会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Thermal conductive composite silicone rubber sheet
    • 导热复合硅橡胶板
    • US5705258A
    • 1998-01-06
    • US670759
    • 1996-06-21
    • Takehide OkamiTokio Sekiya
    • Takehide OkamiTokio Sekiya
    • B32B25/02B29C37/00B32B25/08B32B5/16B32B9/00B32B15/02B32B17/02
    • B29C37/0075B32B25/08Y10T428/24058Y10T428/24124Y10T428/24364Y10T428/24843Y10T428/2486Y10T428/24975Y10T428/249921Y10T442/124
    • The composite silicone rubber sheet comprises a thermal conductive silicone rubber layer, both surfaces of which are tacky, containing a thermal conductive filler such as aluminum oxide and having a Asker C hardness of 5 to 50 and a thickness of 0.4 mm or less; at least one reinforcing sheet such as glass cloth arranged within said silicone rubber layer; and a releasable protective sheet such as a release paper covered on at least one tacky surface of said silicone rubber layer. Since the composite silicone rubber sheet is superior in thermal conductivity and has a good flexibility and tackiness, when used as a heat dissipating insulation sheet, the composite silicone rubber sheet has the advantages of being superior in adherence, free of oil-bleeding, suitable for mass-production, and capable of not lowering workability in assembling electronic parts and the like. The composite silicone rubber sheet is thin and lightweight and has a superior thermal conductivity, so that it can be used in the heat dissipation of a display panel for mounting on motor vehicles, railway vehicles or aircrafts.
    • 复合硅橡胶片包括两个表面都是粘性的导热硅橡胶层,其中包含导热填料如氧化铝,Asker C硬度为5至50,厚度为0.4mm或更小; 布置在所述硅橡胶层内的至少一个加强片如玻璃布; 以及可剥离的保护片,例如覆盖在所述硅橡胶层的至少一个粘性表面上的剥离纸。 由于复合硅橡胶片的导热性优异并且具有良好的柔软性和粘合性,因此,作为散热绝缘片使用时,复合硅橡胶片的附着性优异,无油渍,适合于 批量生产,并且能够降低组装电子部件等的可操作性。 复合硅橡胶片薄且重量轻,具有优良的导热性,因此可用于显示面板的散热,用于安装在机动车辆,铁路车辆或飞机上。
    • 2. 发明授权
    • Organopolysiloxane composition and process for producing cured product
of the same
    • 有机聚硅氧烷组合物及其生产方法
    • US5384075A
    • 1995-01-24
    • US37588
    • 1993-03-26
    • Takehide Okami
    • Takehide Okami
    • C08K3/04C08K3/08C08K3/22C08K5/5435C08L83/04C08L83/05C08L83/07C09J9/02C09J11/04C09J183/00C09J183/04B29C45/00
    • C08L83/04C08G77/045C08G77/12C08G77/14C08G77/18C08G77/20
    • An addition-curable type organopolysiloxane composition having a volume resistivity of 10.sup.7 .OMEGA.cm or below, comprising (A) an organopolysiloxane having at least two alkenyl group in its molecule and a viscosity at 25.degree. C. of from 100 to 200,000 cSt, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in its molecule, (C) a platinum group metal catalyst, (D) an organosilicon compound which has at least one silicon-bonded hydrogen atom in its molecule and in which at least one member selected from the group consisting of epoxy group-containing organic groups and alkoxy groups is attached to a silicon atom, and (E) an electrically conductive filler. This composition can be cured by an ultra high frequency heating system to form an adhesive cured product. It is therefore possible to obtain cured products with stable physical properties under constantly fixed conditions irrespective of the heat capacity of adherends.
    • (A)在分子中具有至少两个烯基的有机聚硅氧烷和25℃下的粘度为100至200,000cSt的(B(B))的体积电阻率为10 7Ω/ cm以下的加成固化型有机基聚硅氧烷组合物 )在其分子中具有至少两个与硅键合的氢原子的有机氢聚硅氧烷,(C)铂族金属催化剂,(D)在其分子中具有至少一个与硅键合的氢原子的有机硅化合物,其中至少一个 选自由含环氧基的有机基团和烷氧基组成的基团的硅原子连接到硅原子上,(E)导电填料。 该组合物可以通过超高频加热系统固化以形成粘合剂固化产物。 因此,可以在恒定的固定条件下获得具有稳定物理性质的固化物,而不管被粘物的热容。
    • 4. 发明授权
    • Room temperature-curable organopolysiloxane composition
    • 室温可固化的有机聚硅氧烷组合物
    • US4623693A
    • 1986-11-18
    • US762555
    • 1985-08-05
    • Yoshio InoueTakehide OkamiKoji YokooHitoshi Kinami
    • Yoshio InoueTakehide OkamiKoji YokooHitoshi Kinami
    • C08L83/00C08K5/00C08K5/5419C08K5/5425C08K5/57C08L83/04C08L83/06C08K3/02
    • C08L83/04C08G77/16Y10S528/901
    • The room temperature-curable organopolysiloxane composition of the invention is characteristic in the remarkably increased adhesive bonding strength of the rubber of the composition to the surface of a substrate of metals, plastics and others on which the composition has been cured. The composition is also advantageous in the improved thixotropy despite the admixture of an adhesion improver mentioned below. Thus, the composition comprises, in addition to conventional components in a deacidification type room temperature curable organopolysiloxane composition, a specific organic silicon compound represented by the general formula(R.sup.3 O).sub.b (MeCOO).sub.3-b Si--O--R.sup.4 --O--Si(OCOMe).sub.3-b (OR.sup.3).sub.b,in which R.sup.3 is a monovalent hydrocarbon group, R.sup.4 is a divalent hydrocarbon group or a polyoxyalkylene group of the formula --C.sub.x H.sub.2x --O).sub.n C.sub.x H.sub.2x --, x being 2 to 4 and n being a positive integer, and b is 1 or 2.
    • 本发明的室温可固化的有机基聚硅氧烷组合物的特征在于组合物的橡胶与其组合物已经固化的金属,塑料和其它基材的表面的粘合强度显着增加。 尽管混合以下提及的粘合改进剂,该组合物在改善的触变性方面也是有利的。 因此,除了脱酸型室温可固化的有机聚硅氧烷组合物中的常规组分外,组合物还包含由通式(R3O)b(MeCOO)3-bSi-O-R4-O-Si(MeCOO)3-bSi-O-R4-O-Si OCOMe)3-b(OR3)b,其中R3是一价烃基,R4是二价烃基或式-CxH2x-O的聚氧化烯基)nCxH2x-,x是2-4,n是正的 整数和b为1或2。