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71. 发明申请

US20120297618A1 PRINTED CIRCUIT BOARDS BY MASSIVE PARALLEL ASSEMBLY 审中-公开
标题翻译：印刷电路板通过大型平行线组装
公开(公告)号：US20120297618A1
公开(公告)日：2012-11-29
申请号：US13571252
申请日：2012-08-09
申请人： JengPing Lu , Eugene M. Chow
发明人： JengPing Lu , Eugene M. Chow
IPC分类号： H05K3/00
CPC分类号： H05K1/142 , H05K1/0286 , H05K1/14 , H05K3/368 , H05K2201/09963 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern.
摘要翻译：形成互连衬底的方法包括提供至少两个单元电池，布置单元电池以形成期望的电路图案，以及连接单元电池以形成具有所需电路图案的互连衬底。

72. 发明授权

US08272392B2 Electrostatically addressable microvalves 有权
标题翻译：静电寻址微型阀
公开(公告)号：US08272392B2
公开(公告)日：2012-09-25
申请号：US12818788
申请日：2010-06-18
申请人： Ashish Pattekar , Eugene M. Chow , Eric Peeters
发明人： Ashish Pattekar , Eugene M. Chow , Eric Peeters
IPC分类号： F16K31/126 , F16K7/02
CPC分类号： F16K99/0001 , B01L3/502738 , B01L2200/12 , B01L2300/0819 , B01L2300/0887 , B01L2400/0655 , F16K99/0026 , Y10T137/0318 , Y10T137/0391 , Y10T137/87249
摘要： A method of controlling a main fluid in a conduit using a microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture in response to an electric field applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid, thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane into and out of the conduit, thereby controlling the flow of the main fluid by opening or closing the conduit.
摘要翻译：描述了使用微型阀控制导管中的主流体的方法。微型阀包括致动孔层中相应的致动孔。响应于通过致动孔层附近的电荷分布施加的电场，控制流体流过致动孔。在一个实施例中，电场可以调节致动孔的打开和关闭，从而控制控制流体的流动。在第二实施例中，控制流体是电流变流体，其中电场控制ER流体的粘度，由此控制通过致动孔的流体流动。在两个实施例中，控制流体的流动控制柔性膜进出导管的伸展，从而通过打开或关闭导管来控制主流体的流动。

73. 发明申请

US20120067637A1 Interposer with microspring contacts and methods of making and using same 有权
标题翻译：具有微球接触的插入物及其制造和使用方法
公开(公告)号：US20120067637A1
公开(公告)日：2012-03-22
申请号：US12887814
申请日：2010-09-22
申请人： Eugene M. Chow
发明人： Eugene M. Chow
IPC分类号： H05K1/11 , H05K3/00
CPC分类号： H05K3/32 , G01R1/06727 , H01L21/56 , H01L21/6835 , H01L23/3157 , H01L23/48 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/72 , H01L24/73 , H01L2221/68331 , H01L2221/68377 , H01L2221/68381 , H01L2224/1161 , H01L2224/1182 , H01L2224/1191 , H01L2224/13008 , H01L2224/13012 , H01L2224/13016 , H01L2224/13022 , H01L2224/13026 , H01L2224/131 , H01L2224/1355 , H01L2224/13564 , H01L2224/136 , H01L2224/16225 , H01L2224/48091 , H01L2224/81192 , H01L2224/81801 , H01L2224/819 , H01L2924/0001 , H01L2924/01006 , H01L2924/01012 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/01093 , H01L2924/014 , H01L2924/14 , H05K3/281 , H05K3/4007 , H05K3/4092 , H05K2201/10378 , Y10T29/49124 , Y10T29/49147 , H01L2924/00014 , H01L2924/00 , H01L2224/13099
摘要： An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer.
摘要翻译：包括应力设计的非平面微球的插入件可以提供布置在插入件上方和下方的电子结构的焊盘的互连。位于插入件的底表面处的用于接触的微小弹簧的锚定部分与位于微弹簧的自由部分中的微小弹簧的末端之间的侧向偏移在插入件的顶表面上接触和偏转允许装置的互连具有不同的焊盘间距。自由部分的微针接触允许器件的临时互连，而焊接在自由部分上的焊料允许器件永久连接到插入器。

74. 发明授权

US08080293B2 Micro-machined structure production using encapsulation 有权
标题翻译：微加工结构生产采用封装
公开(公告)号：US08080293B2
公开(公告)日：2011-12-20
申请号：US12728047
申请日：2010-03-19
申请人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
发明人： Thomas Hantschel , Sven Kosgalwies , Eugene M. Chow , Gordon Todd Jagerson, Jr.
IPC分类号： H01R12/00
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译：微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

75. 发明申请

US20110223778A1 MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER 有权
标题翻译：具有多级插补器的多芯片模块
公开(公告)号：US20110223778A1
公开(公告)日：2011-09-15
申请号：US12719975
申请日：2010-03-09
申请人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
发明人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
IPC分类号： H01R12/02 , B23P11/00 , H01R43/16
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/6835 , H01L23/13 , H01L23/147 , H01L23/15 , H01L23/49827 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L2221/68309 , H01L2221/68345 , H01L2223/54426 , H01L2223/54473 , H01L2224/13 , H01L2224/13016 , H01L2224/131 , H01L2224/136 , H01L2224/16237 , H01L2224/81005 , H01L2224/81007 , H01L2224/81136 , H01L2224/81138 , H01L2224/81141 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/81901 , H01L2924/0001 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15156 , H01L2924/15787 , Y10T29/49165 , Y10T29/49204 , Y10T29/49895 , Y10T29/49947 , H01L2924/00012 , H01L2224/13099 , H01L2924/00
摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.
摘要翻译：描述了包括多层插入板的多层插入板和多芯片模块（MCM）。多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到第一个微型弹簧连接器。类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧连接器

76. 发明申请

US20100285700A1 Curved Spring Structure With Downturned Tip 有权
标题翻译：弯曲的弹簧结构与低调的尖端
公开(公告)号：US20100285700A1
公开(公告)日：2010-11-11
申请号：US12845690
申请日：2010-07-28
申请人： Eugene M. Chow , Dirk DeBruyker
发明人： Eugene M. Chow , Dirk DeBruyker
IPC分类号： H01R4/48
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06744 , G01R1/06761
摘要： A curved spring structure includes a base (anchor) section extending parallel to a planar substrate surface, a cantilever section extending away from the substrate surface, and an optional elongated section extending from the base section along the substrate surface under the cantilevered section. The cantilever section includes a body portion integrally attached at a lower end to the anchor section and extending at an acute angle relative to the planar surface, and a curved portion integrally attached to an upper end of the body portion and including a downturned tip. A middle section of the curved portion is disposed a first distance away from the planar surface of the substrate, and the downturned tip is disposed a second distance away from the planar surface of the substrate, the first distance being greater than the second distance.
摘要翻译：弯曲的弹簧结构包括平行于平面衬底表面延伸的基部（锚）部分，远离衬底表面延伸的悬臂部分，以及从底部部分沿悬臂部分下方的衬底表面延伸的可选的细长部分。悬臂部分包括主体部分，其整体地附接到锚固部分的下端并相对于平坦表面以锐角延伸;以及弯曲部分，其整体地附接到主体部分的上端并且包括下降的尖端。弯曲部分的中间部分设置成离开基板的平面表面的第一距离，并且下端尖端设置成离开基板的平面表面第二距离，第一距离大于第二距离。

77. 发明申请

US20100251914A1 IMAGING MEMBER 审中-公开
标题翻译：成像会员
公开(公告)号：US20100251914A1
公开(公告)日：2010-10-07
申请号：US12416189
申请日：2009-04-01
申请人： Jing Zhou , Eugene M. Chow , Nancy Y. Jia
发明人： Jing Zhou , Eugene M. Chow , Nancy Y. Jia
IPC分类号： B41N1/00
CPC分类号： B41C1/1041 , B41M1/06 , B41M5/368
摘要： An imaging member is disclosed having a surface layer comprising a heat-sensitive material whose surface compatibility to printing agents, such as toners and inks, can be substantially reversed in response to small changes in temperature. The imaging member is suitable for use in lithographic and printing applications, permitting reversible switching between compatibility states of printing agents, such as between hydrophilic and hydrophobic states or oleophilic and oleophobic states, and enabling rapid production of images on a recording medium.
摘要翻译：公开了一种成像构件，其具有包括热敏材料的表面层，其与打印剂（例如调色剂和墨水）的表面相容性可以响应于温度的微小变化而基本上反转。成像构件适用于平版印刷和印刷应用，允许打印剂的相容性状态之间的可逆切换，例如在亲水和疏水状态之间或亲油和疏油状态下，以及使得能够在记录介质上快速生成图像。

78. 发明授权

US07749396B2 Method of manufacturing fine features for thin film transistors 有权
标题翻译：制造薄膜晶体管精细特征的方法
公开(公告)号：US07749396B2
公开(公告)日：2010-07-06
申请号：US11388731
申请日：2006-03-24
申请人： Eugene M. Chow , William S. Wong , Michael Chabinyc , Ana Claudia Arias
发明人： Eugene M. Chow , William S. Wong , Michael Chabinyc , Ana Claudia Arias
IPC分类号： H01B13/00 , C23F1/00
CPC分类号： H01L29/4908 , H01L27/124 , H01L27/1292
摘要： A process for fabricating fine features such as small gate electrodes on a transistor. The process involves the jet-printing of a mask and the plating of a metal to fabricate sub-pixel and standard pixel size features in one layer. Printing creates a small sub-pixel size gap mask for plating a fine feature. A second printed mask may be used to protect the newly formed gate and etch standard pixel size lines connecting the small gates.
摘要翻译：一种在晶体管上制造诸如小栅电极的精细特征的工艺。该方法涉及一种掩模的喷墨印刷和金属镀层，以在一层中制造亚像素和标准像素尺寸特征。打印创建一个小的子像素大小的间隙掩模，用于电镀精细特征。可以使用第二印刷掩模来保护新形成的栅极并蚀刻连接小栅极的标准像素尺寸线。

79. 发明申请

US20090077807A1 Self-Releasing Spring Structures And Methods 有权
标题翻译：自我释放弹簧结构与方法
公开(公告)号：US20090077807A1
公开(公告)日：2009-03-26
申请号：US12256060
申请日：2008-10-22
申请人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
发明人： Thomas Hantschel , Sven Kosgalwies , David K. Fork , Eugene M. Chow
IPC分类号： B23P13/00
CPC分类号： G01R1/06716 , G01R3/00 , Y10T29/49609
摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
摘要翻译：根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量导致剥离力高于自释放层和应力金属层之间的粘附力。此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中，在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

80. 发明授权

US07344928B2 Patterned-print thin-film transistors with top gate geometry 有权
标题翻译：具有顶栅几何形状的图案印刷薄膜晶体管
公开(公告)号：US07344928B2
公开(公告)日：2008-03-18
申请号：US11193847
申请日：2005-07-28
申请人： William S. Wong , Rene A. Lujan , Eugene M. Chow
发明人： William S. Wong , Rene A. Lujan , Eugene M. Chow
IPC分类号： H01L21/84
CPC分类号： H01L29/41733 , H01L27/124 , H01L27/1285 , H01L27/1288 , H01L27/1292 , H01L29/42384 , H01L29/4908 , H01L29/66757
摘要： A self-aligned, thin-film, top-gate transistor and method of manufacturing same are disclosed. A first print-patterned mask is formed over a metal layer by digital lithography, for example by printing with a phase change material using a droplet ejector. The metal layer is then etched using the first print-patterned mask to form source and drain electrodes. A semiconductive layer and an insulative layer are formed thereover. A layer of photosensitive material is then deposited and exposed through the substrate, with the source and drain electrodes acting as masks for the exposure. Following development of the photosensitive material, a gate metal layer is deposited. A second print-patterned mask is then formed over the device, again by digital lithography. Etching and removal of the photosensitive material leaves the self-aligned top-gate electrode.
摘要翻译：公开了一种自对准薄膜顶栅晶体管及其制造方法。通过数字光刻在金属层上形成第一印刷图案掩模，例如通过使用液滴喷射器用相变材料进行印刷。然后使用第一印刷图案化掩模蚀刻金属层以形成源极和漏极。在其上形成半导体层和绝缘层。然后将一层感光材料沉积并暴露通过基底，源极和漏极用作曝光的掩模。在感光材料的显影之后，沉积栅极金属层。然后再次通过数字光刻法在器件上形成第二印刷图案掩模。蚀刻和去除感光材料离开自对准顶栅电极。

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