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    • 87. 发明授权
    • Method of manufacturing semiconductor memory device
    • 制造半导体存储器件的方法
    • US06329250B1
    • 2001-12-11
    • US09521612
    • 2000-03-09
    • Koji Sakui
    • Koji Sakui
    • H01L218246
    • H01L27/1126H01L27/112
    • A semiconductor memory device has a semiconductor substrate and a plurality of memory transistors, each having a gate electrode, a source diffused layer and a drain diffused layer and provided in array. Data is fixedly written as a difference between threshold voltages depending on an existence or non-existence of a doped channel layer. The doped channel layer extends to at least one of the source and the drain diffused layers. In order to manufacture such memory device, after forming a plurality of memory transistors, the steps of providing a mask having an opening formed so that a side surface of the gate electrode and substrate surface of one of the source diffused layer and the drain diffused layer are exposed and providing a doped channel layer under the gate electrode and in one of the source and drain diffused layers by implanting impurity ions through the opening with an inclined angle selected from a range from perpendicularity to parallelism to the substrate.
    • 半导体存储器件具有半导体衬底和多个存储晶体管,每个存储晶体管具有栅电极,源极扩散层和漏极扩散层并且阵列设置。 根据存在或不存在掺杂沟道层,将数据固定地写为阈值电压之间的差。 掺杂沟道层延伸到源极和漏极扩散层中的至少一个。 为了制造这样的存储器件,在形成多个存储晶体管之后,提供具有开口形成为使源极扩散层和漏极扩散层之一的栅电极和衬底表面的侧表面的掩模的步骤 并且通过从垂直于平行于衬底到平行度的范围内以倾斜角度注入杂质离子而在栅极电极之下和在源极和漏极扩散层中的一个中提供掺杂沟道层。
    • 90. 发明授权
    • Non-volatile semiconductor memory device
    • 非易失性半导体存储器件
    • US6107658A
    • 2000-08-22
    • US468928
    • 1999-12-22
    • Yasuo ItohKoji Sakui
    • Yasuo ItohKoji Sakui
    • G11C16/04H01L27/115H01L29/72
    • H01L27/115G11C16/0483
    • In a NAND EEPROM using the local self-boosting system, an intermediate voltage which allows a memory cell adjacent to a selected memory cell to be turned on is applied to the control gate of the adjacent memory cell. As a result, even if the adjacent memory cell is in a normally-off state, the potential of a bit line can be transmitted to the adjacent memory cell. Thus, the reliability of the write inhibition in a non-selected NAND memory cell column is improved, while data can be written at random into a plurality of memory cells in a selected NAND memory cell column. When data is to be erased, an absolute value of an erasing voltage applied to a control gate can be less. As a result, data can be erased by a lower erasure voltage than that required in the conventional art. Consequently, the element refinement, the reliability and the yield can be further improved.
    • 在使用本地自增强系统的NAND EEPROM中,将允许与所选存储单元相邻的存储单元导通的中间电压被施加到相邻存储单元的控制栅极。 因此,即使相邻的存储单元处于常关状态,也可以将位线的电位发送到相邻的存储单元。 因此,提高了在非选择的NAND存储单元列中写入禁止的可靠性,同时可以将数据随机写入到所选NAND存储单元列中的多个存储单元中。 当要擦除数据时,施加到控制栅极的擦除电压的绝对值可以较小。 结果,可以通过比传统技术中所需的更低的擦除电压来擦除数据。 因此,可以进一步提高元素精化,可靠性和产率。