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71. 发明授权

US4301509A Method for cooking meat or poultry in thermal oven 失效
标题翻译：在烤箱中烹制肉类或家禽的方法
公开(公告)号：US4301509A
公开(公告)日：1981-11-17
申请号：US93685
申请日：1979-11-13
申请人： Michael A. Haase , Edward B. Miller , Charles W. Eichelberger , Scott E. Cutler , Robert J. Wojnarowski
发明人： Michael A. Haase , Edward B. Miller , Charles W. Eichelberger , Scott E. Cutler , Robert J. Wojnarowski
IPC分类号： F24C7/00 , G06F15/20 , H05B1/02
CPC分类号： F24C7/006 , F24C7/085
摘要： Meat or poultry is cooked automatically in a thermal oven to a desired degree of doneness by a chosen time. The temperature of the meat or poultry is monitored, and linear extrapolations are made therefrom. These extrapolations are compared to the course the cooking should follow, and the oven temperature is automatically varied to correct deviations from the ideal course.
摘要翻译：肉或家禽在热烘箱中自动烹饪至所需时间的期望程度。监测肉类或家禽的温度，并由此进行线性外推。将这些外推与烹饪应遵循的过程进行比较，并且烘箱温度自动变化，以纠正与理想过程的偏差。

72. 发明授权

US4268779A Circuit for controlling current flow from an A.C. source to a load 失效
标题翻译：用于控制从交流电源到负载的电流的电路
公开(公告)号：US4268779A
公开(公告)日：1981-05-19
申请号：US66286
申请日：1979-08-13
申请人： Charles W. Eichelberger , Rudolph A. Dehn , Michael Gdula , Robert J. Wojnarowski
发明人： Charles W. Eichelberger , Rudolph A. Dehn , Michael Gdula , Robert J. Wojnarowski
IPC分类号： H05B6/68 , H05B39/00 , H05B41/14
CPC分类号： H05B6/681
摘要： A circuit for controlling power consumption of a load, by controlling the flow of current thereto, utilizes at least one parallel combination of non-linear resistance elements, such as a varistor and the like, and a gateable semiconductor switching device, such as a triac and the like, to substantially reduce or prevent current flow when the semiconductor switching device is gated to an "off" condition and to enable normal current flow to a load when the semiconductor switching device is gated to an "on" condition. Embodiments of the power circuits for control of magnetron power, in a microwave oven, are illustrated.
摘要翻译：用于通过控制电流的流量来控制负载的功耗的电路利用非线性电阻元件（例如变阻器等）的至少一个并联组合，以及可选择的半导体开关器件，例如三端双向可控硅开关元件当半导体开关器件选通到“关闭”状态并且当半导体开关器件选通到“导通”状态时能够使负载正常流动，从而大大减少或防止电流流动。示出了在微波炉中控制磁控管功率的电源电路的实施例。

73. 发明授权

US06747406B1 LED cross-linkable phospor coating 失效
标题翻译： LED可交联磷光体涂层
公开(公告)号：US06747406B1
公开(公告)日：2004-06-08
申请号：US09633527
申请日：2000-08-07
申请人： Jacob C. Bortscheller , Robert J. Wojnarowski
发明人： Jacob C. Bortscheller , Robert J. Wojnarowski
IPC分类号： H01J6304
CPC分类号： H01L33/508 , H01L2224/48463 , H01L2224/8592 , H01S5/028
摘要： A light source (10) includes a light emitting component (32), such as a UV/blue light emitting diode or laser diode coated with a layer (60) of a phosphor material (64). The phosphor material converts a portion of the light emitted by the light emitting component to light of a longer wavelength, such as yellow light. The thickness d of the layer varies across the light emitting component in relation to the intensity of light emitted by the light emitting component. This maintains a uniform color of the emission from the light source while minimizing the loss in light intensity (brightness) due to the presence of the phosphor.
摘要翻译：光源（10）包括诸如UV /蓝色发光二极管的发光部件（32）或涂覆有磷光体材料（64）的层（60）的激光二极管。荧光体材料将由发光部件发射的光的一部分转换为较长波长的光，例如黄色光。该层的厚度d相对于由发光部件发出的光的强度而在发光部件上变化。这保持了来自光源的发射的均匀颜色，同时由于荧光体的存在而使光强度（亮度）的损失最小化。

74. 发明授权

US5452182A Flexible high density interconnect structure and flexibly interconnected system 失效
标题翻译：灵活的高密度互连结构和灵活互连的系统
公开(公告)号：US5452182A
公开(公告)日：1995-09-19
申请号：US865786
申请日：1992-04-07
申请人： Charles W. Eichelberger , William P. Kornrumpf , Robert J. Wojnarowski
发明人： Charles W. Eichelberger , William P. Kornrumpf , Robert J. Wojnarowski
IPC分类号： H01L23/52 , H01L21/00 , H01L21/68 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18 , H05K1/02 , H05K1/05 , H05K1/14 , H05K1/18 , H05K3/00 , H05K1/11
CPC分类号： H05K1/189 , H01L21/67144 , H01L21/6835 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L2221/68313 , H01L2224/24227 , H01L2224/7665 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H05K1/05 , H05K2201/051 , H05K2201/09745 , H05K2201/2009 , H05K2203/0264 , H05K3/0058
摘要： A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.
摘要翻译：通过将高密度互连结构延伸超过含有由此相互连接的芯片的固体基板而提供灵活的高密度互连结构。在制造期间，高密度互连结构的柔性部分由临时互连支撑支撑，以便于根据现有制造技术制造结构。随后，如果临时支撑结构足够柔软以赋予该高密度互连结构部分所需的柔性程度，那么该临时支撑结构可被移除或保持在适当位置。还公开了制造方法。

75. 发明授权

US5381445A Munitions cartridge transmitter 失效
标题翻译：弹药筒式变送器
公开(公告)号：US5381445A
公开(公告)日：1995-01-10
申请号：US55473
申请日：1993-05-03
申请人： John E. Hershey , Menahem Lowy , Lionel M. Levinson , Amer A. Hassan , Richard L. Frey , Kenneth B. Welles, II , Michael Gdula , Robert J. Wojnarowski
发明人： John E. Hershey , Menahem Lowy , Lionel M. Levinson , Amer A. Hassan , Richard L. Frey , Kenneth B. Welles, II , Michael Gdula , Robert J. Wojnarowski
IPC分类号： F42B12/36 , G01S5/00 , G01S5/06 , H04L27/30
CPC分类号： G01S5/0009 , F42B12/36 , F42B12/365 , G01S5/06
摘要： A munitions cartridge transmitter capable of emitting an electromagnetic signal after discharge from a cartridge propelling device comprises a signal generator, an electromagnetic signal transmitter coupled to the generator, an antenna coupled to the transmitter, and a hollow cartridge for housing the generator, the transmitter, and the antenna. The transmitter is energized after discharge of the cartridge propelling device by a power source contained in the cartridge.
摘要翻译：一种能够在从暗盒推进装置排放之后发出电磁信号的弹药盒式发射器包括信号发生器，耦合到发生器的电磁信号发射器，耦合到发射器的天线以及用于容纳发生器的中空滤芯，和天线。在通过盒中包含的电源将墨盒驱动装置排出之后，变送器通电。

76. 发明授权

US5331203A High density interconnect structure including a chamber 失效
标题翻译：包括腔室的高密度互连结构
公开(公告)号：US5331203A
公开(公告)日：1994-07-19
申请号：US141460
申请日：1993-10-25
申请人： Robert J. Wojnarowski , Charles W. Eichelberger , William P. Kornrumpf
发明人： Robert J. Wojnarowski , Charles W. Eichelberger , William P. Kornrumpf
IPC分类号： H01L23/538 , H01L23/02 , H01L23/12
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L2224/2402 , H01L2224/24227 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01052 , H01L2924/01058 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/10329 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011
摘要： A high density interconnect structure is rendered suitable for the packaging of overlay sensitive chips by providing a cavity in the high density interconnect structure which spaces the sensitive surface of such chips from the overlying high density interconnect structure in a manner which prevents undesired interactions between the dielectric of the high density interconnect structure and the chip.
摘要翻译：通过在高密度互连结构中提供空腔使得高密度互连结构适合于覆盖敏感芯片的封装，其将这种芯片的敏感表面与上覆的高密度互连结构隔离，以防止电介质之间的不期望的相互作用的高密度互连结构和芯片。

77. 发明授权

US5258647A Electronic systems disposed in a high force environment 失效
标题翻译：处于高强度环境中的电子系统
公开(公告)号：US5258647A
公开(公告)日：1993-11-02
申请号：US936712
申请日：1992-08-26
申请人： Robert J. Wojnarowski , Charles W. Eichelberger
发明人： Robert J. Wojnarowski , Charles W. Eichelberger
IPC分类号： H01L23/00 , H01L23/498 , H01L23/538 , H01L29/78
CPC分类号： H01L23/562 , H01L23/4985 , H01L23/5389 , H01L24/24 , H01L24/75 , H01L24/82 , H01L2224/2402 , H01L2224/24225 , H01L2224/24227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/75315 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/19041
摘要： A high acceleration object includes an electronic system which is operable at accelerations in excess of 20,000 g. Connections between integrated circuit chips and other portions of the electronic system are provided by metallization patterns disposed on polymer dielectric layers which are self-supporting across gaps between components. A high density interconnect structure is disposed within the cavity of a hermetically sealed package.
摘要翻译：高加速度对象包括可在超过20,000g的加速度下操作的电子系统。集成电路芯片和电子系统的其它部分之间的连接由设置在聚合物电介质层上的金属化图案提供，其跨组件之间的间隙自支撑。高密度互连结构设置在密封封装的空腔内。

78. 发明授权

US5241456A Compact high density interconnect structure 失效
标题翻译：紧密的高密度互连结构
公开(公告)号：US5241456A
公开(公告)日：1993-08-31
申请号：US548462
申请日：1990-07-02
申请人： Walter M. Marcinkiewicz , Charles W. Eichelberger , Robert J. Wojnarowski
发明人： Walter M. Marcinkiewicz , Charles W. Eichelberger , Robert J. Wojnarowski
IPC分类号： H01L23/52 , H01L23/538 , H01L25/00
CPC分类号： H01L25/105 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/1627
摘要： An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness to the thickness of the semiconductor chips plus the combined thickness of the high density interconnect structure's dielectric and conductive layers. In the two-sided structures, feedthroughs, which are preferably hermetic, provide connections between opposite sides of the substrate. Substrates of either of these types may be stacked to form a three-dimensional structure. Means for connecting between adjacent substrates are preferably incorporated within the boundaries of the stack rather than on the outside surface thereof.

79. 发明授权

US5214655A Integrated circuit packaging configuration for rapid customized design and unique test capability 失效
标题翻译：集成电路封装配置，快速定制设计和独特的测试能力
公开(公告)号：US5214655A
公开(公告)日：1993-05-25
申请号：US784094
申请日：1991-10-28
申请人： Charles W. Eichelberger , Kenneth B. Welles, II , Robert J. Wojnarowski
发明人： Charles W. Eichelberger , Kenneth B. Welles, II , Robert J. Wojnarowski
IPC分类号： G01R31/3185 , H01L23/538
CPC分类号： H01L23/5382 , G01R31/318505 , H01L2924/0002 , H01L2924/3011
摘要： A packaged electronics system, having respective portions each with respective input and output ports, and having interconnection busses between certain of these ports, is tested as follows. Each input port has a set of first transmission gates associated therewith for selectively disconnecting it during testing from the end of each interconnection bus connected bit during normal operation. Each input port has a second set of transmission gates associated therewith for selectively applying test vectors thereto during testing as provided in parallel form from a serially loaded shift register. Each output port connects to the input connections of a respective set of tristate drivers for selectively applying its output signals at relatively low source impedance to at least one interconnection bus connected from the output connections of that set of tristate drivers. A shift register converts the signals appearing in parallel at least one end of each interconnection bus to a concatenation of test results in serial form.
摘要翻译：具有相应部分的封装电子系统各自具有相应的输入和输出端口，并且在这些端口中的某些端口之间具有互连总线，如下进行测试。每个输入端口具有与其相关联的一组第一传输门，用于在正常操作期间从每个互连总线连接的位的端部进行测试时选择性地断开它。每个输入端口具有与之相关联的第二组传输门，用于在测试期间选择性地将测试向量应用于串行装载的移位寄存器的并行形式。每个输出端口连接到相应组的三态驱动器的输入连接，用于选择性地将其输出信号以相对低的源阻抗施加到从该组三态驱动器的输出连接连接的至少一个互连总线。移位寄存器将并联出现的每个互连总线的至少一端的信号以串行形式连接到测试结果。

80. 发明授权

US5200810A High density interconnect structure with top mounted components 失效
标题翻译：高密度互连结构与顶部安装组件
公开(公告)号：US5200810A
公开(公告)日：1993-04-06
申请号：US504749
申请日：1990-04-05
申请人： Robert J. Wojnarowski , Charles W. Eichelberger
发明人： Robert J. Wojnarowski , Charles W. Eichelberger
IPC分类号： H01L23/52 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/07 , H01L25/18 , H01L27/00 , H05K1/02 , H05K1/14 , H05K1/18
CPC分类号： H01L23/5389 , H01L2224/05554 , H01L2224/16225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H05K1/181 , H05K1/182 , Y10S257/93
摘要： The functionality, versatility and connection and packing density of a high density interconnect structure is enhanced by mounting one or more components on top of the high density interconnect structure for connection to conductors of the high density interconnect structure and the chips embedded within the high density interconnect structure. Both active and passive components may be mounted in this manner, as may components which would be adversely affected by high density interconnect structure fabrication temperatures or by the presence of the high density interconnect structure dielectric.

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