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1. 发明授权

US11578967B2 Wafer inspection system including a laser triangulation sensor 有权
公开(公告)号：US11578967B2
公开(公告)日：2023-02-14
申请号：US16620317
申请日：2018-06-08
申请人： Rudolph Technologies, Inc.
发明人： John Schaefer , Christopher Voges , Nicholas Smith , Jeffrey Treptau
IPC分类号： H04N5/225 , G01B11/06 , G06T7/00 , G01B11/25 , H04N5/232 , H04N5/247 , G01N21/95
摘要： One example of an inspection system includes a laser, a magnification changer, and a first camera. The laser projects a line onto a wafer to be inspected. The magnification changer includes a plurality of selectable lenses of different magnification. The first camera images the line projected onto the wafer and outputs three-dimensional line data indicating the height of features of the wafer. Each lens of the magnification changer provides the same nominal focal plane position of the first camera with respect to the wafer.

2. 发明申请

US20220121676A2 WAFER-LEVEL PACKAGE ASSEMBLY HANDLING 有权
公开(公告)号：US20220121676A2
公开(公告)日：2022-04-21
申请号：US16651870
申请日：2018-09-28
申请人： RUDOLPH TECHNOLOGIES, INC.
发明人： Kevin Barr , Edward Andrew Condon
IPC分类号： G06F16/25 , G06F16/176 , G06F16/26 , G06F16/28
摘要： A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.

3. 发明授权

US10553504B2 Inspection of substrates 有权
公开(公告)号：US10553504B2
公开(公告)日：2020-02-04
申请号：US15933366
申请日：2018-03-22
申请人： Rudolph Technologies, Inc.
发明人： Gurvinder Singh , Wu Y. Han , John Thornell , Chetan Suresh , Wayne Fitzgerald
IPC分类号： H01L21/66 , G01N21/64 , G01N21/95 , H01L21/02
摘要： Concepts presented herein relate to approaches for performing substrate inspection. In one aspect, the concepts relate to detecting anomalies or candidate defects on the substrate based on contrast in images obtained of the substrate.

4. 发明授权

US10466179B2 Semiconductor device inspection of metallic discontinuities 有权
公开(公告)号：US10466179B2
公开(公告)日：2019-11-05
申请号：US15933362
申请日：2018-03-22
申请人： Rudolph Technologies, Inc.
发明人： Gurvinder Singh , Wu Y. Han , John Thornell , Chetan Suresh , Wayne Fitzgerald
IPC分类号： G01N21/64 , H01L21/67 , G01N21/95 , G01N21/88 , H01L21/66 , G01N21/84 , G01B11/06
摘要： Concepts presented herein relate to approaches for performing substrate inspection. In one aspect, the concepts relate to detecting anomalies or candidate defects on the substrate based on contrast in images obtained of the substrate.

5. 发明授权

US10014228B2 Method and apparatus to assist the processing of deformed substrates 有权
公开(公告)号：US10014228B2
公开(公告)日：2018-07-03
申请号：US14944839
申请日：2015-11-18
申请人： Rudolph Technologies, Inc.
发明人： James H. Greer , Troy Palm
IPC分类号： H01L21/66 , H01L21/683 , H01L21/687 , H01L21/67 , H01L21/673
CPC分类号： H01L22/12 , H01L21/67288 , H01L21/673 , H01L21/67346 , H01L21/6838 , H01L21/68714 , H01L21/68721 , H01L21/68728 , H01L21/6875
摘要： A method and apparatus for detecting and handling deformed substrates, thus allowing them to be processed, and for increasing device yield on the substrate is herein disclosed. A sensor detects deformity, then the substrate is flattened, allowing a support to hold it securely.

6. 发明申请

US20170276758A1 METHOD OF MEASURING AND ASSESSING A PROBE CARD WITH AN INSPECTION DEVICE 审中-公开
公开(公告)号：US20170276758A1
公开(公告)日：2017-09-28
申请号：US15622246
申请日：2017-06-14
申请人： Rudolph Technologies, Inc.
发明人： Greg Olmstead
IPC分类号： G01R35/00 , G01R31/28
CPC分类号： G01R35/00 , G01R31/2891
摘要： A method of assessing functionality of a probe card includes providing a probe card analyzer without a probe card interface, removably coupling a probe card having probes to a support plate of the probe card analyzer, aligning a sensor head of the probe card analyzer with the probe card, and measuring a component of the probes with the sensor head.

7. 发明授权

US09594230B2 On-axis focus sensor and method 有权
标题翻译：轴上对焦传感器和方法
公开(公告)号：US09594230B2
公开(公告)日：2017-03-14
申请号：US14367564
申请日：2012-12-20
申请人： Rudolph Technologies, Inc.
发明人： Dennis L. Ohren , Christopher J. Voges , Andrew E. Rotering
IPC分类号： G02B7/28 , G01N21/84 , G01B11/00 , G01B11/02 , G01B11/06 , H04N5/232 , G01N21/95
CPC分类号： G02B7/28 , G01B11/00 , G01B11/026 , G01B11/0608 , G01N21/84 , G01N21/9501 , G01N2201/127 , H04N5/23212
摘要： A focus height sensor in an optical system for inspection of semiconductor devices includes a sensor beam source that emits a beam of electromagnetic radiation. A reflector receives the beam of electromagnetic radiation from the sensor beam source and directs the beam toward a surface of a semiconductor device positioned within a field of view of the optical system. The reflector is positioned to receive at least a portion of the beam back from the surface of the semiconductor device to direct the returned beam to a sensor. The sensor receives the returned beam and outputs a signal correlating to a position of the surface within the field of view along an optical axis of the optical system.
摘要翻译：用于检查半导体器件的光学系统中的焦点高度传感器包括发射电磁辐射束的传感器光束源。反射器接收来自传感器光束源的电磁辐射束，并将光束引向位于光学系统的视野内的半导体器件的表面。反射器定位成从半导体器件的表面接收光束的至少一部分，以将返回的光束引导到传感器。传感器接收返回的光束，并沿着光学系统的光轴输出与视场内的表面的位置相关的信号。

8. 发明授权

US09535089B2 Inspection device with vertically moveable assembly 有权
标题翻译：具有垂直移动组件的检查装置
公开(公告)号：US09535089B2
公开(公告)日：2017-01-03
申请号：US14282565
申请日：2014-05-20
申请人： RUDOLPH TECHNOLOGIES, INC.
发明人： Gary Mark Gunderson , Greg Olmstead
IPC分类号： G01R31/00 , G01R1/04 , G01R31/28
CPC分类号： G01R1/04 , G01R31/2891
摘要： The inspection of semiconductors or like substrates by the present mechanism minimizes deflection in the checkplate and probe card. An inspection device including a housing, a toggle assembly within the housing, an objective lens assembly attached within the toggle assembly including an objective coupled within an objective focus, wherein the objective focus is deflectable along an optics axis, and a cam assembly including a rotary cam and a window carrier, wherein the window carrier is moveable along the optics axis with rotation of the rotary cam, wherein the cam assembly is coupled to the toggle assembly with the objective and window are aligned along the optics axis.
摘要翻译：通过本机构检查半导体或类似基板可以最大限度地减少检查板和探针卡中的偏转。一种检查装置，包括壳体，壳体内的肘节组件，附接在肘节组件内的物镜组件，其包括联接在物镜焦点内的物镜，其中物镜焦点可沿光学轴线偏转;以及凸轮组件，包括旋转凸轮和窗户托架，其中所述窗口托架可随着所述旋转凸轮的旋转沿着所述光学轴线移动，其中所述凸轮组件联接到所述肘节组件，所述物镜和所述窗口沿着所述光学轴线对准。

9. 发明申请

US20160352997A1 HIGH SPEED AUTOFOCUS SYSTEM 审中-公开
标题翻译：高速自动对焦系统
公开(公告)号：US20160352997A1
公开(公告)日：2016-12-01
申请号：US15209218
申请日：2016-07-13
申请人： Rudolph Technologies, Inc.
发明人： Robert Bishop , Timothy Pinkney
IPC分类号： H04N5/235 , H04N5/372 , G01N21/95 , G03B13/36 , G01N21/64 , G01N21/88 , H04N5/33 , H04N5/378
CPC分类号： H04N5/2356 , G01N21/6456 , G01N21/8806 , G01N21/9501 , G01N21/956 , G01N2021/6463 , G01N2021/95638 , G01N2201/0612 , G01N2201/062 , G01N2201/10 , G03B13/36 , H04N5/332 , H04N5/37206 , H04N5/378 , H04N7/18
摘要： A method and apparatus for optimizing inspection high-speed optical inspection of parts using intelligent image analysis to determine optimal focus using high numerical aperture (NA) optics, achieve a superior signal-to-noise ratio, resolution, and inspection speed performance with very limited depth of field lenses.
摘要翻译：使用智能图像分析优化检测部件的高速光学检测的方法和装置，使用高数值孔径（NA）光学元件确定最佳聚焦，实现了非常有限的信号噪声比，分辨率和检测速度性能景深镜头。

10. 发明申请

US20160101445A1 CALIBRATION OF SEMICONDUCTOR METROLOGY SYSTEMS 审中-公开
标题翻译：半导体公制系统的校准
公开(公告)号：US20160101445A1
公开(公告)日：2016-04-14
申请号：US14881847
申请日：2015-10-13
申请人： Rudolph Technologies, Inc.
发明人： Jian Ding , Priya Mukundhan , James Kane , Steven Peterson , Fei Shen
IPC分类号： B08B7/00 , H01L21/02 , G01D18/00 , H01L21/67
CPC分类号： B08B7/0057 , G01D18/00 , H01L21/02046 , H01L21/67028 , H01L21/67115 , H01L21/67288 , H01L22/12 , H01L22/20
摘要： A method of cleaning calibration and other substrates that improves the correlation of measurements from calibration and product substrates and increases the useful life of the calibration substrates is herein disclosed. By exposing a calibration substrate to ultraviolet light, a reaction is triggered that results in the cleaning of the contaminants from the calibration substrate. For instance, monatomic oxygen is introduced to contaminants on the surface of a calibration substrate to remove the contaminants without inducing modifications in the substrate itself. Through the cleaning process, the temperature of the calibration substrate may be controlled to limit adverse effects caused by the overheating of the calibration substrate.
摘要翻译：本文公开了一种清洁校准和其它基板的方法，其改进了来自校准和产品基板的测量值的相关性并增加了校准基板的使用寿命。通过将校准基板暴露于紫外光，触发反应，导致从校准基板清洁污染物。例如，将单原子氧引入到校准基板的表面上的污染物上以除去污染物，而不引起基板本身的修饰。通过清洗处理，可以控制校准基板的温度，以限制由校准基板过热引起的不良影响。

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