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    • 4. 发明授权
    • Active heat sink for cooling a semiconductor chip
    • 主动散热片用于冷却半导体芯片
    • US06429513B1
    • 2002-08-06
    • US09866100
    • 2001-05-25
    • Charles A. Shermer, IVThomas P. GlennSteven WebsterDonald Craig Foster
    • Charles A. Shermer, IVThomas P. GlennSteven WebsterDonald Craig Foster
    • H01L2334
    • H01L23/427H01L23/4334H01L2224/48227H01L2224/48247H01L2924/15311
    • Semiconductor packages and other electronic assemblies having an active heat sink are disclosed, along with methods of making the same. The active heat sink includes a cavity partially filled with a heat activated liquid. Heat generated during operation of a chip boils the heat activated liquid. The vapor condenses on an inner surface of the active heat sink and transfers heat to an outer, possibly finned, surface exposed to ambient to dissipate heat. In some embodiments, the active heat sink may be a closed vessel mounted on the chip. In some embodiments, the vessel of the active heat sink is formed from a die pad of a leadframe substrate. The die pad includes a recess that forms the active heat sink cavity when bonded to the back surface of the chip. The heat activated liquid directly contacts the back surface of the chip in these embodiments.
    • 公开了具有有源散热器的半导体封装和其它电子组件及其制造方法。 活性散热器包括部分填充有热活化液体的空腔。 在芯片运行期间产生的热量使热活化液体沸腾。 蒸汽在有源散热器的内表面上冷凝,并将热量传递到暴露于环境的外部可能有翅片的表面以散热。 在一些实施例中,有源散热器可以是安装在芯片上的封闭容器。 在一些实施例中,有源散热器的容器由引线框架基板的管芯焊盘形成。 芯片焊盘包括当结合到芯片的背面时形成有源散热腔的凹部。 在这些实施例中,热活化液体直接接触芯片的背面。