专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120241797A1 LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING DIODE MODULE, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光二极管，其制造方法，发光二极管模块及其制造方法
公开(公告)号：US20120241797A1
公开(公告)日：2012-09-27
申请号：US13428726
申请日：2012-03-23
申请人： Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
发明人： Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC分类号： H01L33/50
CPC分类号： H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
摘要翻译：提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

2. 发明授权

US08785953B2 Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof 有权
标题翻译：发光二极管及其制造方法，发光二极管模块及其制造方法
公开(公告)号：US08785953B2
公开(公告)日：2014-07-22
申请号：US13428726
申请日：2012-03-23
申请人： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
发明人： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
摘要翻译：提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

3. 发明申请

US20130092962A1 LIGHT EMITTING DEVICE (LED), MANUFACTURING METHOD THEREOF, AND LED MODULE USING THE SAME 审中-公开
标题翻译：发光装置（LED）及其制造方法及其使用的LED模块
公开(公告)号：US20130092962A1
公开(公告)日：2013-04-18
申请号：US13655100
申请日：2012-10-18
申请人： Ho Sun Paek , Hak Hwan Kim , Ill Heung Choi , Kyung Mi Moon
发明人： Ho Sun Paek , Hak Hwan Kim , Ill Heung Choi , Kyung Mi Moon
IPC分类号： H01L33/08 , H01L33/62
CPC分类号： H01L33/62 , H01L33/44 , H01L2224/16225
摘要： A light emitting device (LED), a manufacturing method thereof, and an LED module using the same. The LED may include a first semiconductor layer, an active layer, and a second semiconductor layer formed sequentially on a light-transmitting substrate, a first electrode formed in a region exposed by removing a part of the first semiconductor layer, a second electrode formed on the second semiconductor layer, a passivation layer formed on the first electrode and the second electrode to expose a region of the first electrode and a region of the second electrode, a first bump formed in a first region including the first electrode exposed through the passivation layer, and extended to another region of the second electrode on which the passivation layer is formed, and a second bump formed in a second region including the second electrode exposed through the passivation layer.
摘要翻译：发光装置（LED）及其制造方法以及使用其的LED模块。 LED可以包括在透光性基板上依次形成的第一半导体层，有源层和第二半导体层，形成在通过去除第一半导体层的一部分而露出的区域中的第一电极，形成在所述第二半导体层，形成在所述第一电极和所述第二电极上以钝化所述第一电极的区域和所述第二电极的区域的钝化层，形成在包括通过所述钝化层暴露的所述第一电极的第一区域中的第一凸起并且延伸到其上形成有钝化层的第二电极的另一区域，以及形成在包括通过钝化层暴露的第二电极的第二区域中的第二凸块。

4. 发明申请

US20120267647A1 LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：发光装置模块及其制造方法
公开(公告)号：US20120267647A1
公开(公告)日：2012-10-25
申请号：US13452561
申请日：2012-04-20
申请人： Hak Hwan KIM , Kyung Mi Moon , Ho Sun Paek , Young Hee Song
发明人： Hak Hwan KIM , Kyung Mi Moon , Ho Sun Paek , Young Hee Song
IPC分类号： H01L33/50
CPC分类号： H01L33/502 , H01L25/0753 , H01L27/15 , H01L33/50 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.
摘要翻译：提供了可应用于各种应用的发光器件（LED）模块及其制造方法。通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量，可以提高价格竞争力。在制造LED模块的方法中，通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作，可以最小化和简化操作。可以通过使用金属材料作为基板和凸块来增强散热特性。

5. 发明授权

US08960984B2 Backlight unit including COB type light emitting diode module 有权
标题翻译：背光单元包括COB型发光二极管模块
公开(公告)号：US08960984B2
公开(公告)日：2015-02-24
申请号：US13594014
申请日：2012-08-24
申请人： Kyung Mi Moon , Hak Hwan Kim
发明人： Kyung Mi Moon , Hak Hwan Kim
IPC分类号： F21V8/00 , G02F1/1335 , H01L33/58
CPC分类号： G02B6/0021 , G02F1/133615 , H01L33/58
摘要： A backlight unit (BLU) is disclosed. The BLU may include a light emitting diode (LED) module including at least one LED chip mounted on a substrate in a chip-on-board (COB) type, and a light guide panel including an incidence surface configured to receive light emitted from an emission surface of the LED chip and to include at least one insertion recess disposed corresponding to the LED chip, such that the LED chip is bonded to the LED module to be inserted in the insertion recess.
摘要翻译：公开了一种背光单元（BLU）。 BLU可以包括发光二极管（LED）模块，其包括安装在基板上（COB）类型的基板上的至少一个LED芯片，以及导光板，其包括入射表面，该入射表面被配置为接收从并且包括与LED芯片相对设置的至少一个插入凹槽，使得LED芯片被结合到LED模块以插入插入凹部中。

6. 发明申请

US20140197443A1 LED DEVICE HAVING IMPROVED LUMINOUS EFFICACY 有权
标题翻译：具有改善的LUMINOUS效能的LED装置
公开(公告)号：US20140197443A1
公开(公告)日：2014-07-17
申请号：US14238963
申请日：2011-08-16
申请人： Kyung Mi Moon , Jung Hye Chae , Hyung Kun Kim , Se Hwan An
发明人： Kyung Mi Moon , Jung Hye Chae , Hyung Kun Kim , Se Hwan An
IPC分类号： H01L33/50 , H01L33/60
CPC分类号： H01L33/502 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/56 , H01L33/60
摘要： There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K.
摘要翻译：提供了一种发光二极管（LED）装置，其包括发射特定波长区域内的光的LED芯片，覆盖LED芯片的发光面的透明树脂层和形成为与LED间隔开的颜色转换层通过透明树脂层覆盖透明树脂层并且包括将从LED芯片发射的光转换成不同波长区域内的光的至少一种类型的荧光体，其中包括在颜色转换层中的荧光体颗粒的平均自由程是在5500K的温度下为0.8mm以上。

7. 发明申请

US20120056227A1 LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20120056227A1
公开(公告)日：2012-03-08
申请号：US13224658
申请日：2011-09-02
申请人： Young Jin LEE , Hyung Kun Kim , Kyung Mi Moon , Gwang Bok Woo
发明人： Young Jin LEE , Hyung Kun Kim , Kyung Mi Moon , Gwang Bok Woo
IPC分类号： H01L33/62 , H01L33/58
CPC分类号： H01L33/642 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2933/0075 , H01L2924/00014
摘要： A light emitting diode (LED) package is disclosed. The LED package includes a lead frame comprising a thermal pad and at least two electrode pads disposed at a distance from the thermal pad; at least one LED mounted on the thermal pad and electrically connected with the at least two electrode pads through a wire; a package mold comprising a first cavity to receive the thermal pad and the at least two electrode pads and to partially expose the thermal pad and the at least two electrode pads through a first surface of the package mold, the first surface on which the at least one LED is mounted, and exposing the thermal pad and the at least two electrode pads through a surface coplanar with a second surface opposite to the first surface; and a molding unit disposed in the first cavity.
摘要翻译：公开了一种发光二极管（LED）封装。所述LED封装包括引线框架，所述引线框架包括散热焊盘和至少两个设置在距离所述散热焊盘一定距离的电极焊盘; 至少一个LED，其安装在所述散热垫上并通过导线与所述至少两个电极焊盘电连接; 封装模具，其包括用于接收所述热垫和所述至少两个电极焊盘的第一腔，并且通过所述封装模具的第一表面部分地暴露所述热垫和所述至少两个电极焊盘，所述第一表面至少在所述第一表面上，安装一个LED，并且通过与第一表面相对的第二表面共面的表面暴露热衬垫和至少两个电极焊盘; 以及设置在所述第一腔中的模制单元。

8. 发明申请

US20120043896A1 AC DRIVEN LIGHT EMITTING DEVICE 有权
标题翻译：交流驱动发光装置
公开(公告)号：US20120043896A1
公开(公告)日：2012-02-23
申请号：US13215619
申请日：2011-08-23
申请人： Young Jin LEE , Hyung Kun Kim , Kyung Mi Moon
发明人： Young Jin LEE , Hyung Kun Kim , Kyung Mi Moon
IPC分类号： H05B37/02
CPC分类号： H05B33/0821 , H05B33/0806
摘要： There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.
摘要翻译：提供了一种包括串联连接的多个LED阵列的交流（AC）驱动的发光器件，每个LED阵列具有多个LED电连接以形成两端电路并通过双向电压发光的结构当对两端电路施加交流电压时; 以及连接到所述多个LED阵列中的至少一个并且控制相对于所述多个LED阵列的总驱动电压的开关装置。交流驱动发光器件允许从低驱动电压Vf进行操作，同时具有高电压Vf的高驱动电压，从而在功率因数，THD和能量效率方面实现卓越。

9. 发明授权

US07983552B2 Camera flash lens and portable device including the same 有权
标题翻译：相机闪光灯镜头和便携式设备包括相同
公开(公告)号：US07983552B2
公开(公告)日：2011-07-19
申请号：US12580150
申请日：2009-10-15
申请人： Kyung Mi Moon , Jin Ha Kim
发明人： Kyung Mi Moon , Jin Ha Kim
IPC分类号： G03B15/03 , H04N5/222 , H01L33/00
CPC分类号： G03B15/05 , F21L4/02 , F21V5/045 , F21Y2115/10 , G03B2215/0503 , G03B2215/0592
摘要： A camera flash lens for a plurality of light emitting diodes (LEDs) mounted on a board and serving as a light source of a camera flash, includes a plurality of annular lenses corresponding to the plurality of LEDs, respectively. The plurality of annular lenses each include an edge portion extending toward the board to reflect and collect light emitted from the edge of a corresponding LED of the plurality of LEDs, and a central portion having an inner surface with a Fresnel shape or a curved shape to collect light emitted from the top of the corresponding LED.
摘要翻译：用于安装在板上并用作相机闪光灯的光源的多个发光二极管（LED）的相机闪光灯透镜分别包括与多个LED对应的多个环形透镜。多个环形透镜各自包括朝向板延伸的边缘部分，以反射和收集从多个LED中的相应LED的边缘发射的光，以及具有菲涅耳形状或弯曲形状的内表面的中心部分收集从相应LED顶部发出的光。

10. 发明授权

US09166120B2 LED device having improved luminous efficacy 有权
标题翻译： LED器件具有改善的发光效率
公开(公告)号：US09166120B2
公开(公告)日：2015-10-20
申请号：US14238963
申请日：2011-08-16
申请人： Kyung Mi Moon , Jung Hye Chae , Hyung Kun Kim , Se Hwan An
发明人： Kyung Mi Moon , Jung Hye Chae , Hyung Kun Kim , Se Hwan An
IPC分类号： H01L33/00 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/60
CPC分类号： H01L33/502 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/56 , H01L33/60
摘要： There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K.
摘要翻译：提供了一种发光二极管（LED）装置，其包括发射特定波长区域内的光的LED芯片，覆盖LED芯片的发光面的透明树脂层和形成为与LED间隔开的颜色转换层通过透明树脂层覆盖透明树脂层并且包括将从LED芯片发射的光转换成不同波长区域内的光的至少一种类型的荧光体，其中包括在颜色转换层中的荧光体颗粒的平均自由程是在5500K的温度下为0.8mm以上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式