针卡的装置和使用其的方法
公开(公告)号：US20050062464A1
公开(公告)日：2005-03-24
申请号：US10902188
申请日：2004-07-28
申请人： Craig Foster , Ray Wakefield
发明人： Craig Foster , Ray Wakefield
IPC分类号： G01R31/02 , H01L20060101
CPC分类号： G01R31/2891 , G01R1/07307 , G01R1/07314 , G01R31/2886 , G01R31/2889
摘要： An apparatus for use with a wafer prober and a probe card comprising a stiffening member having a feature defining a first plane. The stiffening member is mountable atop the central portion of the probe card. A reference member is provided to mount to the wafer prober and has an underside with a feature defining a second plane. When the feature of the stiffening member defining the first plane is urged against the feature of the reference member defining a second plane the probe tips of the probe card are substantially planarized relative to the wafer prober.
摘要翻译：一种用于晶片探测器和探针卡的装置，包括具有限定第一平面的特征的加强构件。加强构件可安装在探针卡的中心部分的顶部。提供参考构件以安装到晶片探测器并具有具有限定第二平面的特征的底面。当限定第一平面的加强构件的特征被抵抗限定第二平面的参考构件的特征时，探针卡的探针尖端相对于晶片探针基本平坦化。

3. 发明授权

US06486781B2 Equipment label 失效
标题翻译：设备标签
公开(公告)号：US06486781B2
公开(公告)日：2002-11-26
申请号：US09852116
申请日：2001-05-09
申请人： Geoffrey Stephen Edwards , Michael Craig Foster
发明人： Geoffrey Stephen Edwards , Michael Craig Foster
IPC分类号： G08B1314
CPC分类号： G09F3/12 , G06K19/077 , G06K19/07758
摘要： An equipment label comprising an identity plate bearing information markings and an electronic tag having electrical contacts. The identity plate is provided with means for attachment to an item of equipment and is adapted to mount the electronic tag such that in use the label can be attached to the item of equipment with the identity plate's markings exposed to be read and the electrical contacts accessible for communication with the tag.
摘要翻译：一种设备标签，其包括承载信息标记的标识牌和具有电触点的电子标签。标识牌设置有用于附接到设备项目的装置，并且适于安装电子标签，使得在使用中标签可以被附接到设备项目，其中标识牌的标记被暴露以被读取，并且电触点可访问用于与标签进行通信。

4. 发明授权

US08551820B1 Routable single layer substrate and semiconductor package including same 有权
标题翻译：可路由单层基板和包含相同的半导体封装
公开(公告)号：US08551820B1
公开(公告)日：2013-10-08
申请号：US12568041
申请日：2009-09-28
申请人： Donald Craig Foster , Ronald Patrick Huemoeller
发明人： Donald Craig Foster , Ronald Patrick Huemoeller
IPC分类号： H01L21/44 , H01L23/495
CPC分类号： H01L23/3107 , H01L21/4821 , H01L21/561 , H01L23/49548 , H01L23/49582 , H01L24/97 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/181 , H05K2201/10689 , H01L2924/00 , H01L2224/85 , H01L2924/00012
摘要： In accordance with the present invention, there is provided a routable substrate that may be used, for example, in relation to the manufacture of Dual and Quad Flat No-Lead (DFN/QFN) style semiconductor packages as a substrate or interposer of such packages. The method of fabricating the substrate effectively removes metal from the saw streets and provides a more stable surface structure for wire bonding. The substrate fabrication method also utilizes existing etching techniques which are implemented in a prescribed sequence to achieve no metal in the saw streets and to completely electrically isolated features. Further, the substrate fabrication method includes a molding step intended to replace pressure sensitive adhesive tapes.
摘要翻译：根据本发明，提供了一种可路由的衬底，其可以例如关于制造双和四扁平无铅（DFN / QFN）型半导体封装作为这种封装的衬底或插入件。制造基板的方法有效地从锯片上除去金属并提供用于引线接合的更稳定的表面结构。衬底制造方法还利用现有的蚀刻技术，其以规定的顺序实现，以在锯片街道中没有金属和完全电隔离的特征。此外，基板制造方法包括用于替代压敏粘合带的成型步骤。

5. 发明授权

US08362597B1 Shielded package having shield lid 有权
公开(公告)号：US08362597B1
公开(公告)日：2013-01-29
申请号：US12589500
申请日：2009-10-23
申请人： Donald Craig Foster
发明人： Donald Craig Foster
IPC分类号： H01L23/552 , H01L23/12
CPC分类号： H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/552 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.

6. 发明授权

US07629674B1 Shielded package having shield fence 有权
标题翻译：屏蔽包装有屏蔽围栏
公开(公告)号：US07629674B1
公开(公告)日：2009-12-08
申请号：US10992036
申请日：2004-11-17
申请人： Donald Craig Foster
发明人： Donald Craig Foster
IPC分类号： H01L23/552
CPC分类号： H01L21/52 , H01L21/56 , H01L23/3121 , H01L23/552 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.
摘要翻译：屏蔽封装包括具有屏蔽罩，屏蔽盖和将屏蔽盖电连接到屏蔽栅的屏蔽盖粘合剂的屏蔽组件。屏蔽栅栏包括多孔侧壁，模制复合体在模制屏蔽封装期间通过该侧壁。此外，屏蔽栅栏包括中心孔，电子部件通过该中心孔模连接并引线接合。

7. 发明申请

US20060198319A1 Network diagnostic systems and methods for aggregated links 审中-公开
标题翻译：用于聚合链接的网络诊断系统和方法
公开(公告)号：US20060198319A1
公开(公告)日：2006-09-07
申请号：US11344893
申请日：2006-02-01
申请人： Adam Schondelmayer , Randy Oyadomari , Craig Foster , A. Lawson , Scott Baxter , Paul Abrahams
发明人： Adam Schondelmayer , Randy Oyadomari , Craig Foster , A. Lawson , Scott Baxter , Paul Abrahams
IPC分类号： H04J1/16 , H04J15/00
CPC分类号： H04L43/00 , G06F11/2294 , H04J3/0632 , H04J3/14 , H04L43/0823 , H04L43/0829
摘要： A networking system is provided. The networking system may include a diagnostic module. The diagnostic module may perform any of a variety of network diagnostic functions. The diagnostic module may include an analysis module, which may receive messages and perform any of a variety of network diagnostic functions using the messages it receives. The diagnostic module may include a logic module, which may receive network messages having a first format or structure, may process the network messages it receives into network messages having a second format or structure, and may send the processed messages to the analysis module. The logic module may receive the network messages from an aggregated link.
摘要翻译：提供网络系统。网络系统可以包括诊断模块。诊断模块可以执行各种网络诊断功能中的任一种。诊断模块可以包括分析模块，其可以使用其接收的消息来接收消息并执行各种网络诊断功能中的任一种。诊断模块可以包括逻辑模块，其可以接收具有第一格式或结构的网络消息，可以将其接收的网络消息处理成具有第二格式或结构的网络消息，并且可以将经处理的消息发送到分析模块。逻辑模块可以从聚合链路接收网络消息。

8. 发明授权

US06900527B1 Lead-frame method and assembly for interconnecting circuits within a circuit module 有权
标题翻译：电路模块内互连电路的引线框架方法和组装
公开(公告)号：US06900527B1
公开(公告)日：2005-05-31
申请号：US09956190
申请日：2001-09-19
申请人： Jeffrey Alan Miks , Kenneth Kaskoun , Markus Liebhard , Donald Craig Foster , Paul Robert Hoffman , Frederic Bertholio
发明人： Jeffrey Alan Miks , Kenneth Kaskoun , Markus Liebhard , Donald Craig Foster , Paul Robert Hoffman , Frederic Bertholio
IPC分类号： H01L23/31 , H01L23/495 , H01L23/02 , H01L23/04
CPC分类号： H01L23/49575 , H01L23/3107 , H01L24/48 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.
摘要翻译：用于在电路模块内互连电路的引线框架方法和组件允许在没有电路板基板的情况下制造电路模块。集成电路管芯连接到金属引线框架组件，并且管芯互连线被引线接合到引线框架组件上的互连点。引线框架组件从电路互连平面的延伸提供外部电触头，用于将电路模块连接到插座。

9. 发明授权

US06791166B1 Stackable lead frame package using exposed internal lead traces 有权
标题翻译：可堆叠引线框封装，使用暴露的内部引线
公开(公告)号：US06791166B1
公开(公告)日：2004-09-14
申请号：US09829341
申请日：2001-04-09
申请人： Donald Craig Foster
发明人： Donald Craig Foster
IPC分类号： H01L23495
CPC分类号： H01L23/49541 , H01L23/49503 , H01L23/49551 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/05554 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2225/1029 , H01L2225/1041 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A die package is formed, which allows additional electrical connections to the die by using internal leads or traces from a lead frame. The internal leads are exposed through an upper or lower surface of the package, thereby allowing an additional die package to be stacked and electrically connected to the underlying die or additional inputs/outputs to underlying external circuitry, such as a printed circuit board.
摘要翻译：形成管芯封装，其通过使用来自引线框架的内部引线或迹线来允许额外的电连接到管芯。内部引线通过封装的上表面或下表面暴露，从而允许将另外的管芯封装堆叠并电连接到下面的管芯或额外的输入/输出到诸如印刷电路板的下面的外部电路。

10. 发明授权

US3693634A Hair collecting collar for barbershop use 失效
标题翻译：毛发收集用于巴氏使用的胶合片
公开(公告)号：US3693634A
公开(公告)日：1972-09-26
申请号：US3693634D
申请日：1971-07-19
申请人： JAMES CRAIG FOSTER JR , JERRY E GILBERT
发明人： GILBERT JERRY E
IPC分类号： A45D44/08 , A45D44/16 , A45D
CPC分类号： A45D44/08 , A45D44/16
摘要： A readily attachable elastic collar (rubber or plastic material) adapted to be fitted snugly but yieldingly around the neck of a customer whose hair is being cut and which embodies facilities to collect, trap and dispose of the hair clippings. The upper edge is fashioned into a hollow bead whose hollow portion provides a hair conveying duct. An inward convex surface of the bead is provided with a row of hair inlet slots which feed the loose hairs into the duct. One rearward end terminates in a corrugated neck which is connectible with a suction hose. The other end is provided with an extending tongue which provides a hose-end connecting flap and which is adjustably but retentively held in a given position. The lower edge portion of the collar has a channel for reception and support of the upper hem-equipped end of the usual apron.
摘要翻译：一种易于安装的弹性领（橡胶或塑料材料），其适于紧密地装配，但是在头发被切割的客户的颈部附近屈服，并且其体现了收集，捕获和处理剪发物的设施。上边缘被制成空心珠，其空心部分提供毛发输送管。胎圈的向内凸的表面设置有一排头发入口狭槽，其将松散的头发进入管道。一个后端终止于可与抽吸软管连接的波纹颈部。另一端设置有延伸的舌部，其提供软管端连接折板，并且其可调节地但保持性地保持在给定位置。衣领的下边缘部分具有用于接收和支撑普通围裙的上摆边的通道。

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