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    • 81. 发明授权
    • Etching solution, method of forming a pattern using the same, method of manufacturing a multiple gate oxide layer using the same and method of manufacturing a flash memory device using the same
    • 蚀刻溶液,使用其形成图案的方法,使用该方法制造多栅极氧化物层的方法以及使用其制造闪存器件的方法
    • US07579284B2
    • 2009-08-25
    • US11482773
    • 2006-07-10
    • Byoung-Moon YoonJi-Hong KimYong-Sun KoKyung-Hyun Kim
    • Byoung-Moon YoonJi-Hong KimYong-Sun KoKyung-Hyun Kim
    • H01L21/311
    • C09K13/04H01L21/32134
    • Example embodiments of the present invention relate to an etching solution, a method of forming a pattern using the same, a method of manufacturing a multiple gate oxide layer using the same and a method of manufacturing a flash memory device using the same. Other example embodiments of the present invention relate to an etching solution having an etching selectivity between a polysilicon layer and an oxide layer, a method of forming a pattern using an etching solution using the same, a method of manufacturing a multiple gate oxide layer using the same, and a method of manufacturing a flash memory device using the same. An etching solution including hydrogen peroxide (H2O2) and ammonium hydroxide (NH4OH) by a volume ratio of about 1:2 to about 1:10 mixed in water. In a method of forming a pattern and methods of manufacturing a multiple gate oxide layer and a flash memory device, a polysilicon layer may be formed on a substrate. An insulation layer pattern including an opening exposing the polysilicon layer may be formed on the polysilicon layer. The polysilicon layer exposed by the insulation layer pattern may be etched using the etching solution. A polysilicon layer pattern may be formed on the substrate using the etching solution.
    • 本发明的示例性实施例涉及一种蚀刻溶液,使用该方法形成图案的方法,使用该蚀刻溶液的多栅极氧化物层的制造方法以及使用其制造闪存器件的方法。 本发明的其它示例性实施例涉及在多晶硅层和氧化物层之间具有蚀刻选择性的蚀刻溶液,使用其使用蚀刻溶液形成图案的方法,使用该栅极氧化物层的方法 以及使用其制造闪存器件的方法。 包含在水中混合的体积比为约1:2至约1:10的过氧化氢(H 2 O 2)和氢氧化铵(NH 4 OH)的蚀刻溶液。 在形成图案的方法和制造多栅极氧化物层和闪存器件的方法中,可以在衬底上形成多晶硅层。 可以在多晶硅层上形成包括露出多晶硅层的开口的绝缘层图案。 可以使用蚀刻溶液蚀刻由绝缘层图案暴露的多晶硅层。 可以使用蚀刻溶液在衬底上形成多晶硅层图案。
    • 82. 发明申请
    • DECISION FEEDBACK EQUALIZER (DFE) CIRCUITS FOR USE IN A SEMICONDUCTOR MEMORY DEVICE AND INITIALIZING METHOD THEREOF
    • 用于半导体存储器件的决策反馈均衡器(DFE)电路及其初始化方法
    • US20090175328A1
    • 2009-07-09
    • US12261814
    • 2008-10-30
    • Kyung-Hyun KIMYongsam MOON
    • Kyung-Hyun KIMYongsam MOON
    • H03H7/30
    • G11C7/20G11C7/02G11C7/1006G11C7/1078G11C7/1084G11C27/02
    • A DFE circuit for use in a semiconductor memory device and an initializing method thereof. In the method of initializing a DFE circuit used in a semiconductor memory device having a discontinuous data transmission, the DFE circuit may be used for changing a sampling reference level in response to a level of previous data and sampling transmission data. The method includes terminating a data channel having a transmission of the transmission data at a predefined termination level, and controlling a sampling start time point of the transmission data as a time point preceding a transmission time point of the transmission data by a predefined time. Further, an initialization may be performed of the previous data on the basis of initialization data obtained through a pre-sampling of the data channel at a sampling start time point of the transmission data, thereby obtaining an initialization of the DFE circuit and compensating for a feedback delay.
    • 一种用于半导体存储器件的DFE电路及其初始化方法。 在具有不连续数据传输的半导体存储器件中使用的DFE电路的初始化方法中,DFE电路可以用于响应于先前数据的电平和采样发送数据来改变采样基准电平。 该方法包括终止在预定的终止级别具有传输数据的传输的数据信道,并且将传输数据的采样开始时间点控制在传输数据的传输时间点之前的时间点预定的时间。 此外,可以基于在发送数据的采样开始时间点通过数据信道的预采样获得的初始化数据来执行先前数据的初始化,从而获得DFE电路的初始化并补偿 反馈延迟。
    • 84. 发明申请
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US20080042240A1
    • 2008-02-21
    • US11976251
    • 2007-10-23
    • Yeol JonChung-Ki MinYong-Sun KoKyung-Hyun Kim
    • Yeol JonChung-Ki MinYong-Sun KoKyung-Hyun Kim
    • H01L29/00
    • H01L27/10894H01L27/10852
    • Provided is a semiconductor device including a vertically oriented capacitor extending above the substrate surface and a method of manufacturing such devices in which cell, peripheral and boundary areas between the cell and peripheral areas are defined on a semiconductor substrate. Capacitors are formed in the cell area, a mold pattern is provided in the peripheral areas and an elongated dummy pattern is provided in the boundary areas. The dummy pattern includes a boundary opening in which a thin layer is formed on the elongated inner sidewalls and on the exposed portion of the substrate during formation of the lower electrode. A mold pattern and lower electrode structures having substantially the same height are then formed area so that subsequent insulation interlayer(s) exhibit a generally planar surface, i.e., have no significant step difference between the cell areas and the peripheral areas.
    • 提供一种包括在基板表面上方延伸的垂直取向的电容器的半导体器件以及制造这样的器件的方法,其中在半导体衬底上限定了单元和外围区域之间的单元,外围和边界区域。 电容器形成在电池区域中,在外围区域设置模具图案,并且在边界区域中设置细长的虚拟图案。 虚拟图案包括边界开口,其中在形成下电极期间在细长的内侧壁上和在基板的暴露部分上形成薄层。 然后形成具有基本上相同高度的模具图案和下部电极结构,使得随后的绝缘中间层呈现大致平坦的表面,即在电池区域和外围区域之间没有显着的步进差异。
    • 85. 发明申请
    • Semiconductor memory device
    • 半导体存储器件
    • US20070171738A1
    • 2007-07-26
    • US11499156
    • 2006-08-04
    • Kyung-Hyun KimJae-Woong Lee
    • Kyung-Hyun KimJae-Woong Lee
    • G11C7/00G11C29/00
    • G11C29/46G11C29/14
    • A semiconductor memory device includes a control signal generator for combining command signals applied from an external portion to generate a test signal; a set/reset signal generator for receiving a mode setting signal applied from an external portion in response to the test signal and generating a first set/reset signal when the mode setting signal is a signal that designates an individual set/reset; a test logic portion for storing and then outputting the mode setting signal in response to the test signal; a set/reset master signal generator for receiving the first set/reset signal to output a set/reset master signal for commonly controlling a test mode of internal blocks of the semiconductor memory device; and a test control signal generator for combining an output signal of the test logic portion to generate a plurality of control signals and generating the set/reset master signal as a plurality of test control signals in response to the plurality of control signals.
    • 半导体存储器件包括:控制信号发生器,用于组合从外部施加的命令信号以产生测试信号; 设置/复位信号发生器,用于响应于测试信号接收从外部施加的模式设置信号,并且当模式设置信号是指定单独设置/复位的信号时产生第一设置/复位信号; 测试逻辑部分,用于响应于测试信号存储并随后输出模式设置信号; 一个设置/复位主信号发生器,用于接收第一设置/复位信号以输出一个设置/复位主信号,用于共同控制半导体存储器件的内部块的测试模式; 以及测试控制信号发生器,用于组合测试逻辑部分的输出信号以产生多个控制信号,并且响应于多个控制信号,将设置/复位主信号生成为多个测试控制信号。
    • 88. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US07151043B2
    • 2006-12-19
    • US11082616
    • 2005-03-17
    • Tae-hyun KimByoung-moon YoonWon-jun LeeYong-sun KoKyung-hyun Kim
    • Tae-hyun KimByoung-moon YoonWon-jun LeeYong-sun KoKyung-hyun Kim
    • H01L21/76
    • H01L27/11521H01L21/76224H01L27/115
    • Methods of manufacturing a semiconductor device are provided. A trench is formed in a semiconductor substrate. A first field oxide layer is formed that partially fills the trench. The first field oxide layer defines an active region of the substrate that is adjacent to the trench. An upper portion of sidewalls of the trench extends upward beyond a surface of the first field oxide layer. A first liner is formed on the first field oxide layer and on the portion of the sidewalls of the trench that extend upward beyond the first field oxide layer. A second field oxide layer is formed on the first liner and fills the trench. The second field oxide layer and the first liner are each partially removed to expose a top adjacent surface and upper sidewalls of the trench along the active region of the substrate. A dielectric layer is formed on the exposed top adjacent surface and upper sidewalls of the trench. A gate electrode is formed on the dielectric layer.
    • 提供制造半导体器件的方法。 在半导体衬底中形成沟槽。 形成部分填充沟槽的第一场氧化物层。 第一场氧化物层限定与沟槽相邻的衬底的有源区。 沟槽的侧壁的上部向上延伸超过第一场氧化物层的表面。 第一衬垫形成在第一场氧化物层上并且在沟槽的侧壁的部分上方向上延伸超过第一场氧化物层。 在第一衬垫上形成第二场氧化物层并填充沟槽。 每个部分去除第二场氧化物层和第一衬里以沿着衬底的有源区域暴露沟槽的顶部相邻表面和上侧壁。 介电层形成在沟槽的暴露的顶部相邻表面和上侧壁上。 在电介质层上形成栅电极。