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    • 9. 发明授权
    • Room temperature-curable, heat-conductive silicone rubber composition
    • 室温固化,导热硅橡胶组合物
    • US07601773B2
    • 2009-10-13
    • US11873929
    • 2007-10-17
    • Jun HorikoshiTsuneo Kimura
    • Jun HorikoshiTsuneo Kimura
    • C08K3/08
    • C08L83/04C08G77/16C08G77/18C08K3/08C08K3/22Y10T428/31663C08L83/00
    • Provided is a room temperature-curable, heat-conductive silicone rubber composition, including: (A) a diorganopolysiloxane with both molecular chain terminals blocked with hydroxyl groups and/or organooxy groups, (B) a heat-conductive filler other than a palladium powder, (C) an organosilane containing two or more hydrolyzable groups, and/or a partial hydrolysis-condensation product thereof, and (D) a palladium powder. The composition improves on the drawbacks of the conventional technology, is able to suppress the quantity of hydrogen gas produced from the heat-conductive filler, exhibits superior storage properties, and yields a low-hardness cured product upon curing. The cured product is useful as a heat-conductive material for a heat-generating electronic component.
    • 本发明提供一种室温固化型导热性硅橡胶组合物,其包含:(A)分子链末端用羟基和/或有机氧基封端的二有机聚硅氧烷,(B)除钯粉末以外的导热性填料 ,(C)含有两个或更多个可水解基团的有机硅烷和/或其部分水解缩合产物,和(D)钯粉末。 组合物改善了传统技术的缺点,能够抑制由导热填料产生的氢气的量,显示出优异的储存性能,并且在固化时产生低硬度固化产物。 固化产物可用作发热电子部件的导热材料。