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71. 发明授权

US5013772A Method for the preparation of silicone rubber composition 失效
标题翻译：硅橡胶组合物的制备方法
公开(公告)号：US5013772A
公开(公告)日：1991-05-07
申请号：US387600
申请日：1989-07-28
申请人： Hironao Fujiki , Morio Oohashi
发明人： Hironao Fujiki , Morio Oohashi
IPC分类号： C08K3/36 , C08K5/544 , C08K9/06 , C08L83/04 , C08L83/05 , C08L83/07
CPC分类号： C08K9/06 , C08L83/04 , C08G77/12 , C08G77/20
摘要： A novel method is proposed for the preparation of a curable organopolysiloxane composition which is suitable as a material of a mold-making having excellent mechanical properties and durability in use for replica molding. The method comprises (a) blending a vinyl-containing organopolysiloxane with a hydrophobic reinforcing silica filler and hexamethyl disilazane, optionally, together with water each in a limited amount, (b) subjecting the blend to a heat treatment and (c) admixing the heat-treated blend with an organohydrogenpolysiloxane as a crosslinking agent of the vinyl-containing organopolysiloxane and a platinum compound as a catalyst for promoting the addition reaction between the silicon-bonded vinyl groups and the silicon-bonded hydrogen atoms.
摘要翻译：提出了一种制备可固化的有机基聚硅氧烷组合物的新方法，该组合物适用于具有优异机械性能和用于复制成型的耐久性的模具制造材料。该方法包括：（a）将含乙烯基的有机聚硅氧烷与疏水性增强二氧化硅填料和六甲基二硅氮烷共混，任选地，与水分别有限，（b）使共混物进行热处理，和（c）混合热与有机氢聚硅氧烷作为含乙烯基的有机聚硅氧烷的交联剂和铂化合物作为促进硅键合的乙烯基和与硅键合的氢原子之间的加成反应的催化剂。

72. 发明授权

US4900362A Primer composition 失效
标题翻译：底漆组成
公开(公告)号：US4900362A
公开(公告)日：1990-02-13
申请号：US323025
申请日：1989-03-15
申请人： Hironao Fujiki , Takehide Okami , Yuji Hinoto
发明人： Hironao Fujiki , Takehide Okami , Yuji Hinoto
IPC分类号： C08G77/00 , C08G59/30 , C08G59/40 , C08G77/02 , C09D4/00 , C09D183/04 , C09D183/06 , C09J183/00 , C09J183/06
CPC分类号： C09D4/00 , C08G59/306 , C08G59/4092 , C09D183/06
摘要： A primer composition, comprising:(A) an organosilicon compound having in its molecule i) at least one hydrogen atom bonded to a silicon atom and ii) at least one group selected from silicon-bonded alkoxy groups and silicon-bonded and epoxy group-containing organic groups; and (B) an organic titanium compound. This composition can achieve a durable adhesion even under severe conditions as in high-temperature air, high-temperature water vapor, and high-temperature oil.
摘要翻译：一种底漆组合物，其包含：（A）在其分子中具有i）至少一个与硅原子键合的氢原子的有机硅化合物，和ii）至少一个选自与硅键合的烷氧基和硅键合的环氧基 - 含有机基团; 和（B）有机钛化合物。即使在高温空气，高温水蒸汽和高温油等严酷条件下，也能够实现耐久性的粘合。

73. 发明授权

US4886865A Organopolysiloxane composition 失效
标题翻译：有机聚硅氧烷组合物
公开(公告)号：US4886865A
公开(公告)日：1989-12-12
申请号：US169849
申请日：1988-03-18
申请人： Masayuki Ikeno , Hironao Fujiki , Hiroshi Inomata
发明人： Masayuki Ikeno , Hironao Fujiki , Hiroshi Inomata
IPC分类号： C08G77/50 , C08L83/05 , C08L83/07 , C08L83/14
CPC分类号： C08G77/50 , C08L83/14
摘要： The organopolysiloxane composition is useful as a potting or encapsulating material having a gel-like consistency for protecting electronic components even at an extremely low temperature as is encountered in the space industry. The composition is basically of the type in which crosslinks are formed by the addition reaction between silicon-bonded vinyl groups in an organopolysiloxane and silicon-bonded hydrogen atoms in an organohydrogenpolysiloxane but the outstanding cold resistance of the gel-like material obtained from the composition is imparted by incorporating specific silethylene-containing units of the unit formula OSiMe--CH.sub.2 CH.sub.2 --SiMe.sub.2 O.sub.0.5 into the organopolysiloxane in a specified molar content.
摘要翻译：有机聚硅氧烷组合物可用作具有凝胶状稠度的灌封或封装材料，即使在空间工业中遇到的极低温下也能保护电子元件。组合物基本上是通过有机聚硅氧烷中与硅键合的乙烯基与有机氢聚硅氧烷中与硅键合的氢原子之间的加成反应形成交联的类型，但由组合物获得的凝胶状材料的出色的耐寒性为通过将单元式OSiMe-CH 2 CH 2 -SiMe 2 O 0.5的特定的含有亚乙烯基的单元以特定的摩尔含量加入有机聚硅氧烷中。

74. 发明申请

US20100165546A1 CAPACITOR AND METHOD FOR PRODUCING THEREOF 有权
标题翻译：电容器及其制造方法
公开(公告)号：US20100165546A1
公开(公告)日：2010-07-01
申请号：US12280003
申请日：2007-02-21
申请人： Kazuyoshi Yoshida , Tailu Ning , Hironao Fujiki , Mitsuaki Negishi
发明人： Kazuyoshi Yoshida , Tailu Ning , Hironao Fujiki , Mitsuaki Negishi
IPC分类号： H01G9/022 , B05D5/12
CPC分类号： H01G9/0036 , H01G9/028 , H01G9/042 , H01G11/48 , H01G11/52 , H01G11/56 , Y02E60/13 , Y10T29/417
摘要： A capacitor having a high degree of electric strength, a high electrostatic capacity, and a low ESR, which can be readily downsized, is provided. The capacitor according to the present invention includes an anode made of porous valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer. The solid electrolyte layer includes a π conjugated conductive polymer, a polyanion, and an ion-conductive compound.
摘要翻译：提供了可以容易地小型化的具有高电力强度，高静电电容和低ESR的电容器。根据本发明的电容器包括由多孔阀金属制成的阳极，通过氧化阳极表面形成的电介质层和形成在电介质层的表面上的固体电解质层。固体电解质层包括：共轭导电聚合物，聚阴离子和离子导电化合物。

75. 发明授权

US07484556B2 Heat dissipating member 有权
标题翻译：散热构件
公开(公告)号：US07484556B2
公开(公告)日：2009-02-03
申请号：US11527641
申请日：2006-09-27
申请人： Kunihiko Mita , Kazuhiko Tomaru , Yoshitaka Aoki , Hironao Fujiki
发明人： Kunihiko Mita , Kazuhiko Tomaru , Yoshitaka Aoki , Hironao Fujiki
IPC分类号： F28F7/00 , F28F13/00 , H05K7/20
CPC分类号： C09K5/06 , H01L23/3737 , H01L23/4275 , H01L2924/0002 , Y10S165/905 , H01L2924/00
摘要： A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.
摘要翻译：一种散热构件，其设置在发热电子部件之间，其在运转时产生热量并达到高于室温的温度，散热部件的特征在于，散热构件在室温状态下为非流体，电子部件的操作并且获得低粘度，在电子部件的操作期间在发热的同时软化或熔化至少使其表面流化，以便填充电子部件和散热部件而不留下任何实质的空隙，以及散热构件由包含硅树脂和导热填料的组合物形成。

76. 再颁专利

USRE40519E1 Conductive fluoro-resin compositions 失效
标题翻译：导电氟树脂组合物
公开(公告)号：USRE40519E1
公开(公告)日：2008-09-23
申请号：US10246412
申请日：2002-09-19
申请人： Hironao Fujiki , Hiroyasu Hara , Kenichi Fukuda
发明人： Hironao Fujiki , Hiroyasu Hara , Kenichi Fukuda
IPC分类号： C08J5/12 , C08K3/08 , C08L27/14
CPC分类号： H01B1/22 , C08K3/08 , C08K2003/0806 , C08L71/00
摘要： A conductive fluoro-resin composition of the addition reaction curing type is provided comprising (A) a reactive fluorinated polyether compound comprising fluorinated polyether units and having at least two aliphatic unsaturated hydrocarbon radicals in a molecule, (B) a compound having at least two hydrogen atoms each directly attached to a silicon atom, (C) a platinum group metal catalyst, and (D) silver particles. The composition cures into rubbery parts having improved heat resistance, weather resistance and solvent resistance and optionally forming firm bonds to various substrates.
摘要翻译：提供了一种加成反应固化型的导电性氟树脂组合物，其包含（A）包含氟化聚醚单元并且在分子中具有至少两个脂族不饱和烃基的反应性氟化聚醚化合物，（B）具有至少两个氢的化合物各自直接连接到硅原子的原子，（C）铂族金属催化剂和（D）银颗粒。该组合物固化成具有改善的耐热性，耐候性和耐溶剂性的橡胶状部分，并任选地形成与各种基材的牢固粘合。

77. 发明授权

US07417078B2 Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work 失效
标题翻译：电磁波吸收导热组合物和热软化电磁波吸收散热片及散热工作方法
公开(公告)号：US07417078B2
公开(公告)日：2008-08-26
申请号：US10250685
申请日：2002-03-20
申请人： Hironao Fujiki , Kazuhiko Tomaru , Ikuo Sakurai , Akio Suzuki , Kunihiko Mita
发明人： Hironao Fujiki , Kazuhiko Tomaru , Ikuo Sakurai , Akio Suzuki , Kunihiko Mita
IPC分类号： G21F1/10 , C08K3/10 , C08K3/22 , C08L83/06 , H05K7/20
CPC分类号： H05K9/0083
摘要： An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.
摘要翻译：使用电磁波吸收导热组合物形成电磁波吸收散热物品，其放置在发热电子部件之间，发热电子部件在运转时发热，达到高于室温的温度，作为电磁波发生源，以及散热部件。组合物在电子组件操作之前在室温下是非流体的，但是在电子部件的操作期间获得低粘度，在发热时软化或熔化，以使组合物的至少一个表面流化，使得组合物基本上填充电子部件和散热部件之间的任何间隙。

78. 发明申请

US20060083948A1 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods 有权
公开(公告)号：US20060083948A1
公开(公告)日：2006-04-20
申请号：US10540825
申请日：2004-03-23
申请人： Toshiyuki Kawaguchi , Hironao Fujiki , Atsushi Taniguchi , Takashi Gonda , Kazutoki Tahara
发明人： Toshiyuki Kawaguchi , Hironao Fujiki , Atsushi Taniguchi , Takashi Gonda , Kazutoki Tahara
IPC分类号： B32B15/00 , C23C14/00
CPC分类号： H05K9/0083 , H01F10/08 , H01F41/18 , H01F2017/065 , H05K1/0233 , H05K3/28 , Y10T156/10 , Y10T428/25 , Y10T428/26 , Y10T428/31504 , Y10T428/32
摘要： An electromagnetic noise suppressor of the present invention includes a base material 2 containing a binding agent and a composite layer 3 formed by integrating the binding agent that is a part of the base material 2 and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer 3 on the surface of the base material 2 by physical vapor deposition of the magnetic material onto the surface of the base material 2. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.

79. 发明授权

US06740725B2 Room temperature curable organopolysiloxane compositions 失效
标题翻译：室温可固化的有机聚硅氧烷组合物
公开(公告)号：US06740725B2
公开(公告)日：2004-05-25
申请号：US10183419
申请日：2002-06-28
申请人： Jun Horikoshi , Tsuneo Kimura , Hironao Fujiki
发明人： Jun Horikoshi , Tsuneo Kimura , Hironao Fujiki
IPC分类号： C08G7726
CPC分类号： C08L83/14 , C08K5/5465 , H05K3/285 , Y10S528/901 , C08L83/00
摘要： A room temperature curable organopolysiloxane composition comprising (a) an organopolysiloxane having a specific structure, (b) a alkenoxysilane or substituted alkenoxysilane or a partial hydrolyzate thereof, and (c) a siloxane or a partial hydrolyzate thereof cures into a product which experiences no decline of insulation resistance upon application of voltage in a hot humid environment and is resistant to electrolytic corrosion.
摘要翻译：一种室温可固化的有机聚硅氧烷组合物，其包含（a）具有特定结构的有机聚硅氧烷，（b）烯氧基硅烷或取代的烯氧基硅烷或其部分水解产物，和（c）硅氧烷或其部分水解产物固化成不会下降的产物的绝缘电阻，在耐潮湿环境下施加电压并且耐电解腐蚀。

80. 发明授权

US06342178B1 Replica molding 失效
标题翻译：复制成型
公开(公告)号：US06342178B1
公开(公告)日：2002-01-29
申请号：US08936553
申请日：1997-09-24
申请人： Yasuhiko Matsuoka , Tarou Kita , Hironao Fujiki , Takafumi Sakamoto , Shohei Nakamura , Kousi Anai
发明人： Yasuhiko Matsuoka , Tarou Kita , Hironao Fujiki , Takafumi Sakamoto , Shohei Nakamura , Kousi Anai
IPC分类号： B29C3508
CPC分类号： B29C39/02 , B29C33/3857 , B29C35/0888 , B29K2883/00
摘要： Replicas are molded by curing a photo-curable liquid silicone rubber composition to form a transparent mother mold having a cavity corresponding to the outer contour of a master model, casting a photo-curable liquid resin into the mold cavity, and irradiating light to the liquid resin through the mold wall. Replicas can be fabricated by simple steps and within a short time.
摘要翻译：通过固化光固化液体硅橡胶组合物来形成复制品，以形成具有对应于主模型的外轮廓的空腔的透明母模，将光可固化液体树脂浇铸到模腔中，并将光照射到液体树脂通过模具壁。复制品可以通过简单的步骤在短时间内制造。

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