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    • 74. 发明申请
    • Spot grid array electron imaging system
    • 点阵阵列电子成像系统
    • US20030085353A1
    • 2003-05-08
    • US09986137
    • 2001-11-07
    • Gilad AlmogyOren Reches
    • H01J037/28
    • H01J37/28H01J2237/024H01J2237/0635H01J2237/1503H01J2237/20228H01J2237/2817
    • A high data-rate electron beam spot-grid array imaging system is provided that overcomes the low resolution and severe linearity requirements of prior art systems. Embodiments include an imaging system comprising an electron beam generator for simultaneously irradiating an array of spots spaced apart from each other on a surface of an object to be imaged, and a detector for collecting backscattered and/or secondary electrons emitted as a result of the interaction of the spots with the surface of the object to form an image of the irradiated portions of the object surface. A mechanical system moves the substrate in a direction which is nearly parallel to an axis of the array of spots such that as the substrate is moved across the spot array in the scan direction (the y-direction) the spots trace a path which leaves no gaps in the mechanical cross-scan direction (the x-direction). A compensator, such as a servo or a movable mirror, compensates for mechanical inaccuracies in the moving stage, thereby increasing imaging accuracy. In other embodiments, multiple detectors placed at different angles to the substrate collect electrons to provide multiple perspective imaging of the substrate surface.
    • 提供了高数据速率电子束点阵阵列成像系统,其克服了现有技术系统的低分辨率和严格的线性要求。 实施例包括一种成像系统,包括电子束发生器,用于同时照射待成像物体的表面上彼此间隔开的点阵列,以及用于收集由于相互作用而发射的反向散射和/或二次电子的检测器 具有物体表面的斑点以形成物体表面的照射部分的图像。 机械系统使基板沿着几乎平行于点阵列的轴线的方向移动,使得当基板在扫描方向(y方向)上移动穿过光点阵列时,斑点追踪不留下的路径 机械横向扫描方向(x方向)的间隙。 诸如伺服或可移动镜的补偿器补偿了移动台中的机械不准确度,从而提高了成像精度。 在其他实施例中,以与衬底不同的角度放置的多个检测器收集电子以提供衬底表面的多个透视成像。
    • 76. 发明授权
    • Fabrication method for semiconductor devices and transparent mask for
charged particle beam
    • 半导体器件的制造方法和带电粒子束的透明掩模
    • US5036209A
    • 1991-07-30
    • US424733
    • 1989-10-20
    • Toyotaka KataokaKiichi Sakamoto
    • Toyotaka KataokaKiichi Sakamoto
    • G03F1/00G03F1/20G03F7/20H01J37/09H01J37/317
    • B82Y10/00B82Y40/00G03F1/20G03F7/2047H01J37/09H01J37/3174H01J2237/024H01J2237/15H01J2237/31776
    • A charged particle beam exposure apparatus includes a charged particle beam generator, a deflector device for deflecting the charged particle beam electromagnetically to individually illuminate small areas of a pattern forming region formed on a transparent mask, apparatus for moving the transparent mask mechanically, and the various components required for reducing the charged particle beam pattern through the mask and projecting the same onto a semiconductor device substrate to be exposed. A semiconductor device is fabricated using such apparatus by moving the mask mechanically to position a pattern forming region at a predetermined exposure position. The pattern forming region includes a plurality of small areas which can be individually selected by deflecting the charged particle beam when the pattern forming region is positioned at the exposure position. Each individual area is of a size such that the entirety thereof is exposed when the beam is deflected onto such area.
    • 在带电粒子束曝光装置中,包括用于产生带电粒子束(20)的装置(21-23),用于电磁地偏转带电粒子束(20)的偏转装置(24)并照射多个 构成形成在透明掩模(26)上的多个聚集隔板(27)的一个聚集隔板(27)的小隔板(28); 用于机械地移动透明掩模(26)的掩模移动装置和用于减小通过掩模(26)图案化的带电粒子束(20)的减少曝光装置(30-34),并将其暴露于半导体器件(35)上 ),制造半导体器件(35)的方法包括以下步骤:通过掩模移动装置将多个聚集隔板(27)中的一个聚集隔板(27)移动到预定位置; 通过所述偏转装置(24)从所述移动的聚集隔板(27)的所述多个小隔板(28)中选择一个小隔板(28); 并且通过所述还原曝光装置(30-34)减小所选择的小分区(28)并将其暴露在所述半导体器件(35)上。