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81. 发明授权

US5001542A Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips 失效
标题翻译：用于电路连接的组合，使用其的连接方法以及半导体芯片的连接结构
公开(公告)号：US5001542A
公开(公告)日：1991-03-19
申请号：US443169
申请日：1989-11-30
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
IPC分类号： H01R4/04 , C09J163/00 , G06K19/077 , H01B1/00 , H01B1/20 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/482 , H01L23/498 , H05K3/32
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L23/49883 , H01L24/05 , H01L24/29 , H05K3/323 , H01L2224/0401 , H01L2224/05571 , H01L2224/274 , H01L2224/2919 , H01L2224/29339 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/82365 , H01L2224/83101 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/0106 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/15151 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321
摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

82. 发明授权

US4960490A Method of making multiple-connector adhesive tape 失效
标题翻译：制造多连接胶带的方法
公开(公告)号：US4960490A
公开(公告)日：1990-10-02
申请号：US258615
申请日：1988-10-17
申请人： James G. Berg , Robert S. Reylek
发明人： James G. Berg , Robert S. Reylek
IPC分类号： H01R4/04 , H01R12/52 , H05K1/00 , H05K3/06 , H05K3/10 , H05K3/30 , H05K3/32 , H05K3/36
CPC分类号： H05K3/361 , H01R12/52 , H05K3/323 , H01R4/04 , H05K1/0393 , H05K2201/0245 , H05K2201/0367 , H05K2201/10977 , H05K2203/0522 , H05K2203/0571 , H05K2203/066 , H05K2203/1189 , H05K3/061 , H05K3/102 , H05K3/305 , H05K3/321
摘要： Multiple-connector tape has a flexible backing carrying a pattern of longitudinally electrically conductive stripes, each having an overlying adhesive band, each edge of which precisely follows an edge of the underlying conductive stripe. The adhesive bands may contain silver particles having thicknesses exceeding that of the adhesive between particles so that the terminals of an electrical device can be electrically connected through the particles to the longitudinally conductive stripes when the tape is adhered by its adhesive to the device. Electrical connections can be made in the absence of such particles when the stripes are metal foil having embossings which protrude through the adhesive.
摘要翻译：多连接器带具有柔性背衬，其承载纵向导电条纹的图案，每个带有上覆的粘合带，其每个边缘精确地跟随下面的导电条的边缘。粘合带可以含有厚度超过颗粒之间的粘合剂厚度的银颗粒，使得当带通过其粘合剂粘附到装置上时，电气装置的端子可以通过颗粒电连接到纵向导电条。当条纹是具有通过粘合剂突出的压花的金属箔时，可以在没有这种颗粒的情况下进行电连接。

83. 发明授权

US4860754A Electrically conductive adhesive materials 失效
标题翻译：导电胶粘材料
公开(公告)号：US4860754A
公开(公告)日：1989-08-29
申请号：US294970
申请日：1989-01-03
申请人： Clyde L. Sharik , Anthony J. Berejka
发明人： Clyde L. Sharik , Anthony J. Berejka
IPC分类号： C08L39/06 , A61B5/0408 , C08L39/00 , C08L71/02 , C09J9/02 , C09J11/06 , C09J129/04 , C09J137/00 , C09J139/06 , C09J201/00 , H01B1/12 , H01B1/20 , H01R4/04
CPC分类号： H01B1/122 , A61B5/04087 , C09J201/00
摘要： Electrically conductive adhesive material possessing good adhesive, cohesive, elastomeric and conductive properties is disclosed. The present adhesive material also has improved electrical stability since it is less susceptible to drying out in most ambients. The material comprises a plasticizer, a high molecular weight water-soluble polymer, uncrosslinked polyvinylpyrrolidone as the tackifier, and an electrolyte dopant.

84. 发明授权

US4752499A Adhesive for electroless plating and method of preparation of circuit board using this adhesive 失效
标题翻译：用于化学镀的粘合剂和使用该粘合剂制备电路板的方法
公开(公告)号：US4752499A
公开(公告)日：1988-06-21
申请号：US860886
申请日：1986-05-08
申请人： Ryo Enomoto
发明人： Ryo Enomoto
IPC分类号： C23C18/20 , H01R4/02 , H01R4/04 , H05K3/18 , H05K3/38 , B05D5/12 , B05D3/04
CPC分类号： H01R4/04 , C23C18/2013 , C23C18/2033 , C23C18/2086 , C23C18/26 , C23C18/30 , H05K3/387 , H01R4/02 , H05K2201/0212 , H05K2203/0773 , H05K3/181
摘要： An adhesive for electroless plating is composed of at least one kind of fine powders selected from either a cured heat resistant resin or an inorganic material and easily soluble in a predetermined solution and a heat resistant resin solution sparingly soluble in the predetermined solution by curing treatment. The adhesive for electroless plating in which the above fine powders are dispersed in the above uncured heat resistant resin solution, is coated on a circuit board, dried and cured to form an adhesive layer. When the above predetermined solution contacts with the surface of the adhesive layer, its surface is roughed to be formed a plating film having an excellent adhesiveness by electroless plating.
摘要翻译：用于化学镀的粘合剂由选自固化的耐热树脂或无机材料中的至少一种细粉末组成，并且易于溶解在预定溶液中，以及通过固化处理微溶于预定溶液中的耐热树脂溶液。将上述细粉末分散在上述未固化的耐热性树脂溶液中的无电解电镀用粘合剂涂布在电路基板上，干燥固化，形成粘接层。当上述预定溶液与粘合剂层的表面接触时，其表面被粗糙化，以形成具有通过无电镀的优异粘合性的镀膜。

85. 发明授权

US4695404A Hyperconductive filled polymers 失效
标题翻译：超导填充聚合物
公开(公告)号：US4695404A
公开(公告)日：1987-09-22
申请号：US848783
申请日：1986-04-07
申请人： Chung T. Kwong
发明人： Chung T. Kwong
IPC分类号： H01B1/22 , H01R4/04 , H02G15/105 , H05K1/09 , H05K3/32 , H01B1/02
CPC分类号： H01R4/04 , H01B1/22 , H02G15/105 , H05K1/095 , H05K3/321 , Y02E40/648
摘要： This invention is directed to a polymeric composition comprising a polymeric binder and silver particles and having a volume electrical resistivity of 0.0001 ohm-cm or less.
摘要翻译：本发明涉及包含聚合物粘合剂和银颗粒并且具有0.0001欧姆 - 厘米或更小的体积电阻率的聚合物组合物。

86. 发明授权

US4667401A Method of making an electronic device using an uniaxial conductive adhesive 失效
标题翻译：使用单轴导电粘合剂制造电子装置的方法
公开(公告)号：US4667401A
公开(公告)日：1987-05-26
申请号：US801745
申请日：1985-11-26
申请人： James R. Clements , Terry T. J. Yu , Laura H. C. Yu
发明人： James R. Clements , Terry T. J. Yu , Laura H. C. Yu
IPC分类号： H01R4/04 , H05K1/18 , H05K3/28 , H05K3/32 , H05K3/30
CPC分类号： H01R4/04 , H05K3/323 , H05K1/181 , H05K2201/10166 , H05K2203/0278 , H05K3/284 , Y10T29/4913 , Y10T29/49144
摘要： An electronic device made by the method of connecting a circuit member (18) to a substrate (12) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning conductive terminals (20) of the circuit member (18) over preselected ones of conductive paths (16) of the substrate (12). The percent by weight content of the conductive metal particles in the adhesive (22) is concentrated between each conductive terminal (20) and the vertically aligned conductive paths (16) to between forty to fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin uniaxially conductive vertically between the conductive terminal (20) and conductive bath (16).
摘要翻译：一种通过将电路部件（18）连接到基板（12）的方法制造的电子装置，其中所述方法包括以下步骤：施加包含具有导体的二十五至五十五重量％的树脂的粘合剂（22）金属颗粒位于衬底（12）的安装表面（14）上，其中树脂是介于其间的隔开的金属颗粒之间的电介质，并且将电路构件（18）安装在粘合剂（22）上，同时垂直对准导电端子）超过衬底（12）的预选的导电路径（16）的电路构件（18）。粘合剂（22）中的导电金属颗粒的重量含量在每个导电端子（20）和垂直排列的导电路径（16）之间被集中在40至50重量％之间，以减小金属颗粒之间的间隔允许导电性通过树脂，并使树脂在导电端子（20）和导电槽（16）之间垂直单轴导电。

87. 发明授权

US4663079A Copper-type conductive coating composition 失效
标题翻译：铜型导电涂料组合物
公开(公告)号：US4663079A
公开(公告)日：1987-05-05
申请号：US749463
申请日：1985-06-27
申请人： Shoji Yamaguchi , Kimiko Yamada
发明人： Shoji Yamaguchi , Kimiko Yamada
IPC分类号： C08K5/3472 , C08K5/5398 , C09D5/24 , H01B1/22 , H01R4/04 , H05K1/09 , H05K3/32
CPC分类号： H01B1/22 , C08K5/3472 , C08K5/5398 , C09D5/24 , H01R4/04 , H05K1/095 , H05K3/321
摘要： A copper-type conductive coating composition which comprises:(A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with its oxidized surface layer removed by treatment with an organic carboxylic acid,(B) a coating binder resin, and(C) an antioxidant selected from triazoles represented by the formula: ##STR1## wherein Y is a hydroxyl group, a hydrogen atom, a C.sub.1 -C.sub.18 alkyl group or a halogen atom, and a is an integer of 1 to 3, and trithiophosphites represented by the formula: ##STR2## wherein each of R.sub.1 to R.sub.3 is a C.sub.1 -C.sub.30 alkyl group or an allyl group.
摘要翻译：一种铜型导电涂料组合物，其包含：（A）氢损失最多为0.2重量％的铜粉末或通过用有机羧酸处理除去氧化表面层的铜粉末，（B）涂料粘合剂树脂，和（C）选自由下式表示的三唑的抗氧化剂：其中Y是羟基，氢原子，C1-C18烷基或卤素原子，和a是 1至3，和由下式表示的三硫代亚磷酸酯：其中R 1至R 3各自为C 1 -C 30烷基或烯丙基。

88. 发明授权

US4643843A Preparation for improving the reliability of electrical connections 失效
标题翻译：准备提高电气连接的可靠性
公开(公告)号：US4643843A
公开(公告)日：1987-02-17
申请号：US848928
申请日：1986-04-07
申请人： Harold L. Lowdon
发明人： Harold L. Lowdon
IPC分类号： H01R4/04 , H01B1/06
CPC分类号： H01R4/04
摘要： In order to maintain the long term reliability of an electrical connection subjected to difficult environmental conditions, such as in the engine compartment of a motor vehicle, a paste-like preparation is provided for application at the conductively mating surfaces of the connection. A first embodiment of the preparation includes water, glycerin, a thixotropic agent and a hydrophilic substance, such as calcium chloride or lithium chloride, exhibiting sufficient hydrophilic action and in sufficient quantity as to maintain the preparation in a fluid state by absorbing moisture from the ambient atmosphere. Variants of the preparation include, as one or more additional ingredients, acetic acid and/or powdered graphite or metallic powder or flakes of high conductivity such as copper, aluminum or silver. A second and presently preferred embodiment of the preparation includes detergent, ethylene glycol, fine sand and powdered graphite in conjunction with a high concentration of calcium chloride or lithium chloride.
摘要翻译：为了保持在困难的环境条件下的电气连接的长期可靠性，例如在机动车辆的发动机舱中，提供糊状制剂用于连接的导电配合表面。该制剂的第一个实施方案包括水，甘油，触变剂和亲水性物质，例如氯化钙或氯化锂，表现出足够的亲水作用，并且足够的量，以通过从环境中吸收水分将制剂保持在流体状态大气层。制剂的变体包括作为一种或多种另外的成分的乙酸和/或粉状石墨或高导电性的金属粉末或薄片，例如铜，铝或银。制剂的第二个和目前优选的实施方案包括洗涤剂，乙二醇，细砂和粉末状石墨以及高浓度的氯化钙或氯化锂。

89. 发明授权

US4568602A Sheet material adapted to provide long-lived stable adhesive-bonded electrical connections 失效
标题翻译：适用于提供长寿命稳定的粘合剂电连接的片材
公开(公告)号：US4568602A
公开(公告)日：1986-02-04
申请号：US637147
申请日：1984-08-02
申请人： Robert H. Stow
发明人： Robert H. Stow
IPC分类号： H01R4/04 , H05K3/30 , H05K3/32 , H05K3/36 , B32B3/00
CPC分类号： H05K3/361 , H01R4/04 , H05K2201/10977 , H05K2203/1189 , H05K3/305 , H05K3/321 , Y10T428/24612 , Y10T428/24843 , Y10T428/24893 , Y10T428/24959 , Y10T428/28 , Y10T428/2817 , Y10T428/2826 , Y10T428/2887 , Y10T428/2891
摘要： Sheet material useful for making bonded electrical connections, especially to sets of small side-by-side terminal pads. In one typical form, the sheet material is an elongated tape comprising an elongated insulating backing; a plurality of narrow spaced parallel elongated electrically conductive stripes on the backing; and electrically conductive adhesive disposed over the stripes comprising a layer of adhesive material in which are contained a monolayer of electrically conductive elements which are thinner than the adhesive layer. The surface of the adhesive layer that contacts a substrate is configured so that at least a portion of the area of the surface is recessed below other areas of the surface, whereby when the adhesive layer is heated and pressed against a substrate, adhesive material may be displaced into the recessed areas and allow the electrically conductive elements to be brought into close electrical association with the substrate.
摘要翻译：用于制造粘合电连接的板材，特别是小型并排端子焊盘的组合。在一种典型形式中，片材是包括细长绝缘背衬的细长带; 背衬上的多个窄间隔的平行细长的导电条纹; 以及设置在条纹之上的导电粘合剂，其包含粘合剂材料层，其中包含比粘合剂层更薄的单层导电元件。与基板接触的粘合剂层的表面被构造成使得表面的至少一部分区域在表面的其它区域下方凹入，由此当粘合剂层被加热并压靠在基底上时，粘合剂材料可以是移动到凹陷区域中并且允许导电元件与衬底紧密地电连接。

90. 发明授权

US4552607A Method of making electrically conductive thin epoxy bond 失效
标题翻译：制造导电性薄环氧键的方法
公开(公告)号：US4552607A
公开(公告)日：1985-11-12
申请号：US616630
申请日：1984-06-04
申请人： Gregg W. Frey
发明人： Gregg W. Frey
IPC分类号： H01R4/04 , B32B7/02 , B32B7/12 , B32B9/00 , B32B15/08 , B32B27/18 , C08J5/12 , C08K7/18 , C09J5/02 , H01B1/22 , H01B5/16 , H05K3/24 , H05K3/32 , H05K3/38 , H05K3/40 , C09J3/02
CPC分类号： H05K3/4007 , C08K7/18 , C09J5/02 , H01B1/22 , H05K3/323 , H05K2201/0317 , H05K2201/0367 , H05K2201/0373 , H05K2201/09754 , H05K2201/10234 , H05K2201/10977 , H05K3/244 , H05K3/388
摘要： The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds between two substrates. Copper microspheres, having an average diameter of about 2 microns are bound in an epoxy layer which bonds two substrates together. The microspheres make electrical contact between the substrates while providing intersphere gaps which are filled with the epoxy which actually bonds the substrates together.
摘要翻译：本发明是在两个基板之间产生极薄的导电环氧树脂结合体的方法和结构。平均直径约2微米的铜微球体结合在环氧树脂层中，将环氧树脂层结合在一起。微球体在基板之间进行电接触，同时提供填充有实际将基板粘合在一起的环氧树脂的间隙。

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