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81. 发明授权

US06881058B2 Apparatus for processing substrate and method of processing the same 失效
标题翻译：基板处理装置及其处理方法
公开(公告)号：US06881058B2
公开(公告)日：2005-04-19
申请号：US10026419
申请日：2001-12-26
申请人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
发明人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
IPC分类号： B05C5/02 , B05C9/14 , B05C11/08 , B05D1/40 , B05D3/02 , G03F7/16 , G03F7/20 , G03F7/30 , G03F7/38 , H01L21/00 , H01L21/027 , F27D7/06
CPC分类号： H01L21/6715 , B05C5/0254 , B05C11/08 , G03F7/168 , G03F7/3021 , G03F7/38 , G03F7/70358 , G03F7/70558 , H01L21/67109 , H01L21/67115
摘要： A heating apparatus for a substrate to be processed with a coating film has a chamber with an inner space, a heating plate heating the substrate to be processed in the inner space, and a partition member. The heating plate has a support surface which supports the substrate to be processed within the chamber. The partition member is arranged in the chamber so as to face the support surface. The partition member partitions the inner space into first and second spaces, and has a plurality of pores which allow the first and second spaces to communicate with each other. The support surface of the heating plate is set in the first space. An air stream formation mechanism forming an air stream is arranged in the second space. This mechanism discharges a substance evaporated from the photoresist film.
摘要翻译：用涂膜处理的基板的加热装置具有内部空间的室，在内部空间中加热被处理基板的加热板和分隔构件。加热板具有支撑表面，该支撑表面支撑在腔室内待处理的基底。分隔构件布置在腔室中以面向支撑表面。分隔构件将内部空间分隔成第一和第二空间，并且具有允许第一和第二空间彼此连通的多个孔。加热板的支撑表面设置在第一空间中。形成空气流的气流形成机构设置在第二空间中。该机理将从光致抗蚀剂膜蒸发的物质排出。

82. 发明授权

US06880131B1 Apparatus and method for selecting data sets 失效
标题翻译：用于选择数据集的装置和方法
公开(公告)号：US06880131B1
公开(公告)日：2005-04-12
申请号：US09515905
申请日：2000-02-29
申请人： Hiroki Nakazono , Shinichi Ito
发明人： Hiroki Nakazono , Shinichi Ito
IPC分类号： G06F3/048 , G06F3/00 , G06F3/033 , G06F12/00 , G09G5/00 , G10H1/18
CPC分类号： G06F3/0482 , Y10S707/99953 , Y10S707/99956
摘要： A storage medium stores a large number of data sets or files as grouped in a smaller number of data groups or directories, each data group containing a plurality of data sets. On a control panel is provided a display screen, and are also provided a plurality of group call buttons to be individually allocated for the respective data groups and a plurality of data set designating buttons to be individually allocated for the respective data sets. When the user actuates an intended one of the group call buttons, identifying names or marks of the data sets of the called group are listed in a display screen for a further selection of the intended data set from among the listed group by user's actuation of an intended one of the data set designating buttons. This enables an easy and speedy selection of a particular intended data set from among a large number of data sets.
摘要翻译：存储介质存储大量数据集或文件，分组在较少数量的数据组或目录中，每个数据组包含多个数据集。在控制面板上设置有显示画面，并且还设置有要分别分配给各个数据组的多个组呼叫按钮以及要分别分配给各个数据组的多个数据组指定按钮。当用户启动组呼叫按钮中的预定的一个时，识别被叫组的数据集的名称或标记被列在显示屏幕中，用于通过用户的启动来从列出的组中进一步选择所期望的数据集意图是数据集指定按钮之一。这使得能够从大量数据集中容易且快速地选择特定的预期数据集。

83. 发明授权

US06831258B2 Heating device, method for evaluating heating device and pattern forming method 失效
标题翻译：加热装置，加热装置的评价方法和图案形成方法
公开(公告)号：US06831258B2
公开(公告)日：2004-12-14
申请号：US10611345
申请日：2003-06-30
申请人： Kei Hayasaki , Shinichi Ito , Kenji Kawano
发明人： Kei Hayasaki , Shinichi Ito , Kenji Kawano
IPC分类号： H05B102
CPC分类号： H01L21/67115 , G03F7/168 , G03F7/38
摘要： A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.
摘要翻译：用于在曝光前后施加抗蚀剂的晶片上进行热处理的加热装置包括用于加热放置在加热板上的晶片的加热板，用于在晶片上照射光以检测反射的强度的光强度检测装置来自晶片上的抗蚀剂的光，以及控制部分，用于根据检测到的反射光强度控制由加热板进行的加热，使得施加到多个晶片的加热量变得恒定。因此，可以将晶片的加热量控制为恒定，并且可以减小抗蚀剂图案的尺寸变化。

84. 发明授权

US06742944B2 ALKALINE SOLUTION AND MANUFACTURING METHOD, AND ALKALINE SOLUTION APPLIED TO PATTERN FORMING METHOD, RESIST FILM REMOVING METHOD, SOLUTION APPLICATION METHOD, SUBSTRATE TREATMENT METHOD, SOLUTION SUPPLY METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 失效
标题翻译：碱解决方案和制造方法以及应用于图案形成方法，电阻膜去除方法，溶液应用方法，基板处理方法，解决方案供应方法和半导体器件制造方法的碱性溶液
公开(公告)号：US06742944B2
公开(公告)日：2004-06-01
申请号：US10144025
申请日：2002-05-14
申请人： Riichiro Takahashi , Kei Hayasaki , Tomoyuki Takeishi , Shinichi Ito
发明人： Riichiro Takahashi , Kei Hayasaki , Tomoyuki Takeishi , Shinichi Ito
IPC分类号： G03D500
CPC分类号： H01L21/31133 , G03F7/3021 , G03F7/322 , G03F7/422 , G03F7/425
摘要： A manufacturing method of an alkaline solution, comprising dissolving a gaseous molecule having oxidizing properties or reducing properties in an aqueous alkaline solution.
摘要翻译：一种碱性溶液的制造方法，包括将具有氧化性质或还原性的气态分子溶解在碱性水溶液中。

85. 发明授权

US06709531B2 Chemical liquid processing apparatus for processing a substrate and the method thereof 失效
标题翻译：用于处理基板的化学液处理装置及其方法
公开(公告)号：US06709531B2
公开(公告)日：2004-03-23
申请号：US10396407
申请日：2003-03-26
申请人： Shinichi Ito , Riichiro Takahashi , Tatsuhiko Ema , Katsuya Okamura
发明人： Shinichi Ito , Riichiro Takahashi , Tatsuhiko Ema , Katsuya Okamura
IPC分类号： B08B504
CPC分类号： H01L21/67034 , B05C11/06 , B05C11/08 , B05D1/005 , B05D3/0406 , H01L21/6708 , Y10S134/902 , Y10S438/906
摘要： In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.
摘要翻译：在本公开中，在化学液膜上方形成空气流，并且通过使空气流与化学液体的表面接触而产生化学液体的移动。此外，通过旋转板在处理对象基板和板之间的空间中产生负压。因此，提高了液体的处理均匀性，能够有效地进行液体除去工序。结果，可以提高化学液体处理的产率。

86. 发明授权

US06686130B2 Pattern forming method using photolithography 失效
标题翻译：使用光刻的图案形成方法
公开(公告)号：US06686130B2
公开(公告)日：2004-02-03
申请号：US09893485
申请日：2001-06-29
申请人： Kei Hayasaki , Shinichi Ito
发明人： Kei Hayasaki , Shinichi Ito
IPC分类号： G03F700
CPC分类号： G03F7/3028
摘要： In the light exposure step of the device pattern, the monitor region is exposed to light together with the device region for every chip, and chip {circle around (4)} within the wafer, the chip {circle around (4)} having the focus conditions in the light exposure step close to a set value and having an average value of the dose, is extracted after the light exposure of the device pattern and before the developing treatment. The monitor region arranged within the extracted chip {circle around (4)} is irradiated with light during the development of the resist, and the stopping time of the development for finishing the device pattern in a desired size is estimated on the basis of the change in the intensity of the reflected light of the monitor region. Further, a developing solution is supplied onto the wafer during the estimated stopping time of the development so as to stop the development.
摘要翻译：在设备图案的曝光步骤中，监视区域与每个芯片的器件区域一起暴露于光，并且芯片（圆周（4个晶片内，芯片周围（4个焦点条件在在设备图案的曝光之后和显影处理之前提取接近设定值并且具有剂量的平均值的曝光步骤。布置在提取的芯片内的监视器区域（围绕四周（4）照射光在抗蚀剂的显影期间，基于监视区域的反射光的强度的变化来估计用于完成所需尺寸的器件图案的显影的停止时间，并且提供显影液在发展的预计停止时间期间到晶片上，以阻止开发。

87. 发明授权

US06579382B2 Chemical liquid processing apparatus for processing a substrate and the method thereof 失效
标题翻译：用于处理基板的化学液处理装置及其方法
公开(公告)号：US06579382B2
公开(公告)日：2003-06-17
申请号：US09784200
申请日：2001-02-16
申请人： Shinichi Ito
发明人： Shinichi Ito
IPC分类号： B08B700
CPC分类号： H01L21/67034 , B05C11/06 , B05C11/08 , B05D1/005 , B05D3/0406 , H01L21/6708 , Y10S134/902 , Y10S438/906
摘要： In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.
摘要翻译：在本公开中，在化学液膜上方形成空气流，并且通过使空气流与化学液体的表面接触而产生化学液体的移动。此外，通过旋转板在处理对象基板和板之间的空间中产生负压。因此，提高了液体的处理均匀性，能够有效地进行液体除去工序。结果，可以提高化学液体处理的产率。

88. 发明授权

US06550990B2 Substrate processing apparatus and processing method by use of the apparatus 有权
公开(公告)号：US06550990B2
公开(公告)日：2003-04-22
申请号：US10022637
申请日：2001-12-20
申请人： Hideaki Sakurai , Masamitsu Itoh , Shinichi Ito
发明人： Hideaki Sakurai , Masamitsu Itoh , Shinichi Ito
IPC分类号： G03D500
CPC分类号： G03D5/003
摘要： An apparatus for processing a substrate comprising a substrate holding mechanism for holding the substrate substantially horizontally, a chemical solution discharge/suction mechanism having a chemical solution discharge/suction portion which has a chemical solution outlet for discharging a chemical solution onto the substrate and chemical solution inlets for sucking up the chemical solution present on the substrate, and a chemical solution supply/suction system for supplying the chemical solution to the chemical solution discharge/suction mechanism simultaneously with sucking the chemical solution by the chemical solution supply/suction mechanism.

89. 发明授权

US06495807B2 Heat treating method and heat treating apparatus 失效
标题翻译：热处理方法和热处理装置
公开(公告)号：US06495807B2
公开(公告)日：2002-12-17
申请号：US09983667
申请日：2001-10-25
申请人： Hideaki Sakurai , Shinichi Ito , Iwao Higashikawa , Akitoshi Kumagae
发明人： Hideaki Sakurai , Shinichi Ito , Iwao Higashikawa , Akitoshi Kumagae
IPC分类号： H05B302
CPC分类号： H01L21/67115 , F26B3/28 , H05B3/0047
摘要： Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which light irradiation treatment is applied to the target substrate such that the light irradiation regions of the target substrate do not overlap with each other, the light irradiation treatment being performed by using an irradiating light adjusted such that the distribution of the light intensity within the light irradiation region of the target substrate is rendered uniform.
摘要翻译：公开了一种通过光照射对目标基板进行加热的热处理方法，其中对目标基板施加光照射处理，使得目标基板的光照射区域彼此不重叠，光照射处理为通过使用被调整为使得目标基板的光照射区域内的光强度分布变得均匀的照射光进行。

90. 发明授权

US06187488B1 Pattern estimating method and pattern forming method 失效
标题翻译：模式估计方法和图案形成方法
公开(公告)号：US06187488B1
公开(公告)日：2001-02-13
申请号：US09527526
申请日：2000-03-16
申请人： Kei Hayasaki , Shinichi Ito , Fumio Komatsu
发明人： Kei Hayasaki , Shinichi Ito , Fumio Komatsu
IPC分类号： G03F900
CPC分类号： G03F7/70616 , G03F7/70625
摘要： A pattern estimating method, wherein during exposure for forming the device pattern, a latent image of a monitor pattern which has the same pitch as an L/S pattern as the device pattern and has a narrower line width than the L/S pattern is formed in a mark area, after developing the device pattern, probing light is applied from a monitor head to the monitor pattern, and under the conditions for preventing generation of diffracted light of first-order or more, the intensity of zero-order light reflected from the monitor pattern is detected, so that the size of the device pattern is estimated on the basis of the prestored relationship between the device pattern size and the zero-order diffracted light intensity.
摘要翻译：一种模式估计方法，其中在用于形成装置图案的曝光期间形成具有与L / S图案相同的间距作为装置图案并且具有比L / S图案窄的线宽的监视器图案的潜像在标记区域中，在显影装置图案之后，将探测光从监视器头施加到监视器图案，并且在用于防止产生一级以上的衍射光的条件下，从零反射的零级光的强度检测监视器图案，从而基于设备图案尺寸和零级衍射光强度之间的预先存储的关系来估计设备图案的尺寸。

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