专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08952404B2 Light-emitting device package and method of manufacturing the light-emitting device package 有权
标题翻译：发光器件封装以及制造发光器件封装的方法
公开(公告)号：US08952404B2
公开(公告)日：2015-02-10
申请号：US13348369
申请日：2012-01-11
申请人： Cheol-jun Yoo , Young-hee Song
发明人： Cheol-jun Yoo , Young-hee Song
IPC分类号： H01L33/44 , H01L33/48 , B29C45/14 , H01L33/54 , H01L33/64
CPC分类号： H01L33/486 , B29C45/14344 , B29C45/14655 , B29C45/14836 , H01L33/54 , H01L33/647 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/4826 , H01L2224/73215 , H01L2924/15311 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate.
摘要翻译：具有提高接合线的连接可靠性的发光器件封装，由于后成型而导致的散热特性和光质量以及制造发光器件封装的方法。发光器件封装包括例如具有开口的布线基板; 发光装置，其布置在所述布线基板上并覆盖所述开口; 通过所述开口将所述布线基板的底面与所述发光装置的底面电连接的接合线; 在布线基板的上表面的一部分上形成有围绕发光装置的侧面而不是作为发光面的发光元件的顶面的成型部件，布线基板的开口以覆盖接合线; 以及形成在布线基板的底面上的阻焊剂和凸块。

2. 发明授权

US08796050B2 Method and apparatus for manufacturing white light-emitting device 有权
标题翻译：白光发光装置的制造方法及装置
公开(公告)号：US08796050B2
公开(公告)日：2014-08-05
申请号：US13338678
申请日：2011-12-28
申请人： Cheol-jun Yoo , Seong-jae Hong , Tsuyoshi Tsutsui , Shin-kun Kim
发明人： Cheol-jun Yoo , Seong-jae Hong , Tsuyoshi Tsutsui , Shin-kun Kim
IPC分类号： H01L33/50 , H01L33/00 , H01L21/67 , H01L21/683
CPC分类号： B05C1/027 , H01L21/6715 , H01L21/6838 , H01L33/0079 , H01L33/50 , H01L2933/0041
摘要： Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.
摘要翻译：制造通过在晶片级在半导体发光元件的发射表面上形成荧光层而发出白光的半导体发光器件的制造方法和装置。该方法包括：在晶片上形成多个发光器件; 使形成有多个发光装置的晶片变薄; 将薄的晶片设置在载体膜上; 以及在所述晶片上的所述多个发光器件的发射表面上形成荧光体层。

3. 发明授权

US08795817B2 Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package, and LED package manufactured thereby 有权
标题翻译：荧光体膜，其制造方法，荧光体层的涂布方法，LED封装的制造方法以及由此制造的LED封装
公开(公告)号：US08795817B2
公开(公告)日：2014-08-05
申请号：US13818373
申请日：2011-08-24
申请人： Chang Hoon Kwak , II Woo Park , Kyu Jin Lee , Cheol Jun Yoo , Seong Jae Hong
发明人： Chang Hoon Kwak , II Woo Park , Kyu Jin Lee , Cheol Jun Yoo , Seong Jae Hong
IPC分类号： B32B3/10 , B32B5/16 , H01L33/50 , C09K11/06
CPC分类号： H01L33/50 , B32B3/08 , B32B3/10 , B32B3/14 , B32B3/16 , B32B3/18 , B32B5/16 , B32B7/12 , B32B9/04 , B32B9/045 , B32B27/06 , B32B27/08 , B32B27/32 , B32B2250/03 , B32B2250/40 , B32B2250/44 , B32B2266/025 , B32B2307/40 , B32B2307/422 , B32B2457/00 , C09K11/06 , H01L24/97 , H01L33/505 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/00011 , H01L2924/181 , H01L2933/0041 , H05B33/22 , Y10T428/24802 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , Y10T428/31855 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01005 , H01L2924/00012
摘要： There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.
摘要翻译：提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。

4. 发明授权

US08741675B2 Method of manufacturing semiconductor light emitting device and mask for application of paste used therefor 有权
标题翻译：制造半导体发光元件的制造方法以及用于其的膏体的涂布面罩
公开(公告)号：US08741675B2
公开(公告)日：2014-06-03
申请号：US13409641
申请日：2012-03-01
申请人： Cheol Jun Yoo , Seong Jae Hong
发明人： Cheol Jun Yoo , Seong Jae Hong
IPC分类号： H01L21/78 , H01L33/50 , H01L33/54
CPC分类号： H01L33/505 , H01L33/38 , H01L2933/0041
摘要： Provided are a mask for an application of paste and a method of manufacturing a semiconductor light emitting device by using the same. The method includes preparing a light emitting structure including first and second conductive semiconductor layers and an active layer disposed therebetween, which has at least one electrode formed on a surface of the light emitting structure; disposing a mask having an open part exposing a portion of the surface of the light emitting structure therethrough and a recess part corresponding the electrode in a region thereof on a surface of the light emitting structure; and applying wavelength conversion material-containing paste to the surface of the light emitting structure through the open part.
摘要翻译：提供了一种用于施加糊剂的掩模和使用该方法制造半导体发光器件的方法。该方法包括制备包括第一和第二导电半导体层和设置在其间的有源层的发光结构，其具有形成在发光结构的表面上的至少一个电极; 在所述发光结构的表面上配置具有使所述发光结构体的表面的一部分露出的开口部的掩模和与所述电极对应的凹部，并通过开放部分将波长转换材料的浆料涂覆到发光结构的表面。

5. 发明授权

US08587010B2 Light emitting device package and method of manufacturing the same 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US08587010B2
公开(公告)日：2013-11-19
申请号：US13328864
申请日：2011-12-16
申请人： Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
发明人： Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00
摘要： Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.
摘要翻译：提供了一种发光器件封装，包括：多个引线框架，被布置成彼此分离; 至少一个发光装置，其安装在引线框架上，并通过设置在引线接合焊盘上的接合线电连接到引线框架，所述引线接合焊盘设置在作为上表面设置的发光面的同一表面上发光装置; 形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架的主体部分，并且具有形成在其上表面中的反射槽，以将发光表面暴露于外部; 以及设置在主体部分上的透镜部分，以覆盖发光器件。

6. 发明申请

US20130032843A1 LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20130032843A1
公开(公告)日：2013-02-07
申请号：US13564330
申请日：2012-08-01
申请人： Cheol Jun YOO , Young Hee Song
发明人： Cheol Jun YOO , Young Hee Song
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L2224/13 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/181 , H01L2924/18301 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED.
摘要翻译：提供一种发光二极管（LED）封装及其制造方法。 LED封装包括：基板，包括电路层，安装在基板上的LED以及设置在除了基板上的LED安装区域之外的区域中的多个突出反射单元，其被配置为反射从LED产生的光。

7. 发明申请

US20120241797A1 LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING DIODE MODULE, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光二极管，其制造方法，发光二极管模块及其制造方法
公开(公告)号：US20120241797A1
公开(公告)日：2012-09-27
申请号：US13428726
申请日：2012-03-23
申请人： Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
发明人： Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC分类号： H01L33/50
CPC分类号： H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
摘要翻译：提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

8. 发明申请

US20120205708A1 LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US20120205708A1
公开(公告)日：2012-08-16
申请号：US13365882
申请日：2012-02-03
申请人： Cheol-jun YOO , Young-hee SONG
发明人： Cheol-jun YOO , Young-hee SONG
IPC分类号： H01L33/36 , H01L33/48
CPC分类号： H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2933/005 , H01L2924/00014
摘要： A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame.
摘要翻译：一种发光器件封装。发光器件封装包括引线框架，该引线框架包括多个单独的引线; 模制构件，其固定所述多个引线并且包括暴露所述引线框架的开口部; 以及发光器件芯片，其安装在所述引线框架中的所述开口部分中并且通过所述发光器件芯片的上表面部分发射光，其中所述模制构件的高度低于所述发光器件芯片的高度，相对于引线框架的发光器件芯片。

9. 发明申请

US20120205696A1 LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：发光器件封装及其制造方法
公开(公告)号：US20120205696A1
公开(公告)日：2012-08-16
申请号：US13356245
申请日：2012-01-23
申请人： Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
发明人： Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
IPC分类号： H01L33/50 , H01L33/58 , H01L33/62
CPC分类号： H01L33/642 , H01L24/97 , H01L33/486 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/12041 , H01L2924/181 , H01L2933/0033 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： There are provided a light emitting device package and a method of manufacturing thereof. The light emitting device package including a first lead frame including amounting area and a heat radiating area surrounding the mounting area, the mounting area being protruded upwardly so as to be located higher than the heat radiating area; a second lead frame disposed to be spaced apart from the first lead frame; at least one light emitting device disposed on the mounting area of the first lead frame; a molding part formed so as to fix the first and second lead frame leads thereto; and a lens part disposed over the at least one light emitting device and the molding part, and the method of manufacturing the light emitting device package are provided.
摘要翻译：提供了一种发光器件封装及其制造方法。所述发光器件封装包括包括量区域的第一引线框架和围绕所述安装区域的散热区域，所述安装区域向上突出以被定位成高于所述散热区域; 设置成与所述第一引线框架间隔开的第二引线框架; 至少一个发光器件，设置在第一引线框架的安装区域上; 形成为将第一和第二引线框架引线固定到其上的模制部件; 以及设置在所述至少一个发光器件和所述模制部件上的透镜部分，以及制造所述发光器件封装的方法。

10. 发明申请

US20120142124A1 METHOD OF APPLYING PHOSPHOR TO SEMICONDUCTOR LIGHT-EMITTING DEVICE 审中-公开
标题翻译：将磷光体应用于半导体发光器件的方法
公开(公告)号：US20120142124A1
公开(公告)日：2012-06-07
申请号：US13289497
申请日：2011-11-04
申请人： Cheol-jun Yoo , Seong-jae Hong
发明人： Cheol-jun Yoo , Seong-jae Hong
IPC分类号： H01L33/08
CPC分类号： H01L33/50 , H01L33/0095
摘要： A method of applying a phosphor according to a light-emission characteristic of semiconductor light-emitting devices so as to increase a yield rate of manufacture with respect to a white light-emitting device chip, the method including the operations of testing light-emission characteristics of a plurality of light-emitting devices formed on a wafer; disposing a plurality of light-emitting devices having the same light-emission characteristics on a carrier substrate; applying a same phosphor to the plurality of light-emitting devices disposed on the carrier substrate; and separating the plurality of arrayed light-emitting devices. Thus, a white light-emitting device chip manufactured by using the method may emit almost the same white light.
摘要翻译：一种根据半导体发光器件的发光特性施加荧光体以提高白色发光器件芯片的制造成品率的方法，该方法包括测试发光特性形成在晶片上的多个发光器件; 在载体基板上配置具有相同发光特性的多个发光器件; 对设置在载体基板上的多个发光装置施加相同的荧光体; 以及分离所述多个排列的发光器件。因此，通过使用该方法制造的白色发光器件芯片可以发射几乎相同的白光。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式