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71. 发明申请

US20050218110A1 Method for manufacturing wiring substrate and method for manufacturing electronic device 失效
标题翻译：制造布线基板的方法及其制造方法
公开(公告)号：US20050218110A1
公开(公告)日：2005-10-06
申请号：US11091919
申请日：2005-03-28
申请人： Hidemichi Furihata , Satoshi Kimura , Minoru Marumo
发明人： Hidemichi Furihata , Satoshi Kimura , Minoru Marumo
IPC分类号： C23C18/16 , C23C18/28 , C23F1/00 , H01B13/00 , H01L23/12 , H05K3/18
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1868 , C23C18/1893 , C23C18/204 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , H05K3/185 , H05K2203/0789 , H05K2203/0793 , H05K2203/122
摘要： A method for manufacturing a wiring substrate includes the steps of (a) patterning a surface-active agent on a substrate having first and second areas to be remained on the first area; (b) removing residues of the surface-active agent in the second area by wet-etching with an alkali; (c) patterning a catalyst to be remained on one of the second area of the substrate and the surface-active agent; and (d) depositing a metal layer on the catalyst to thereby form a wiring.
摘要翻译：一种制造布线基板的方法包括以下步骤：（a）在具有要留在第一区域上的第一和第二区域的基板上图案化表面活性剂; （b）通过用碱进行湿法蚀刻除去第二区域中表面活性剂的残留物; （c）使待残留在基材的第二区域和表面活性剂之一上的催化剂图形化; 和（d）在催化剂上沉积金属层从而形成布线。

72. 发明申请

US20050170079A1 Method for manufacturing wiring substrate and method for manufacturing electronic device 审中-公开
标题翻译：制造布线基板的方法及其制造方法
公开(公告)号：US20050170079A1
公开(公告)日：2005-08-04
申请号：US11050253
申请日：2005-02-03
申请人： Hidemichi Furihata , Satoshi Kimura , Minoru Marumo
发明人： Hidemichi Furihata , Satoshi Kimura , Minoru Marumo
IPC分类号： C23C2/02 , C23C26/00 , C23C28/02 , G03F7/004 , G03F7/40 , H01L23/12 , H05K3/18 , H05K3/00 , B05D5/12 , B28B19/00 , C23C28/00 , H01L21/44
CPC分类号： G03F7/40 , C23C2/02 , C23C26/00 , G03F7/0042 , H05K3/185
摘要： A method for manufacturing a wiring substrate includes the steps of (a) providing a catalyst in first and second areas of a substrate, (b) irradiating a vacuum ultraviolet radiation to the second area of the substrate to thereby break down an interatomic bond in the second area of the substrate, (c) washing the substrate to thereby remove a portion of the catalyst provided in the second area, and (d) depositing a metal layer on a portion of the catalyst remaining in the first area to thereby form a wiring composed of the metal layer along the first area.
摘要翻译：一种制造布线基板的方法包括以下步骤：（a）在基板的第一和第二区域中提供催化剂，（b）向基板的第二区域照射真空紫外线辐射，从而分解基板中的原子间键（c）洗涤基板，从而除去设置在第二区域中的一部分催化剂，和（d）在保留在第一区域中的催化剂部分上沉积金属层，从而形成布线由沿着第一区域的金属层组成。

73. 发明申请

US20050163987A1 Oriented, thermoplastic polyester film capable of structuring by means of electromagnetic radiation, process for its production, and its use 审中-公开
标题翻译：能够通过电磁辐射构造的定向热塑性聚酯薄膜，其生产方法及其用途
公开(公告)号：US20050163987A1
公开(公告)日：2005-07-28
申请号：US11037689
申请日：2005-01-18
申请人： Holger Kliesch , Thorsten Kiehne , Gottfried Hilkert , Franz Hora
发明人： Holger Kliesch , Thorsten Kiehne , Gottfried Hilkert , Franz Hora
IPC分类号： B29C55/02 , B32B27/18 , B32B27/36 , C08J3/22 , C08J5/18 , C08K3/00 , C08K3/22 , C08L67/00 , C23C18/14 , C23C18/16 , H05K1/00 , H05K3/10 , H05K3/18 , B32B31/30
CPC分类号： B32B27/18 , B29C55/023 , B29K2067/00 , B32B27/08 , B32B27/20 , B32B27/36 , B32B2272/00 , B32B2305/70 , B32B2309/105 , B32B2425/00 , B32B2457/08 , C08J3/22 , C08J5/18 , C08J2367/02 , C08K3/013 , C23C18/14 , H05K1/0393 , H05K3/105 , H05K3/185 , H05K2201/0112 , H05K2203/107 , Y10T428/259 , Y10T428/265 , Y10T428/31786 , C08L67/02
摘要： The invention relates to a single- or multilayer, oriented film comprised of a polyester which comprises an additive which when irradiated with electromagnetic radiation forms metal nuclei on which further metal can be accumulated in further steps of the process. The film also comprises another, radiation-absorbing material. The invention further relates to a process for the production of this film and to its use in printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits of any type.
摘要翻译：本发明涉及一种由聚酯构成的单层或多层取向薄膜，该薄膜包含一种添加剂，当用电磁辐射照射时，该添加剂形成金属核，在此进一步的步骤中可以积聚另外的金属。该膜还包括另一种辐射吸收材料。本发明还涉及一种制造该膜及其用于印刷电路板，带状电缆，智能卡，RFID标签，薄膜键盘和任何类型的基于胶片的电路的方法。

74. 发明授权

US06916741B2 Capture compounds for electronic plating compositions and electronic packaging device manufacture 失效
标题翻译：捕获电子电镀组合物和电子封装装置制造的化合物
公开(公告)号：US06916741B2
公开(公告)日：2005-07-12
申请号：US09850911
申请日：2001-05-08
申请人： Steven M. Florio , Gary S. Calabrese , Jeffrey Doubrava
发明人： Steven M. Florio , Gary S. Calabrese , Jeffrey Doubrava
IPC分类号： C23C18/18 , C23C18/31 , C25D3/02 , C25D5/34 , H05K3/18 , H01L21/44
CPC分类号： C23C18/31 , C23C18/1834 , C23C18/2066 , C25D3/02 , C25D5/34 , H05K3/181 , H05K3/185 , Y10T428/31504
摘要： The invention relates to use of capture compounds such as a crown ether to facilitate selected compositions and processes employed in manufacture of electronic packaging devices such as printed circuit boards, semiconductor integrated circuit systems, multichip modules, lead frames and other interconnection devices, flat panel display substrates, and the like.
摘要翻译：本发明涉及捕获化合物如冠醚的用途，以促进用于制造诸如印刷电路板，半导体集成电路系统，多芯片模块，引线框和其它互连装置的电子封装装置中使用的所选组合物和方法，平板显示器底物等。

75. 发明申请

US20050133904A1 Method of forming metal pattern for hermetic sealing of package 审中-公开
标题翻译：形成包装气密密封的金属图案的方法
公开(公告)号：US20050133904A1
公开(公告)日：2005-06-23
申请号：US10990984
申请日：2004-11-18
申请人： Jin Kim , Won Choi , Chang Noh , Ki Song
发明人： Jin Kim , Won Choi , Chang Noh , Ki Song
IPC分类号： H01L23/02 , H01L21/50 , H01L23/10 , H05K3/18 , H01L21/48 , H01L23/552
CPC分类号： H01L23/10 , H01L21/50 , H01L2924/0002 , H01L2924/01079 , H01L2924/16152 , H01L2924/163 , H01L2924/166 , H05K3/185 , H01L2924/00
摘要： A method of forming a metal multilayer pattern for hermetic sealing of a package. According to the method, a metal multilayer pattern for hermetic sealing of a package is formed by forming latent image centers for crystal growth using a photocatalytic compound, followed by plating the latent pattern. The method avoids the use of vacuum deposition processes, e.g., sputtering and evaporation, requiring vacuum conditions. In addition, the method does not involve a photolithographic process for the formation of the metal multilayer pattern. Accordingly, the metal multilayer pattern for hermetic sealing of a package can be formed in a simple and economical manner.
摘要翻译：一种形成用于封装的气密密封的金属多层图案的方法。根据该方法，通过使用光催化剂形成用于晶体生长的潜像中心，然后对潜像进行电镀，形成用于密封封装的金属多层图案。该方法避免使用需要真空条件的真空沉积工艺，例如溅射和蒸发。此外，该方法不涉及用于形成金属多层图案的光刻工艺。因此，可以简单且经济地形成用于密封封装的金属多层图案。

76. 发明申请

US20050003242A1 Method for forming metal pattern and electromagnetic interference filter using pattern formed by the method 失效
标题翻译：使用该方法形成的图案形成金属图案和电磁干扰滤波器的方法
公开(公告)号：US20050003242A1
公开(公告)日：2005-01-06
申请号：US10844377
申请日：2004-05-13
申请人： Chang No , Jin Kim
发明人： Chang No , Jin Kim
IPC分类号： H05K9/00 , B32B9/00 , C01B21/00 , C25D5/02 , G09F9/00 , G12B17/02 , H01J9/20 , H01J17/04 , H05K3/18
CPC分类号： H05K3/185 , C25D5/022 , Y10S977/70
摘要： Disclosed herein are a method for forming a highly electrically conductive metal pattern and an electromagnetic interference filter (EMI filter) using a metal pattern formed by the method. The method comprises the steps of (i) coating a photocatalytic compound onto a substrate to form a photocatalytic film, (ii) selectively exposing the photocatalytic film to light to form a latent pattern acting as a nucleus for crystal growth, and (iii) plating the latent pattern to grow metal crystals thereon. The EMI filter comprises the metal pattern. According to the method, a highly electrically conductive metal wiring pattern can be rapidly and efficiently formed, when compared to conventional methods. In addition, the EMI filter comprising the metal pattern not only exhibits excellent performance, but also is advantageous in terms of low manufacturing costs and simple manufacture processes. Accordingly, the EMI filter can be broadly applied to flat panel display devices, such as plasma display panels (PDPs).
摘要翻译：本文公开了使用通过该方法形成的金属图案形成高导电性金属图案的方法和电磁干扰滤波器（EMI滤波器）。该方法包括以下步骤：（i）将光催化化合物涂覆到基底上以形成光催化膜，（ii）将光催化膜选择性地曝光以形成用作晶体生长的核的潜伏图案，和（iii）电镀在其上生长金属晶体的潜在图案。 EMI滤波器包括金属图案。根据该方法，与常规方法相比，可以快速有效地形成高导电性金属布线图案。此外，包括金属图案的EMI滤波器不仅表现出优异的性能，而且在低制造成本和简单的制造工艺方面也是有利的。因此，EMI滤波器可以广泛地应用于诸如等离子体显示面板（PDP）的平板显示装置。

77. 发明申请

US20040104040A1 Injection molded conductor carrying means and a method for the manufacture thereof 有权
标题翻译：注射成型导体承载装置及其制造方法
公开(公告)号：US20040104040A1
公开(公告)日：2004-06-03
申请号：US10617925
申请日：2003-07-11
申请人： FESTO AG & Co.
发明人： Stephan Schauz
IPC分类号： H05K001/03
CPC分类号： H05K3/185 , H05K1/0284 , H05K3/0014 , H05K3/182
摘要： A method making possible the production of an injection molded conductor carrying means composed of a first supporting substrate and a second supporting substrate. The first supporting substrate comprises a basically metallizeable plastic material and the second supporting substrate a basically non-metallizeable plastic material. However the plastic material of the second supporting substrate is able to be activated by a laser beam. The laser activation produces a metallization pattern on it and such pattern is connected with uncovered areas of the first supporting substrate, following which a common treatment takes place which results in an electrical conductor arrangement being produced. The invention furthermore relates to a conductor carrying means produced by the method.
摘要翻译：一种能够制造由第一支撑基板和第二支撑基板构成的注塑导体承载装置的方法。第一支撑衬底包括基本可金属化的塑料材料，第二支撑衬底基本上是不可金属化的塑料材料。然而，第二支撑衬底的塑料材料能够被激光束激活。激光激活在其上产生金属化图案，并且这种图案与第一支撑衬底的未覆盖区域连接，随后进行常见的处理，这导致产生电导体布置。本发明还涉及通过该方法制造的导体承载装置。

78. 发明申请

US20040103960A1 Method for the patterned, selective metallization of a surface of a substrate 失效
标题翻译：用于衬底表面的图案化，选择性金属化的方法
公开(公告)号：US20040103960A1
公开(公告)日：2004-06-03
申请号：US10675634
申请日：2003-09-30
发明人： Gunter Schmid
IPC分类号： C22F001/00
CPC分类号： H01L21/4846 , C23C18/1605 , C23C18/161 , C23C18/1612 , C23C18/1678 , H01L21/288 , H01L21/76838 , H01L24/11 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01082 , H01L2924/12042 , H05K3/185 , H05K2203/107 , H05K2203/111 , H05K2203/121 , H01L2924/00
摘要： The present invention provides a method for the patterned metallization of a surface of a substrate, comprising the steps of preheating the substrate to a temperature which is below a deposition temperature of a predetermined metal dissolved in a fluid provided above the surface, and performing patterned deposition of the predetermined metal in predetermined regions on the surface of the substrate by locally increasing the temperature to above the deposition temperature.
摘要翻译：本发明提供了一种用于衬底表面的图案化金属化的方法，包括以下步骤：将衬底预热到低于溶解在设置在表面上方的流体中的预定金属的沉积温度的温度，并执行图案化沉积通过将温度局部升高到高于沉积温度，在基板表面上的预定区域中的预定金属。

79. 发明授权

US06706165B2 Fabrication of metallic microstructures via exposure of photosensitive composition 有权
标题翻译：通过感光组合物的曝光制造金属微结构
公开(公告)号：US06706165B2
公开(公告)日：2004-03-16
申请号：US09755645
申请日：2001-01-05
申请人： Tao Deng , Francisco Arias , Rustem F. Ismagilov , Paul J. A. Kenis , George M. Whitesides
发明人： Tao Deng , Francisco Arias , Rustem F. Ismagilov , Paul J. A. Kenis , George M. Whitesides
IPC分类号： C25D500
CPC分类号： B81C1/00095 , B81B2207/07 , B81C99/008 , B81C99/0095 , B82Y30/00 , C23C18/06 , C23C18/14 , C23C18/1603 , C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/1657 , C23C18/208 , C23C18/36 , C23C18/42 , H05K3/105 , H05K3/106 , H05K3/185 , H05K3/202 , H05K3/205 , H05K2203/0117 , H05K2203/0156 , H05K2203/302 , Y10T29/49986
摘要： A method of forming microstructures. An article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental metal. Additional conductive material may then be deposited onto the elemental metal to produce a microstructure.
摘要翻译：一种形成微观结构的方法。包含金属原子前体的物品不均匀地暴露于电磁辐射，其量和强度足以将一些前体转化为元素金属。然后可以将另外的导电材料沉积到元素金属上以产生微结构。

80. 发明申请

US20040018131A1 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates 失效
标题翻译：聚酰亚胺树脂前体溶液，通过使用该溶液制备的电子部件的层压体和制造层压体的方法
公开(公告)号：US20040018131A1
公开(公告)日：2004-01-29
申请号：US10450048
申请日：2003-06-10
发明人： Shinya Izumida , Koji Itoh , Minoru Oyama , Atsushi Suuki
IPC分类号： C22B011/00 , C01G055/00
CPC分类号： H05K3/387 , C08K5/0025 , C08K5/0091 , C09D179/08 , C23C18/1608 , C23C18/1612 , C23C18/2033 , C23C18/30 , H05K1/0346 , H05K3/181 , H05K3/185 , H05K3/386 , H05K2201/0154 , H05K2201/0236 , H05K2203/0709 , C08L79/04 , C08L79/08
摘要： Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.
摘要翻译：电子部件用层叠体通过在聚酰亚胺基板上涂布含有钯化合物的聚酰亚胺树脂前体溶液进行干燥而形成聚酰亚胺树脂前体层，在氢供体存在下照射紫外线，形成核用于底漆电镀，通过无电解电镀形成金属底漆层，并且在形成表面镀层之后或之后通过加热将聚酰亚胺树脂前体层转化成聚酰亚胺树脂层。本发明提供了电子部件的层叠体，其极大地改善了与金属层的粘附性，而不损害基板固有的特性，绝缘性能优异，并且用于制造层压体的聚酰亚胺树脂前体树脂溶液。

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