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    • 4. 发明授权
    • Semiconducting YBCO device and superconducting YBCO device locally converted by AFM tip and manufacturing methods therefor
    • 半导体YBCO器件和由AFM尖端局部转换的超导YBCO器件及其制造方法
    • US06388268B1
    • 2002-05-14
    • US09670315
    • 2000-09-26
    • Byong-man KimInsang Song
    • Byong-man KimInsang Song
    • H01L2906
    • H01L45/00G01Q60/40G01Q80/00H01L39/225Y10S505/702Y10S977/859
    • A semiconducting yttrium-barium-copper-oxygen(YBCO) device which locally converts a semiconducting YBCO film to a nonconducting YBCO film by a conductive atomic force microscope (AFM), a superconducting YBCO device which locally converts a superconducting YBCO film to nonsuperconducting YBCO by an AFM, and manufacturing methods thereof are provided. According to a method of manufacturing a semiconducting YBCO device or a superconducting YBCO device locally converted by an AFM tip, a voltage is applied to the local region of a semiconducting YBCO channel or a superconducting YBCO channel by an AFM tip. This can produce a nonconducting YBCO region or nonsuperconducting YBCO region to thereby manufacture a tunnel junction easily without any patterning process by microfabrication including photolithography and dry/wet etching.
    • 通过导电原子力显微镜(AFM)将半导体YBCO膜局部转换成不导电的YBCO膜的半导体钇钡钡氧(YBCO)器件,超导YBCO器件,其将超导YBCO膜局部转换为非超导YBCO,由 提供AFM及其制造方法。 根据制造由AFM尖端局部转换的半导体YBCO器件或超导YBCO器件的方法,通过AFM尖端将电压施加到半导体YBCO通道或超导YBCO通道的局部区域。 这可以产生不导电的YBCO区域或非超导YBCO区域,从而通过微加工(包括光刻和干/湿蚀刻)容易地形成隧道结,而无需任何图案化工艺。
    • 5. 发明授权
    • Fabrication method of single electron tunneling device
    • 单电子隧穿装置的制造方法
    • US06268273B1
    • 2001-07-31
    • US09714512
    • 2000-11-17
    • Byong-man KimJo-won LeeMi-young KimMoon-kyoung Kim
    • Byong-man KimJo-won LeeMi-young KimMoon-kyoung Kim
    • H01L214763
    • H01L29/66439B82Y10/00B82Y30/00H01L29/7613Y10S438/927Y10S438/962Y10S438/979
    • A method of fabricating a single electron tunneling (SET) device, the method including forming a source electrode and a drain electrode a predetermined distance apart from each other on an insulating substrate, forming a metal layer having a thickness on the order of nanometers between the source and drain electrodes, and forming quantum dots between the source and drain electrodes due to the movement of metal atoms/ions within the metal layer caused by applying a predetermined voltage to the source and drain electrodes. In the manufacture of an SET device, quantum dots can be formed by a simple method instead of an self assembled monolayer (SAM) method or lithographic methods. Thus, SET devices fabricated in this way have no material dependency, and are also applicable to large scale integration (LSI) structures. Also, since quantum dots are obtained by deposition and electromigration, SET devices having the above-described advantages can be mass-produced.
    • 一种制造单电子隧道(SET)器件的方法,该方法包括在绝缘衬底上形成彼此相隔预定距离的源电极和漏电极,形成厚度约为数量级的金属层 源极和漏极,以及由于通过向源极和漏极施加预定电压而在金属层内的金属原子/离子的移动,在源极和漏极之间形成量子点。 在SET装置的制造中,可以通过简单的方法而不是自组装单层(SAM)方法或光刻方法来形成量子点。 因此,以这种方式制造的SET器件没有材料依赖性,并且也适用于大规模集成(LSI)结构。 此外,由于通过沉积和电迁移获得量子点,因此可以批量生产具有上述优点的SET器件。