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    • 71. 发明授权
    • Positioner system and method of positioning
    • 定位系统和定位方法
    • US08981807B2
    • 2015-03-17
    • US13190928
    • 2011-07-26
    • Christopher Leonard WestCharles Paul Nappen
    • Christopher Leonard WestCharles Paul Nappen
    • G01R31/20G01R31/28
    • G01R31/2887B25J9/023B25J9/041B25J17/0208B25J19/002G01R31/2834G01R31/2891
    • A system for positioning a load including a support column, a drive rail unit coupled to the support column, the drive rail unit moveable relative to the support column, a vertical carriage moveable along the support column, wherein the vertical carriage supports the load, an engagement member which engages the drive rail and which moves along the drive rail, and a motor which applies force to the engagement member, causing the engagement member to move along the drive rail. The motor is coupled to the vertical carriage so that, as the motor applies force to the engagement member, the vertical carriage moves relative to the drive rail unit, the vertical carriage is also moveable with the drive rail unit so that the vertical carriage and the drive rail unit move relative to the support column. A method of positioning a load is also provided.
    • 一种用于定位负载的系统,包括支撑柱,耦合到支撑柱的驱动轨单元,可相对于支撑柱移动的驱动轨道单元,可沿着支撑柱移动的竖直托架,其中竖直托架支撑负载, 接合构件,其与驱动轨道接合并沿着驱动轨道移动;以及电动机,其向接合构件施加力,使得接合构件沿着驱动轨道移动。 电动机联接到垂直滑架,使得当电动机对接合构件施加力时,垂直滑架相对于驱动轨道单元移动,垂直滑架也可以与驱动轨道单元一起移动,使得垂直滑架和 驱动轨道单元相对于支撑柱移动。 还提供了一种定位负载的方法。
    • 75. 发明申请
    • TEST HANDLER, TEST CARRIER AND TEST METHOD THEREOF
    • 测试手段,测试载体及其测试方法
    • US20140354312A1
    • 2014-12-04
    • US14277185
    • 2014-05-14
    • Kai-Ming LiChih-Lung Chien
    • Kai-Ming LiChih-Lung Chien
    • G01R31/28
    • G01R31/2891G01R31/2867G01R31/2875
    • The present invention provides a test handler for various IC tests, which includes a chamber and a test carrier. The chamber is controllable to present a dry status. The test carrier is made of a high thermal-conductive material and includes plural positioning structures for respectively accommodating plural IC chips. The test carrier is disposed on and in thermal contact with a temperature-adjustment device in the chamber, and the temperature-adjustment device controls the temperature of the IC chips on the test carrier by thermal conduction through the test carrier. The invention also provides a test carrier used in the test handler and a test method thereof.
    • 本发明提供了一种用于各种IC测试的测试处理器,其包括腔室和测试载体。 该室是可控的以呈现干燥状态。 测试载体由高导热材料制成,并且包括用于分别容纳多个IC芯片的多个定位结构。 测试载体设置在室内的温度调节装置上并与其接触,并且温度调节装置通过测试载体的热传导来控制测试载体上的IC芯片的温度。 本发明还提供了一种在测试处理器中使用的测试载体及其测试方法。
    • 76. 发明申请
    • LOW OVERDRIVE PROBES WITH HIGH OVERDRIVE SUBSTRATE
    • 具有高过渡基板的低过载探头
    • US20140347084A1
    • 2014-11-27
    • US13899458
    • 2013-05-21
    • Advantest Corporation
    • Ting HULakshmikanth NAMBURI
    • G01R1/073G01R31/26
    • G01R31/2891
    • A method for testing a semiconductor device is disclosed. The method comprises positioning a probe card comprising a plurality of probes above the semiconductor device and moving the probe card in a vertical direction towards the semiconductor device. The plurality of probes are moving in a vertical direction towards a plurality of electrical structures of the semiconductor device until each probe of the plurality of probes has made mechanical contact with a corresponding electrical structure of the plurality of electrical structures with a minimum quantity of force. The each probe of the plurality of probes absorbs a portion of vertical overdrive after contacting their corresponding electrical structures. The probe card absorbs any remaining vertical overdrive. The vertical overdrive is a continuing vertical movement of the plurality of probes after a first probe of the plurality of probes mechanically contacts a first corresponding electrical structure.
    • 公开了一种用于测试半导体器件的方法。 该方法包括将包括多个探针的探针卡定位在半导体器件上方并将探针卡沿垂直方向移向半导体器件。 多个探针在垂直方向上朝向半导体器件的多个电结构移动,直到多个探针的每个探针以最小的力量与多个电气结构的对应的电气结构机械接触。 多个探针的每个探针在接触其相应的电气结构之后吸收垂直过驱动的一部分。 探针卡吸收任何剩余的垂直过载。 在多个探针的第一探针机械地接触第一对应的电结构之后,垂直过驱动是多个探针的持续垂直运动。
    • 77. 发明授权
    • Method for measuring transistor
    • 测量晶体管的方法
    • US08890555B2
    • 2014-11-18
    • US13093172
    • 2011-04-25
    • Takahiro Tsuji
    • Takahiro Tsuji
    • G01R31/00G01R31/26G01R31/28
    • G01R31/2642G01R31/2874G01R31/2886G01R31/2891
    • An object is to provide a measuring method with high reproducibility in a bias-temperature stress test of a transistor in which an oxide semiconductor is used for a semiconductor layer. Provided is a measuring method of a transistor, which includes the steps of disposing a transistor in which an oxide semiconductor is used for a semiconductor layer in a measurement room having a light-blocking property, introducing dry air, nitrogen, or argon into the measurement room, and applying a predetermined voltage to a gate electrode of the transistor in the measurement room kept under an atmosphere where the dew point is greater than or equal to −110° C. and less than or equal to −60° C., whereby the amount of change in threshold voltage over time is measured.
    • 本发明的目的是提供一种在氧化物半导体用于半导体层的晶体管的偏压 - 温度应力测试中具有高再现性的测量方法。 提供了一种晶体管的测量方法,其包括以下步骤:将具有阻光性的测量室中的氧化物半导体用于半导体层的晶体管,将干燥空气,氮气或氩气引入到测量中 并且在保持在露点大于或等于-110℃且小于等于-60℃的气氛下的测量室中的晶体管的栅电极施加预定电压,由此 测量阈值电压随时间的变化量。
    • 80. 发明申请
    • INSPECTION DEVICE WITH VERTICALLY MOVEABLE ASSEMBLY
    • 具有垂直移动装置的检查装置
    • US20140253166A1
    • 2014-09-11
    • US14282565
    • 2014-05-20
    • RUDOLPH TECHNOLOGIES, INC.
    • Gary Mark GundersonGreg Olmstead
    • G01R1/04
    • G01R1/04G01R31/2891
    • The inspection of semiconductors or like substrates by the present mechanism minimizes deflection in the checkplate and probe card. An inspection device including a housing, a toggle assembly within the housing, an objective lens assembly attached within the toggle assembly including an objective coupled within an objective focus, wherein the objective focus is deflectable along an optics axis, and a cam assembly including a rotary cam and a window carrier, wherein the window carrier is moveable along the optics axis with rotation of the rotary cam, wherein the cam assembly is coupled to the toggle assembly with the objective and window are aligned along the optics axis.
    • 通过本机构检查半导体或类似基板可以最大限度地减少检查板和探针卡中的偏转。 一种检查装置,包括壳体,壳体内的肘节组件,附接在肘节组件内的物镜组件,其包括联接在物镜焦点内的物镜,其中物镜焦点可沿光学轴线偏转;以及凸轮组件,包括旋转 凸轮和窗户托架,其中所述窗口托架可随着所述旋转凸轮的旋转沿着所述光学轴线移动,其中所述凸轮组件联接到所述肘节组件,所述物镜和所述窗口沿着所述光学轴线对准。