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1. 发明授权

US4868637A Electronic device including uniaxial conductive adhesive and method of making same 失效
标题翻译：包括单轴导电粘合剂的电子器件及其制造方法
公开(公告)号：US4868637A
公开(公告)日：1989-09-19
申请号：US105999
申请日：1987-10-05
申请人： James R. Clements , Terry T. J. Yu , Laura H. C. Yu
发明人： James R. Clements , Terry T. J. Yu , Laura H. C. Yu
IPC分类号： H01R4/04 , H05K1/18 , H05K3/28 , H05K3/32
CPC分类号： H05K3/323 , H01R4/04 , H05K1/181 , H05K2201/10166 , H05K2203/0278 , H05K3/28 , H05K3/284
摘要： An electronic device made by the method of connecting a circuit member (18) having a plurality of laterally spaced electrically conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16). The percent by weight content of the conductive metal particles in the adhesive (22) is concentrated between each conductive terminal (20) and the vertically aligned conductive paths (16) to between forty to fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin uniaxially conductive vertically aligned between the conductive terminal (20) and conductive path (16) while the resin unconcentrated adhesive (22) remains nonconductive between laterally spaced terminals (20) and conductive paths (16).
摘要翻译：一种电子装置，其通过将具有多个横向间隔开的导电端子（20）的电路构件（18）连接到基板（12）的方法制成，该基板包括具有多个横向间隔开的导电路径（16）的安装表面（14）），其中所述方法包括以下步骤：在具有导电路径的基板（12）的安装表面（14）上涂覆包含导电金属颗粒含量的二十至百分之二十五的树脂的粘合剂（22） 16），其中所述树脂是在其间隔开的金属颗粒之间的电介质阻止导电性，并且将电路构件（18）安装在粘合剂（22）上，同时使导电端子（20）超过预选的导电路径（16）。粘合剂（22）中的导电金属颗粒的重量含量在每个导电端子（20）和垂直排列的导电路径（16）之间被集中在40至50重量％之间，以减小金属颗粒之间的间隔允许导电性通过树脂，并使树脂在导电端子（20）和导电路径（16）之间垂直对准的树脂单轴导电，同时树脂未浓缩粘合剂（22）在横向间隔开的端子（20）和导电路径（16）之间保持不导电。

2. 发明授权

US4667401A Method of making an electronic device using an uniaxial conductive adhesive 失效
标题翻译：使用单轴导电粘合剂制造电子装置的方法
公开(公告)号：US4667401A
公开(公告)日：1987-05-26
申请号：US801745
申请日：1985-11-26
申请人： James R. Clements , Terry T. J. Yu , Laura H. C. Yu
发明人： James R. Clements , Terry T. J. Yu , Laura H. C. Yu
IPC分类号： H01R4/04 , H05K1/18 , H05K3/28 , H05K3/32 , H05K3/30
CPC分类号： H01R4/04 , H05K3/323 , H05K1/181 , H05K2201/10166 , H05K2203/0278 , H05K3/284 , Y10T29/4913 , Y10T29/49144
摘要： An electronic device made by the method of connecting a circuit member (18) to a substrate (12) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning conductive terminals (20) of the circuit member (18) over preselected ones of conductive paths (16) of the substrate (12). The percent by weight content of the conductive metal particles in the adhesive (22) is concentrated between each conductive terminal (20) and the vertically aligned conductive paths (16) to between forty to fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin uniaxially conductive vertically between the conductive terminal (20) and conductive bath (16).
摘要翻译：一种通过将电路部件（18）连接到基板（12）的方法制造的电子装置，其中所述方法包括以下步骤：施加包含具有导体的二十五至五十五重量％的树脂的粘合剂（22）金属颗粒位于衬底（12）的安装表面（14）上，其中树脂是介于其间的隔开的金属颗粒之间的电介质，并且将电路构件（18）安装在粘合剂（22）上，同时垂直对准导电端子）超过衬底（12）的预选的导电路径（16）的电路构件（18）。粘合剂（22）中的导电金属颗粒的重量含量在每个导电端子（20）和垂直排列的导电路径（16）之间被集中在40至50重量％之间，以减小金属颗粒之间的间隔允许导电性通过树脂，并使树脂在导电端子（20）和导电槽（16）之间垂直单轴导电。

3. 发明授权

US4720740A Electronic device including uniaxial conductive adhesive and method of making same 失效
标题翻译：包括单轴导电粘合剂的电子器件及其制造方法
公开(公告)号：US4720740A
公开(公告)日：1988-01-19
申请号：US943509
申请日：1986-12-19
申请人： James R. Clements , Terry T. J. Yu , Laura H. C. Yu
发明人： James R. Clements , Terry T. J. Yu , Laura H. C. Yu
IPC分类号： H01R4/04 , H05K1/18 , H05K3/28 , H05K3/32 , H01L23/28
CPC分类号： H01R4/04 , H05K3/323 , H05K1/181 , H05K2201/10166 , H05K2203/0278 , H05K3/28 , H05K3/284
摘要： An electronic device made by the method of connecting a circuit member (18) having a plurality of laterally spaced electrically conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16). The percent by weight content of the conductive metal particles in the adhesive (22) is concentrated between each conductive terminal (20) and the vertically aligned conductive paths (16) to between forty to fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin uniaxially conductive vertically aligned between the conductive terminal (20) and conductive path (16) while the resin unconcentrated adhesive (22) remains nonconductive between laterally spaced terminals (20) and conductive paths (16).
摘要翻译：一种电子装置，其通过将具有多个横向间隔开的导电端子（20）的电路构件（18）连接到基板（12）的方法制成，该基板包括具有多个横向间隔开的导电路径（16）的安装表面（14）），其中所述方法包括以下步骤：在具有导电路径的基板（12）的安装表面（14）上涂覆包含导电金属颗粒含量的二十至百分之二十五的树脂的粘合剂（22） 16），其中所述树脂是在其间隔开的金属颗粒之间的电介质阻止导电性，并且将电路构件（18）安装在粘合剂（22）上，同时使导电端子（20）超过预选的导电路径（16）。粘合剂（22）中的导电金属颗粒的重量含量在每个导电端子（20）和垂直排列的导电路径（16）之间被集中在40至50重量％之间，以减小金属颗粒之间的间隔允许导电性通过树脂，并使树脂在导电端子（20）和导电路径（16）之间垂直对准的树脂单轴导电，同时树脂未浓缩粘合剂（22）在横向间隔开的端子（20）和导电路径（16）之间保持不导电。

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