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1. 发明授权

US06678452B1 Optical waveguide device 有权
标题翻译：光波导器件
公开(公告)号：US06678452B1
公开(公告)日：2004-01-13
申请号：US09807627
申请日：2001-08-15
申请人： Peter Bloechl , Gian-Luca Bona , Folkert Horst , Ilana Massarek , Bert Offrein , Roland Germann , Huub Salemink
发明人： Peter Bloechl , Gian-Luca Bona , Folkert Horst , Ilana Massarek , Bert Offrein , Roland Germann , Huub Salemink
IPC分类号： G02B622
CPC分类号： G02B6/122 , G02B6/105 , G02B6/126 , G02B6/136
摘要： An optical waveguide device is proposed which comprises a substrate, thereupon a lower cladding layer, thereupon an upper cladding layer and between said cladding layers a waveguide element. The influence of the substrate on the stress-induced birefringence of the optical waveguide device is reduced by modification of the substrate from underneath the waveguide element.
摘要翻译：提出了一种光波导器件，其包括衬底，随后是下包层，随后是上包层，并且在所述包层之间包括波导元件。通过从波导元件下方修改基板，减小了基板对光波导器件的应力诱导双折射的影响。

2. 发明申请

US20050176161A1 Circuit board integrated optical coupling elements 有权
标题翻译：电路板集成光耦合元件
公开(公告)号：US20050176161A1
公开(公告)日：2005-08-11
申请号：US10775854
申请日：2004-02-10
申请人： Urs Bapst , Christoph Berger , Russell Budd , Folkert Horst , Bert Offrein
发明人： Urs Bapst , Christoph Berger , Russell Budd , Folkert Horst , Bert Offrein
IPC分类号： G02B6/12 , G02B6/42 , G02B6/43 , H01L21/00 , H05K1/02 , H05K3/00
CPC分类号： H05K3/0032 , G02B6/42 , G02B6/4214 , G02B6/423 , G02B6/4231 , G02B6/4249 , G02B6/43 , G02B2006/12104 , H05K1/0274 , H05K3/0041 , H05K2201/09918 , H05K2203/0207 , H05K2203/0384
摘要： Techniques for circuit board processing are provided. In one aspect, a method of processing a circuit board having one or more optical waveguides associated therewith is provided. The method comprises the following steps. One or more etch stop layers in proximity to the one or more waveguides are provided, at least one of the etch stop layers comprising one or more fiducials therein. From a surface of the circuit board, the one or more etch stop layers are used to selectively remove material to provide openings having a defined positioning and depth in the circuit board. A circuit board having one or more optical waveguides associated therewith is also provided.
摘要翻译：提供电路板处理技术。一方面，提供一种处理具有与其相关联的一个或多个光波导的电路板的方法。该方法包括以下步骤。提供了靠近一个或多个波导的一个或多个蚀刻停止层，其中至少一个蚀刻停止层包括一个或多个基准。从电路板的表面，使用一个或多个蚀刻停止层来选择性地去除材料以提供在电路板中具有确定的定位和深度的开口。还提供了具有与其相关联的一个或多个光波导的电路板。

3. 发明申请

US20050149593A1 Transitioning a filter function of a two-port lattice-form planar waveguide optical delay line circuit filter from a start filter function to a target filter function 失效
标题翻译：将两端口格式平面波导光学延迟线电路滤波器的滤波器功能从起始滤波器功能转换到目标滤波器功能
公开(公告)号：US20050149593A1
公开(公告)日：2005-07-07
申请号：US11029540
申请日：2005-01-05
申请人： Tonnis Koster , Bert Offrein , Gian Salis
发明人： Tonnis Koster , Bert Offrein , Gian Salis
IPC分类号： G02B6/12 , G06F17/10
CPC分类号： G02B6/12007
摘要： Optically coherent, two-port, serially cascaded-form optical delay line circuits can realize arbitrary signal processing functions identical to those of FIR digital filters with complex filter coefficients whilst maintaining a maximum optical transmission characteristic of 100%. The invention provides an iterative process for transitioning in a step-wise manner a filter function of an optical delay line circuit filter from a start filter function to a target filter function. The invention also describes a dynamic gain equalizer incorporating an optical delay line circuit filter.
摘要翻译：光学相干，双端口，串联级联形式的光延迟线电路可以实现与复数滤波器系数的FIR数字滤波器相同的任意信号处理功能，同时保持100％的最大光传输特性。本发明提供了一种用于逐步地将光学延迟线电路滤波器的滤波器功能从起始滤波器功能转换到目标滤波器功能的迭代过程。本发明还描述了结合光学延迟线电路滤波器的动态增益均衡器。

4. 发明授权

US06870967B2 Pretrimming of tunable finite response (FIR) filter 失效
标题翻译：预调制可调谐有限响应（FIR）滤波器
公开(公告)号：US06870967B2
公开(公告)日：2005-03-22
申请号：US10268637
申请日：2002-10-10
申请人： Dorothea W. Wiesmann , Folkert Horst , Bert Offrein , Gian-Luca Bona
发明人： Dorothea W. Wiesmann , Folkert Horst , Bert Offrein , Gian-Luca Bona
IPC分类号： G02B6/12 , G02B6/125 , G02B6/13 , G02B1/01
CPC分类号： G02B6/13 , G02B6/12007 , G02B6/125 , G02B2006/12159
摘要： A method of inducing phase changes in a FIR filter is provided. The FIR filter consists of a concatenation of tunable couplers and tunable delay lines made of planar waveguides fabricated in SiON technology, forming a plurality of interferometers, at least one of which carries a heater on at least one of its waveguide arms. The method includes the step of exposing at least one of the arms of the interferometers to an irradiation at UV or a smaller wavelength, thereby inducing a change in the refractive index of the waveguide arms which induces the phase difference change. The method provides a procedure that will lead to temperature-stable changes of the refractive index of the waveguides. The resulting device is temperature-stable such that it can be afterwards be heated with chromium heaters to dynamically tune its spectral response without destroying the UV-induced changes.
摘要翻译：提供了一种引入FIR滤波器的相位变化的方法。 FIR滤波器由可调谐耦合器和由SiON技术制造的平面波导制成的可调谐延迟线的级联组成，其形成多个干涉仪，其中至少一个在至少一个波导臂上承载加热器。该方法包括将干涉仪的至少一个臂暴露于UV或较小波长的照射的步骤，从而引起导致相位差变化的波导臂的折射率的变化。该方法提供了将导致波导的折射率的温度稳定变化的过程。所得到的装置是温度稳定的，使得其可以随后用铬加热器加热以动态调节其光谱响应而不破坏UV诱导的变化。

5. 发明申请

US20070205479A1 METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE 失效
标题翻译：将柔性结构连接到装置的方法和具有柔性结构的装置
公开(公告)号：US20070205479A1
公开(公告)日：2007-09-06
申请号：US11469336
申请日：2006-08-31
申请人： Roger Dangel , Laurent Dellmann , Michel Despont , Bert Offrein , Stefano Oggioni
发明人： Roger Dangel , Laurent Dellmann , Michel Despont , Bert Offrein , Stefano Oggioni
IPC分类号： H01L31/0232 , H01L21/00
CPC分类号： H05K1/0393 , B81C3/008 , G02B6/43 , H01L27/14618 , H01L2924/0002 , H05K1/189 , H05K3/4691 , H05K2201/0108 , H05K2203/308 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49171 , H01L2924/00
摘要： Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
摘要翻译：用于生产连接到装置的柔性结构的技术。一个实施例包括以下步骤：提供第一基板，为第二基板提供可释放地附接的柔性结构，在第一基板和柔性结构中的至少一个上提供接合层，邻接第一和第二基板，使得柔性结构通过结合层附着在第一基板上，并且以使弹性结构保留在第一基板上的方式分离第二基板。

6. 发明授权

US07376310B2 Optical waveguide element with controlled birefringence 失效
标题翻译：具有受控双折射的光波导元件
公开(公告)号：US07376310B2
公开(公告)日：2008-05-20
申请号：US10736141
申请日：2003-12-15
申请人： Dorothea Wiesmann , Bert Offrein
发明人： Dorothea Wiesmann , Bert Offrein
IPC分类号： G02B6/26 , G02B6/42
CPC分类号： G02F1/3136 , G02F1/0147
摘要： An optical waveguide element having a cladding layer formed on a substrate and at least one waveguide core formed in the cladding layer for transmitting an optical signal. Two heater sections are provided for shifting a phase of optical signals. The two heater sections show different design. This helps controlling heater induced birefringence.
摘要翻译：一种光波导元件，其具有形成在基板上的包层和形成在所述包层中的用于透射光信号的至少一个波导芯。提供两个加热器部分用于移动光信号的相位。两个加热器部分显示不同的设计。这有助于控制加热器引起的双折射。

7. 发明申请

US20070147729A1 OPTO-ELECTRONIC BOARD 有权
标题翻译： OPTO电子板
公开(公告)号：US20070147729A1
公开(公告)日：2007-06-28
申请号：US11615838
申请日：2006-12-22
申请人： Laurent Dellmann , Michel Despont , Bert Offrein , David Webb
发明人： Laurent Dellmann , Michel Despont , Bert Offrein , David Webb
IPC分类号： G02B6/12
CPC分类号： G02B6/4232 , G02B6/4249 , H05K1/0274 , H05K1/184 , H05K2201/10121
摘要： An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
摘要翻译：一种光电板，包括具有光波导，金属区域和孔的印刷线路板，其中所述光波导的抵接面和所述金属区域的抵接面形成所述孔的侧面的一部分。光电板还包括具有接合焊盘的光电子电路，其中光电子电路布置在孔中并用其焊盘焊接到金属区域的邻接面。

8. 发明授权

US06768857B2 Method for manufacturing an optical device with a defined total device stress 失效
标题翻译：具有规定的总装置应力的光学装置的制造方法
公开(公告)号：US06768857B2
公开(公告)日：2004-07-27
申请号：US10141665
申请日：2002-05-07
申请人： Gian-Luca Bona , Roland Germann , Ingmar Meijer , Bert Offrein , Huub L Salemink , Dorothea W Wiesmann
发明人： Gian-Luca Bona , Roland Germann , Ingmar Meijer , Bert Offrein , Huub L Salemink , Dorothea W Wiesmann
IPC分类号： G02B610
CPC分类号： G02B6/132 , G02B6/105 , G02B2006/12169
摘要： A method for manufacturing an optical device with a defined total device stress, birefringence and optical polarization dependence is disclosed. The method comprises first providing a tower cladding layer of an amorphous material with a first refractive index and then providing above the lower cladding layer an upper cladding layer of an amorphous material with a second refractive index. An optical waveguide core comprising an amorphous material having a third refractive index (larger than the first refractive index and the second refractive index) is provided between the lower and the upper cladding layers. The upper cladding layer is thermally annealed by keeping the upper cladding layer at a first temperature, then raising the temperature to a second temperature, maintaining the second temperature for an annealing time period, and lowering the temperature to a third temperature, after which the temperature is lowered to a fourth temperature.
摘要翻译：公开了一种制造具有规定的总装置应力，双折射和光学偏振依赖性的光学装置的方法。该方法包括首先提供具有第一折射率的非晶材料的塔包层，然后在下包层上方提供具有第二折射率的非晶材料的上包层。包括具有第三折射率（大于第一折射率和第二折射率）的非晶材料的光波导芯设置在下包层和上包层之间。通过将上部包层保持在第一温度而将上部包层热退火，然后将温度升高到第二温度，将第二温度保持退火时间，并将温度降低到第三温度，之后温度降至第四温度。

9. 发明申请

US20080069494A1 ELECTRO-OPTICAL MODULE COMPRISING FLEXIBLE CONNECTION CABLE AND METHOD OF MAKING THE SAME 有权
标题翻译：包含柔性连接电缆的电光模块及其制造方法
公开(公告)号：US20080069494A1
公开(公告)日：2008-03-20
申请号：US11861766
申请日：2007-09-26
申请人： Stefano Oggioni , Bert Offrein
发明人： Stefano Oggioni , Bert Offrein
IPC分类号： G02B6/12
CPC分类号： H05K1/147 , G02B6/43 , H05K1/0274 , H05K1/141 , H05K3/0061 , H05K3/0067 , H05K2201/0108 , H05K2201/044 , H05K2201/048 , H05K2201/09127 , H05K2201/2009
摘要： An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be broken along a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.
摘要翻译：公开了一种包括柔性连接电缆和对准能力的电光模块。电光器件可以焊接在诸如玻璃的透明衬底或包括其中导电迹线被设计的光波导的衬底上，形成电光模块。当将这种电光模块插入并对准印刷电路板时，包括导电迹线和焊盘（称为柔性电缆）的基板的外部部分朝向PCB的安装平面向下弯曲，允许建立这些焊盘和PCB之间的电气连接。衬底可以沿着预先形成的凹槽断裂，并且衬底的外部部分可被移除，使得柔性电缆部分到位。

10. 发明申请

US20060267176A1 Method of assembling electronic components of an electronic system, and system thus obtained 失效
标题翻译：电子系统的电子部件的组装方法以及由此获得的系统
公开(公告)号：US20060267176A1
公开(公告)日：2006-11-30
申请号：US11416757
申请日：2006-05-03
申请人： Bert Offrein , Stefano Oggioni , Mauro Spreafico
发明人： Bert Offrein , Stefano Oggioni , Mauro Spreafico
IPC分类号： H01L23/52
CPC分类号： H01L23/66 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/522 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/86 , H01L25/0655 , H01L25/167 , H01L2224/0401 , H01L2224/05553 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/81143 , H01L2224/81203 , H01L2224/81205 , H01L2224/81224 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12043 , H01L2924/14 , H01L2924/1433 , H01L2924/15173 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/222 , H05K3/3436 , H05K2201/045 , H05K2201/10121 , H05K2201/1053 , H05K2201/10674 , Y10T29/49144 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.
摘要翻译：一种电子系统，包括：用于附接所述电子系统的部件的电子系统支撑基板，所述电子系统支撑基板包括用于在所述系统部件之间传播电信号的电信号传播路径; 至少第一和第二电子部件，其中至少所述第一电子部件是与所述电子系统支撑基板机械和电连接的模块的一部分，所述模块包括模块基板，所述第一电子部件至少机械连接到所述模块基板以及第一和第二电子部件之间的电耦合，用于电耦合，允许第一和第二电子部件交换电信号。电耦合包括在第一和第二电子部件之间特别由柔性电互连部件形成的直接电连接，电连接独立于电子系统支撑基板。

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