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1. 发明申请

US20120260496A1 METHODS FOR FABRICATING MAGNETIC TRANSDUCERS USING POST-DEPOSITION TILTING 有权
标题翻译：使用沉积后倾斜制造磁性传感器的方法
公开(公告)号：US20120260496A1
公开(公告)日：2012-10-18
申请号：US13532716
申请日：2012-06-25
申请人： Robert Glenn Biskeborn , Laurent Dellmann , Michel Despont , Philipp Herget , Pierre-Olivier Jubert
发明人： Robert Glenn Biskeborn , Laurent Dellmann , Michel Despont , Philipp Herget , Pierre-Olivier Jubert
IPC分类号： G11B5/127
CPC分类号： G11B5/00821 , G11B5/3163 , G11B5/3906 , H04R31/00 , Y10T29/49021 , Y10T29/49032 , Y10T29/49039 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048
摘要： In one general embodiment, a method is provided for fabricating magnetic structures using post-deposition tilting. A thin film magnetic transducer structure is formed on a substantially planar portion of a substrate such that a plane of deposition of the thin film transducer structure is substantially parallel to a plane of the substrate. Additionally, the thin film transducer structure is caused to tilt at an angle relative to the plane of the substrate. The thin film transducer is fixed at the angle after being tilted.
摘要翻译：在一个一般实施例中，提供了一种使用后沉积倾斜来制造磁性结构的方法。薄膜换能器结构形成在基板的基本上平面的部分上，使得薄膜换能器结构的沉积平面基本上平行于基板的平面。此外，使薄膜换能器结构相对于基板的平面成一定角度倾斜。薄膜换能器在倾斜后固定成角度。

2. 发明授权

US08240024B2 Methods for fabricating magnetic transducers using post-deposition tilting 有权
标题翻译：使用后沉积倾斜制造磁换能器的方法
公开(公告)号：US08240024B2
公开(公告)日：2012-08-14
申请号：US12547224
申请日：2009-08-25
申请人： Robert Glenn Biskeborn , Laurent Dellmann , Michel Despont , Philipp Herget , Pierre-Olivier Jubert
发明人： Robert Glenn Biskeborn , Laurent Dellmann , Michel Despont , Philipp Herget , Pierre-Olivier Jubert
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/00821 , G11B5/3163 , G11B5/3906 , H04R31/00 , Y10T29/49021 , Y10T29/49032 , Y10T29/49039 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048
摘要： In one general embodiment, a method for fabricating magnetic structures using post-deposition tilting includes forming a thin film magnetic transducer structure on a substantially planar portion of a substrate such that a plane of deposition of the thin film transducer structure is substantially parallel to a plane of the substrate. Additionally, the thin film transducer structure is caused to tilt at an angle relative to the plane of the substrate. The thin film transducer is fixed at the angle after being tilted.
摘要翻译：在一个一般实施例中，使用后沉积倾斜制造磁性结构的方法包括在基板的基本上平面的部分上形成薄膜磁换能器结构，使得薄膜换能器结构的沉积平面基本上平行于平面的基底。此外，使薄膜换能器结构相对于基板的平面成一定角度倾斜。薄膜换能器在倾斜后固定成角度。

3. 发明授权

US08286345B2 Method for attaching a flexible structure to a device 失效
标题翻译：将柔性结构附接到设备的方法
公开(公告)号：US08286345B2
公开(公告)日：2012-10-16
申请号：US12416620
申请日：2009-04-01
申请人： Roger Dangel , Laurent Dellmann , Michel Despont , Bert Jan Offrein , Stefano Sergio Oggioni
发明人： Roger Dangel , Laurent Dellmann , Michel Despont , Bert Jan Offrein , Stefano Sergio Oggioni
IPC分类号： H01R43/00 , H05K13/00
CPC分类号： H05K1/0393 , B81C3/008 , G02B6/43 , H01L27/14618 , H01L2924/0002 , H05K1/189 , H05K3/4691 , H05K2201/0108 , H05K2203/308 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49171 , H01L2924/00
摘要： Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
摘要翻译：用于生产连接到装置的柔性结构的技术。一个实施例包括以下步骤：提供第一基板，为第二基板提供可释放地附接的柔性结构，在第一基板和柔性结构中的至少一个上提供接合层，邻接第一和第二基板，使得柔性结构通过结合层附着在第一基板上，并且以使弹性结构保留在第一基板上的方式分离第二基板。

4. 发明申请

US20090245722A1 THREE-DIMENSIONAL STACKED OPTICAL DEVICE 审中-公开
标题翻译：三维堆叠光学器件
公开(公告)号：US20090245722A1
公开(公告)日：2009-10-01
申请号：US12355081
申请日：2009-01-16
申请人： Laurent Dellmann , Michel Despont , Bert J. Offrein
发明人： Laurent Dellmann , Michel Despont , Bert J. Offrein
IPC分类号： G02B6/12
CPC分类号： H01L25/167 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A three-dimensional stacked optical device includes a transparent substrate, and an optical device having a main body mounted to the transparent substrate. The optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias to form backside contacts. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip.
摘要翻译：三维层叠光学器件包括透明衬底和安装在透明衬底上的主体的光学器件。光学器件包括延伸到主体中并且不延伸到透明衬底中的多个通孔。导电构件设置在多个通孔中的每一个中以形成背侧触点。包括多个通孔的电子芯片安装在光学器件上的背面触点上。在电子芯片中形成的多个通孔中的每一个中沉积另一导电构件。另一导电构件在电子芯片上形成附加的背面接触。

5. 发明申请

US20090245721A1 THREE-DIMENSIONAL STACKED OPTICAL DEVICE 审中-公开
标题翻译：三维堆叠光学器件
公开(公告)号：US20090245721A1
公开(公告)日：2009-10-01
申请号：US12352055
申请日：2009-01-12
申请人： Laurent Dellmann , Michel Despont , Bert J. Offrein
发明人： Laurent Dellmann , Michel Despont , Bert J. Offrein
IPC分类号： G02B6/12
CPC分类号： H01L25/167 , H01L2224/18 , H01L2924/0002 , H01S5/02248 , H01S5/02288 , H04B10/801 , H05K1/186 , H01L2924/00
摘要： A three-dimensional stacked optical device includes a transparent substrate having at least one interconnect member, and an optical device mounted to the at least one interconnect member on the transparent substrate. The optical device includes a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion. An insulating layer encapsulates the optical device. The insulating layer includes a first surface that extends to a second surface. The first surface abuts the transparent substrate. A communication path extends between the first surface of the optical device and the second surface of the insulating layer. An electronic chip is mounted to the second surface of the insulating layer. The electronic chip includes a first surface and a second surface. The first surface is coupled to the communication path so as to form the three-dimensional stacked optical device.
摘要翻译：三维层叠光学器件包括具有至少一个互连构件的透明衬底和安装在透明衬底上的至少一个互连构件的光学器件。光学装置包括耦合到至少一个互连构件的第一表面，其通过中间部分延伸到第二表面。绝缘层封装光学器件。绝缘层包括延伸到第二表面的第一表面。第一表面邻接透明基底。通信路径在光学器件的第一表面和绝缘层的第二表面之间延伸。电子芯片安装在绝缘层的第二表面上。电子芯片包括第一表面和第二表面。第一表面耦合到通信路径，以形成三维堆叠光学装置。

6. 发明申请

US20090188108A1 METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE 失效
标题翻译：将柔性结构连接到装置的方法和具有柔性结构的装置
公开(公告)号：US20090188108A1
公开(公告)日：2009-07-30
申请号：US12416620
申请日：2009-04-01
申请人： Roger Dangel , Laurent Dellmann , Michel Despont , Bert Jan Offrein , Stefano Sergio Oggioni
发明人： Roger Dangel , Laurent Dellmann , Michel Despont , Bert Jan Offrein , Stefano Sergio Oggioni
IPC分类号： H01R9/00
CPC分类号： H05K1/0393 , B81C3/008 , G02B6/43 , H01L27/14618 , H01L2924/0002 , H05K1/189 , H05K3/4691 , H05K2201/0108 , H05K2203/308 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49171 , H01L2924/00
摘要： Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
摘要翻译：用于生产连接到装置的柔性结构的技术。一个实施例包括以下步骤：提供第一基板，为第二基板提供可释放地附接的柔性结构，在第一基板和柔性结构中的至少一个上提供接合层，邻接第一和第二基板，使得柔性结构通过结合层附着在第一基板上，并且以使弹性结构保留在第一基板上的方式分离第二基板。

7. 发明授权

US09230564B2 Methods for fabricating magnetic transducers using post-deposition tilting 有权
标题翻译：使用后沉积倾斜制造磁换能器的方法
公开(公告)号：US09230564B2
公开(公告)日：2016-01-05
申请号：US13532716
申请日：2012-06-25
申请人： Robert Glenn Biskeborn , Laurent Dellmann , Michel Despont , Philipp Herget , Pierre-Olivier Jubert
发明人： Robert Glenn Biskeborn , Laurent Dellmann , Michel Despont , Philipp Herget , Pierre-Olivier Jubert
IPC分类号： G11B5/127 , H04R31/00 , G11B5/008 , G11B5/31 , G11B5/39
CPC分类号： G11B5/00821 , G11B5/3163 , G11B5/3906 , H04R31/00 , Y10T29/49021 , Y10T29/49032 , Y10T29/49039 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048
摘要： In one general embodiment, a method is provided for fabricating magnetic structures using post-deposition tilting. A thin film magnetic transducer structure is formed on a substantially planar portion of a substrate such that a plane of deposition of the thin film transducer structure is substantially parallel to a plane of the substrate. Additionally, the thin film transducer structure is caused to tilt at an angle relative to the plane of the substrate. The thin film transducer is fixed at the angle after being tilted.
摘要翻译：在一个一般实施例中，提供了一种使用后沉积倾斜来制造磁性结构的方法。薄膜换能器结构形成在基板的基本上平面的部分上，使得薄膜换能器结构的沉积平面基本上平行于基板的平面。此外，使薄膜换能器结构相对于基板的平面成一定角度倾斜。薄膜换能器在倾斜后固定成角度。

8. 发明授权

US07480426B1 Method of forming a three-dimensional stacked optical device 有权
标题翻译：形成三维堆叠光学器件的方法
公开(公告)号：US07480426B1
公开(公告)日：2009-01-20
申请号：US12054754
申请日：2008-03-25
申请人： Laurent Dellmann , Michel Despont , Bert J. Offrein
发明人： Laurent Dellmann , Michel Despont , Bert J. Offrein
IPC分类号： G02B6/12
CPC分类号： H01L25/167 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a three-dimensional stacked optical device includes mounting at least one optical device to a transparent substrate, fabricating a plurality of vias though the at least one optical device, and filling the plurality of vias with a conductive material member that forms a plurality of backside contacts on the at least one optical device. The method further requires mounting an electronic chip to the plurality of backside contacts on the at least one optical device, fabricating a plurality of vias in the electronic chip, filling each of the plurality of vias in the electronic chip with a another conductive material member, and depositing a backside contact at each of the plurality of vias formed in the electronic chip. Each backside contact is electrically connected to corresponding ones of the another conductive material member positioned in respective ones of the plurality of vias formed in the electronic chip.
摘要翻译：一种形成三维层叠光学器件的方法包括：将至少一个光学器件安装到透明衬底上，通过所述至少一个光学器件制造多个通孔，以及用导电材料部件填充多个通孔，所述导电材料部件形成在所述至少一个光学装置上的多个背面触点。该方法还需要将电子芯片安装到至少一个光学器件上的多个背面触点中，在电子芯片中制造多个通孔，用另一个导电材料构件填充电子芯片中的多个通孔中的每一个，以及在形成在电子芯片中的多个通孔中的每一个上沉积背面接触。每个背面接触件电连接到位于形成在电子芯片中的多个通孔中的相应一个通孔中的另一个导电材料构件的相应的一个。

9. 发明申请

US20070147729A1 OPTO-ELECTRONIC BOARD 有权
标题翻译： OPTO电子板
公开(公告)号：US20070147729A1
公开(公告)日：2007-06-28
申请号：US11615838
申请日：2006-12-22
申请人： Laurent Dellmann , Michel Despont , Bert Offrein , David Webb
发明人： Laurent Dellmann , Michel Despont , Bert Offrein , David Webb
IPC分类号： G02B6/12
CPC分类号： G02B6/4232 , G02B6/4249 , H05K1/0274 , H05K1/184 , H05K2201/10121
摘要： An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
摘要翻译：一种光电板，包括具有光波导，金属区域和孔的印刷线路板，其中所述光波导的抵接面和所述金属区域的抵接面形成所述孔的侧面的一部分。光电板还包括具有接合焊盘的光电子电路，其中光电子电路布置在孔中并用其焊盘焊接到金属区域的邻接面。

10. 发明授权

US08355259B2 Demountable dry connection for flexible circuits to circuit boards 失效
标题翻译：可拆卸的干式连接，用于柔性电路到电路板
公开(公告)号：US08355259B2
公开(公告)日：2013-01-15
申请号：US12631696
申请日：2009-12-04
申请人： Christoph Berger , Laurent Dellmann , Stefano S. Oggioni
发明人： Christoph Berger , Laurent Dellmann , Stefano S. Oggioni
IPC分类号： H05K1/00
CPC分类号： H05K3/365 , G02B6/4201 , G02B6/424 , G02B6/4257 , G02B6/426 , G02B6/4266 , G02B6/4267 , G02B6/4278 , G02B6/4281 , G02B6/4283 , H05K1/0274 , H05K1/116 , H05K1/118 , H05K1/147 , H05K3/244 , H05K3/325 , H05K3/4007 , H05K2201/09381 , H05K2201/09481 , H05K2201/09736 , H05K2201/10121 , H05K2203/167 , Y10T29/4913
摘要： Substrates are connected by demountable coupling by connecting an electronic module to a substrate. An electronic module and a substrate carrying electrical and/or optical circuits are provided. A connector electrical circuit is connected between the substrate and the electronic module. The connector electrical circuit is electrically demountable dry connected to the electronic module.
摘要翻译：通过将电子模块连接到基板，通过可拆卸的联接来连接基板。提供了一种电子模块和承载电路和/或光学电路的基板。连接器电路连接在基板和电子模块之间。连接器电路可电连接到电子模块。

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