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    • 2. 发明授权
    • Electron multipler and electron detector
    • 电子倍增器和电子探测器
    • US08022606B2
    • 2011-09-20
    • US12715570
    • 2010-03-02
    • Akio SuzukiEtsuo IizukaAkihiro KageyamaMotohiro Suyama
    • Akio SuzukiEtsuo IizukaAkihiro KageyamaMotohiro Suyama
    • H01J43/06
    • H01J43/246
    • An electron multiplier that can easily obtain characteristics according to a purpose is provided. By bonding a marginal portion 23 of an MCP 2 and a marginal portion 33 of an MCP 3 to each other via a conductive spacer layer 7, a gap 12 is formed between channel portions 22, 32. Therefore, when the electron multiplier is used for a purpose that requires a particularly high gain, by adjusting the thickness of the spacer layer 7, the gain can be increased by increasing the gap 12. In addition, when the electron multiplier is used for a purpose that requires an increase in gain as well as time characteristics, by adjusting the thickness of the spacer layer 7, the size of the gap 12 can be adjusted so that desired characteristics are obtained. Consequently, by only adjusting the thickness of the spacer layer 7, characteristics according to the purpose can be easily obtained.
    • 提供了可以容易地根据目的获得特性的电子倍增器。 通过经由导电间隔层7将MCP2的边缘部分23和MCP 3的边缘部分33彼此结合,在通道部分22,32之间形成间隙12.因此,当电子倍增器用于 通过调整间隔层7的厚度,需要特别高的增益的目的可以通过增加间隙12来增加增益。此外,当电子倍增器用于增加增益的目的时 作为时间特性,通过调整间隔层7的厚度,可以调节间隙12的尺寸,从而获得期望的特性。 因此,通过仅调整间隔层7的厚度,可以容易地获得根据目的的特性。
    • 5. 发明授权
    • MCP unit, MCP detector and time of flight mass spectrometer
    • MCP单元,MCP检测器和飞行时间质谱仪
    • US07564043B2
    • 2009-07-21
    • US11802771
    • 2007-05-24
    • Masahiro HayashiYuuya WashiyamaAkio SuzukiMasahiko Iguchi
    • Masahiro HayashiYuuya WashiyamaAkio SuzukiMasahiko Iguchi
    • H01J37/252
    • H01J43/246H01J49/025
    • The present invention relates to an MCP unit or the like having a structure intended to achieve a desired time response characteristic, without depending on a limitation imposed by a channel diameter of MCP. The MCP unit comprises the MCP for releasing secondary electrons internally multiplied in response to incidence of charged particles, an anode arranged in a position where the secondary electrons reach, and an acceleration electrode arranged between the MCP and the anode. In particular, the acceleration electrode includes a plurality of openings which permit passing of the secondary electrons migrating from the MCP toward the anode. Further, the acceleration electrode is arranged such that the shortest distance B between the acceleration electrode and the anode is longer than the shortest distance A between the MCP and the acceleration electrode. Thus, an FWHM of a detected peak appearing in response to the incidence of the charged particles is remarkably shortened.
    • 本发明涉及具有旨在实现所需时间响应特性的结构的MCP单元等,而不依赖于MCP的通道直径所施加的限制。 MCP单元包括MCP,用于响应于带电粒子的入射而布置二次电子的内部倍增的电子,设置在二次电子到达的位置的阳极以及布置在MCP和阳极之间的加速电极。 特别地,加速电极包括允许二次电子从MCP向阳极迁移的多个开口。 此外,加速电极被布置成使得加速电极和阳极之间的最短距离B比MCP和加速电极之间的最短距离A长。 因此,响应于带电粒子的入射出现的检测峰的FWHM显着缩短。
    • 7. 发明申请
    • BONDING MATERIAL AND SEMICONDUCTOR SUPPORTING DEVICE
    • 结合材料和半导体支持设备
    • US20080193741A1
    • 2008-08-14
    • US12025903
    • 2008-02-05
    • Tomoyuki FUJIIAkio Suzuki
    • Tomoyuki FUJIIAkio Suzuki
    • B32B7/12B32B15/04B32B5/16
    • C09J183/04C08G77/12C08G77/20C08K3/22C08L83/00C08L83/04Y10T428/257Y10T428/2804Y10T428/2813
    • The bonding material is formed of a cured sheet composed of an addition curable silicone adhesive agent, and the addition curable silicone adhesive agent contains an organopolysiloxane containing two or more vinyl groups per molecule; an organopolysiloxane resin containing a unit (hereinafter, “M”) represented by R3SiO1/2 (R is a monovalent hydrocarbon group having 1 to 6 carbon atoms and containing no aliphatic unsaturated bond) and a unit (hereinafter, “Q”) represented by Si4/2 in a molar ratio (M/Q ratio) equal to or more than 0.6 to equal to or less than 0.6 to 1.6; an organohydrogenpolysiloxane containing a silicon atom-bonding hydrogen atom; a platinum catalyst; and a heat conductive filler whose content falls within the range equal to or more than 20 vol % to equal to or less than to 50 vol %.
    • 接合材料由加成固化性硅酮粘合剂构成的固化片形成,加成固化性硅酮粘合剂含有每分子含有两个以上乙烯基的有机聚硅氧烷; 含有由R 3 SiO 1/2 1/2表示的单元(以下称为“M”)的有机聚硅氧烷树脂(R为碳原子数1〜6的1价烃基,含有 没有脂族不饱和键)和由Si 4/2/2表示的单元(以下称为“Q”),摩尔比(M / Q比)等于或大于0.6至等于或小于 0.6〜1.6; 含有硅原子键合氢原子的有机氢聚硅氧烷; 铂催化剂; 以及其含量在20体积%以下且50体积%以下的范围内的导热性填料。