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    • 79. 发明申请
    • Patterned wafer inspection method and apparatus therefor
    • 图案化晶圆检查方法及其设备
    • US20050139772A1
    • 2005-06-30
    • US11016990
    • 2004-12-21
    • Masaki HasegawaHisaya Murakoshi
    • Masaki HasegawaHisaya Murakoshi
    • G01N23/225G21K7/00H01L21/66G01N23/00
    • G01N23/225H01J37/265H01J37/29H01J2237/24585H01J2237/24592
    • A defect inspection apparatus is provided which allows a technology for inspecting a pattern on a wafer by using an electron beam to implement a high-resolution and higher-speed inspection. A semiconductor wafer is irradiated with an electron beam and electrons reflected in the vicinity of the wafer are detected. The presence or absence of a defect and the location thereof are measured by forming an image from only a component which changes with a periodicity larger than a size of a circuit pattern or the repetition periodicity thereof by using lenses and comparing an image signal with a preset value. Since only the component which changes with a periodicity larger than the size of the circuit pattern with a surface potential distortion and the repetition periodicity thereof is observed with a resolution lower than required to observe the pattern itself instead of detecting a defect through a comparison between extremely small pattern images, an inspection throughput can be increased exponentially compared with that of a conventional SEM inspection.
    • 提供了一种缺陷检查装置,其允许通过使用电子束来检查晶片上的图案以实现高分辨率和高速检查的技术。 用电子束照射半导体晶片,并检测在晶片附近反射的电子。 缺陷的存在或不存在以及其位置是通过使用仅使用通过使用透镜的电路图案的尺寸或重复周期的周期性变化的分量形成图像来测量的,并且将图像信号与预设 值。 由于仅以比通过观察图案本身所需的分辨率低的分辨率观察周期性大于具有表面电位失真和重复周期的电路图案的尺寸的分量,而不是通过极端的比较来检测缺陷 与传统SEM检查相比,小图案图像的检查吞吐量可以指数增加。