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    • 5. 发明申请
    • THREE-DIMENSIONAL STACKED OPTICAL DEVICE
    • 三维堆叠光学器件
    • US20090245721A1
    • 2009-10-01
    • US12352055
    • 2009-01-12
    • Laurent DellmannMichel DespontBert J. Offrein
    • Laurent DellmannMichel DespontBert J. Offrein
    • G02B6/12
    • H01L25/167H01L2224/18H01L2924/0002H01S5/02248H01S5/02288H04B10/801H05K1/186H01L2924/00
    • A three-dimensional stacked optical device includes a transparent substrate having at least one interconnect member, and an optical device mounted to the at least one interconnect member on the transparent substrate. The optical device includes a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion. An insulating layer encapsulates the optical device. The insulating layer includes a first surface that extends to a second surface. The first surface abuts the transparent substrate. A communication path extends between the first surface of the optical device and the second surface of the insulating layer. An electronic chip is mounted to the second surface of the insulating layer. The electronic chip includes a first surface and a second surface. The first surface is coupled to the communication path so as to form the three-dimensional stacked optical device.
    • 三维层叠光学器件包括具有至少一个互连构件的透明衬底和安装在透明衬底上的至少一个互连构件的光学器件。 光学装置包括耦合到至少一个互连构件的第一表面,其通过中间部分延伸到第二表面。 绝缘层封装光学器件。 绝缘层包括延伸到第二表面的第一表面。 第一表面邻接透明基底。 通信路径在光学器件的第一表面和绝缘层的第二表面之间延伸。 电子芯片安装在绝缘层的第二表面上。 电子芯片包括第一表面和第二表面。 第一表面耦合到通信路径,以形成三维堆叠光学装置。
    • 8. 发明授权
    • Method of forming a three-dimensional stacked optical device
    • 形成三维堆叠光学器件的方法
    • US07480426B1
    • 2009-01-20
    • US12054754
    • 2008-03-25
    • Laurent DellmannMichel DespontBert J. Offrein
    • Laurent DellmannMichel DespontBert J. Offrein
    • G02B6/12
    • H01L25/167H01L23/481H01L2924/0002H01L2924/00
    • A method of forming a three-dimensional stacked optical device includes mounting at least one optical device to a transparent substrate, fabricating a plurality of vias though the at least one optical device, and filling the plurality of vias with a conductive material member that forms a plurality of backside contacts on the at least one optical device. The method further requires mounting an electronic chip to the plurality of backside contacts on the at least one optical device, fabricating a plurality of vias in the electronic chip, filling each of the plurality of vias in the electronic chip with a another conductive material member, and depositing a backside contact at each of the plurality of vias formed in the electronic chip. Each backside contact is electrically connected to corresponding ones of the another conductive material member positioned in respective ones of the plurality of vias formed in the electronic chip.
    • 一种形成三维层叠光学器件的方法包括:将至少一个光学器件安装到透明衬底上,通过所述至少一个光学器件制造多个通孔,以及用导电材料部件填充多个通孔,所述导电材料部件形成 在所述至少一个光学装置上的多个背面触点。 该方法还需要将电子芯片安装到至少一个光学器件上的多个背面触点中,在电子芯片中制造多个通孔,用另一个导电材料构件填充电子芯片中的多个通孔中的每一个, 以及在形成在电子芯片中的多个通孔中的每一个上沉积背面接触。 每个背面接触件电连接到位于形成在电子芯片中的多个通孔中的相应一个通孔中的另一个导电材料构件的相应的一个。