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71. 发明授权

US06223429B1 Method of production of semiconductor device 失效
标题翻译：半导体器件的生产方法
公开(公告)号：US06223429B1
公开(公告)日：2001-05-01
申请号：US08981509
申请日：1998-07-30
申请人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
发明人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
IPC分类号： H05K330
CPC分类号： H01L24/83 , H01L23/3121 , H01L23/49816 , H01L23/49883 , H01L24/29 , H01L24/32 , H01L24/97 , H01L25/18 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29384 , H01L2224/29444 , H01L2224/29469 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/8319 , H01L2224/838 , H01L2224/83951 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2924/00 , H01L2224/13111 , H01L2924/00014
摘要： To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.
摘要翻译：为了提供高可靠性的半导体器件结构，其能够降低封装的生产成本，包括芯片的成本，并且即使在长期耐环境测试的条件下也可能导致连接电阻的变化较小。在包括面向下接合到布线板的半导体芯片，其结构是在相对的布线板端子处设置突出的金属部分，而不在芯片的焊盘上形成凸块，整个芯片表面用有机的各向异性导电粘合剂材料，并且芯片的背面的整个或至少一个边缘被密封材料覆盖。

72. 发明授权

US6049128A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US6049128A
公开(公告)日：2000-04-11
申请号：US820631
申请日：1997-03-19
申请人： Makoto Kitano , Ryuji Kohno , Naotaka Tanaka , Akihiro Yaguchi , Tetsuo Kumazawa , Ichiro Anjoh , Hideki Tanaka , Asao Nishimura , Shuji Eguchi , Akira Nagai , Mamoru Mita
发明人： Makoto Kitano , Ryuji Kohno , Naotaka Tanaka , Akihiro Yaguchi , Tetsuo Kumazawa , Ichiro Anjoh , Hideki Tanaka , Asao Nishimura , Shuji Eguchi , Akira Nagai , Mamoru Mita
IPC分类号： H01L21/60 , H01L23/04 , H01L23/12 , H01L23/31 , H01L23/495 , H01L23/48 , H01L23/34 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01052 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/15787
摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
摘要翻译：提供一种半导体器件，具有多个用于外部连接的电极的半导体芯片，除弹性体树脂形成的弹性体树脂部分，其除了多个电极中的至少一些外部结合到半导体芯片，包括树脂的带层，包括表面上的带状布线图案，用于将印刷布线图案接合到带布线图案的多个焊料凸块，用于将半导体芯片的多个电极连接到带布线图案的引线，以及密封用于覆盖引线的树脂，由引线连接的多个电极。弹性体树脂的横向弹性模量不小于50MPa且不大于750MPa。

73. 发明授权

US5703414A Anti-theft apparatus which permits the engine to start prior to ID signal discrimination 失效
标题翻译：防盗装置允许发动机在ID信号识别之前启动
公开(公告)号：US5703414A
公开(公告)日：1997-12-30
申请号：US832175
申请日：1997-04-08
申请人： Eiji Mutoh , Suguru Asakura , Akira Nagai
发明人： Eiji Mutoh , Suguru Asakura , Akira Nagai
IPC分类号： B60R25/04 , B60R25/24
CPC分类号： B60R25/04 , B60R25/24
摘要： An anti-theft apparatus prevents a delay in engine start caused by an ID legitimacy determination performed by an immobilizer. When an ignition key is operated, a starter motor is immediately energized and an engine control unit and a theft detector are actuated at the same time. Then, when independent running of the engine is detected by a detector, an immobilization determining section determines whether an enable code has been provided from the theft detector. If no enable code is present, then the immobilization determining section issues a halt command to the engine control unit. Thus, as soon as the key is turned to the on-position, the engine is started, thereby preventing a delay in engine start caused by the ID determination performed by the immobilizer.
摘要翻译：防盗装置防止由防盗器执行的ID合法性确定引起的发动机起动延迟。当点火钥匙被操作时，起动马达被立即通电，同时启动发动机控制单元和盗窃检测器。然后，当检测器检测到发动机的独立运行时，固定确定部分确定是否从盗窃检测器提供了使能码。如果不存在启用代码，则固定确定部分向发动机控制单元发出停止命令。因此，一旦钥匙转到开启位置，发动机起动，从而防止由防盗器执行的ID确定引起的发动机起动延迟。

74. 发明授权

US5677045A Laminate and multilayer printed circuit board 失效
标题翻译：层压板和多层印刷电路板
公开(公告)号：US5677045A
公开(公告)日：1997-10-14
申请号：US430553
申请日：1995-04-28
申请人： Akira Nagai , Masatsugu Ogata , Shuji Eguchi , Masahiko Ogino , Toshiaki Ishii , Masanori Segawa , Hiroyoshi Kokaku , Ryo Moteki , Ichiro Anjoh
发明人： Akira Nagai , Masatsugu Ogata , Shuji Eguchi , Masahiko Ogino , Toshiaki Ishii , Masanori Segawa , Hiroyoshi Kokaku , Ryo Moteki , Ichiro Anjoh
IPC分类号： B32B27/12 , H01L23/14 , H05K1/03 , B32B7/00 , B32B3/02 , B32B5/12 , B32B5/16
CPC分类号： B32B27/12 , H01L23/145 , H05K1/0373 , H01L2224/48227 , H01L2924/10253 , H01L2924/12044 , H01L2924/15311 , H01L2924/30107 , H01L2924/3025 , H05K2201/015 , H05K2201/0209 , H05K2201/0212 , H05K2201/029 , H05K2201/068 , Y10S428/901 , Y10T428/23986 , Y10T428/24132 , Y10T428/254 , Y10T442/20 , Y10T442/209 , Y10T442/2123 , Y10T442/3854 , Y10T442/3919
摘要： A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.
摘要翻译：能够在其上安装半导体元件的层压体; 包括由海岛结构的树脂部分和织造加强件构成的绝缘层。例如，海岛结构的树脂部分使得岛状树脂以树脂为基体分散。因此，绝缘层在其平面方向上的热膨胀系数为3.0D（ppm / K），玻璃化转变温度为150℃（℃）。由于这些物理性质，可以减少层压体在其上封装半导体元件时的热应力，使得层压体与半导体元件的连接可以高度可靠。

75. 发明授权

US5080965A Prepreg from poly(p-hydroxystyrene), epoxy-modified polybutadiene and maleimide 失效
标题翻译：聚（对羟基苯乙烯），环氧改性聚丁二烯和马来酰亚胺
公开(公告)号：US5080965A
公开(公告)日：1992-01-14
申请号：US487406
申请日：1990-03-26
申请人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
发明人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
IPC分类号： C08G59/34 , B32B27/04 , B32B27/38 , C08F279/02 , C08G59/00 , C08G59/32 , C08G59/40 , C08J5/24 , C08L25/00 , C08L25/18 , C08L63/00 , C08L63/08 , H05K1/03
CPC分类号： C08J5/24 , C08F279/02 , H05K1/0353 , C08J2351/00 , Y10T428/24917 , Y10T442/2475 , Y10T442/2721 , Y10T442/2902 , Y10T442/2951 , Y10T442/3528
摘要： The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly-p-hydroxystyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.

76. 发明授权

US5045381A Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board 失效
标题翻译：热固性树脂组合物，使用树脂组合物的印刷电路板和印刷电路板的制造方法
公开(公告)号：US5045381A
公开(公告)日：1991-09-03
申请号：US413070
申请日：1989-09-27
申请人： Masao Suzuki , Junichi Katagiri , Akira Nagai , Masahiro Suzuki , Akio Takahashi
发明人： Masao Suzuki , Junichi Katagiri , Akira Nagai , Masahiro Suzuki , Akio Takahashi
IPC分类号： C08G18/09 , C08G18/62 , C08G18/67 , C08G73/10 , H01B3/30 , H05K1/03
CPC分类号： C08G18/092 , C08G18/6275 , C08G18/6705 , C08G18/678 , C08G73/1035 , H01B3/302 , H01B3/303 , H05K1/0346 , Y10S428/901 , Y10T156/10 , Y10T428/24917 , Y10T428/31547 , Y10T428/31678
摘要： A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I):A--R.sub.1 --A (I)wherein R.sub.1 is an aromatic group, an alicyclic group or a mixed group thereof and A is a cyanate group or an isocyanate group, and a poly-(p-hydroxystyrene) derivative represented by the following general formula (II): ##STR1## wherein X is a fluorine atom, a bromine atom and a chlorine atom, R.sub.2 is an alkenyl group and an unsaturated carboxyl group, each having 2 to 4 carbon atoms, B is any one of a polymerization initiator residue, a polymerization-terminating agent residue, H and ##STR2## m is an integer of 1 to 4 and n is an integer of 5 to 100, and further containing a compound having at least one N-substituted unsaturated imido group, if required, can produce a printed circuit board of high flame retardness, low dielectric constant, low moisture absorption and a high mechanical strength at an elevated temperature.

77. 发明授权

US4970107A Composite article comprising a copper element and a process for producing it 失效
标题翻译：包含铜元素的复合制品及其制造方法
公开(公告)号：US4970107A
公开(公告)日：1990-11-13
申请号：US383074
申请日：1989-07-21
申请人： Haruo Akahoshi , Kanji Murakami , Yoshihiro Suzuki , Akira Nagai , Kiyonori Kogawa , Akio Takahashi
发明人： Haruo Akahoshi , Kanji Murakami , Yoshihiro Suzuki , Akira Nagai , Kiyonori Kogawa , Akio Takahashi
IPC分类号： H01L21/3205 , H01L23/52 , H05K1/09 , H05K3/38 , H05K3/46
CPC分类号： H05K3/385 , H05K3/384 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1157 , H05K3/4611 , Y10S428/901 , Y10T156/10 , Y10T428/24917 , Y10T428/31 , Y10T428/31678
摘要： To make a composite article comprising a copper element and an adhesive material adhesively bonded to a surface thereof, the surface of the copper element is provided with knife-shaped elongate projections whose opposite flanks are at an average angle of less than 60.degree. to each other. The knife-shaped elongate projections may include rod-shaped projections much smaller than the knife-shaped projections projecting outwardly from the surface of the knife-shaped projections. The knife-shaped projections may be formed by electroless plating and the rod-shaped projections by oxidation and optionally reduction. Bonding strength is improved.

78. 发明授权

US4931507A Composition comprising poly(p-hydroxystrene) derivative, epoxy-modified polybutadiene and aromatic maleimide 失效
标题翻译：组合物，其包含聚（对 - 羟基硬
体）衍生物，环氧改性聚丁二烯和芳族马来酰亚胺
公开(公告)号：US4931507A
公开(公告)日：1990-06-05
申请号：US266406
申请日：1988-11-02
申请人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
发明人： Katuo Sugawara , Akio Takahashi , Junichi Katagiri , Akira Nagai , Masahiro Ono , Toshikazu Narahara
IPC分类号： C08G59/34 , B32B27/04 , B32B27/38 , C08F279/02 , C08G59/00 , C08G59/32 , C08G59/40 , C08J5/24 , C08L25/00 , C08L25/18 , C08L63/00 , C08L63/08 , H05K1/03
CPC分类号： C08J5/24 , C08F279/02 , H05K1/0353 , C08J2351/00 , Y10T428/24917 , Y10T442/2475 , Y10T442/2721 , Y10T442/2902 , Y10T442/2951 , Y10T442/3528
摘要： The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.

79. 发明授权

US4886858A Thermosetting resin and prepreg and laminate using the same 失效
标题翻译：热固性树脂和预浸料和使用其的层压板
公开(公告)号：US4886858A
公开(公告)日：1989-12-12
申请号：US15325
申请日：1987-02-17
申请人： Junichi Katagiri , Akira Nagai , Keiko Tawara , Akio Takahashi , Motoyo Wajima , Toshikazu Narahara , Ryo Hiraga
发明人： Junichi Katagiri , Akira Nagai , Keiko Tawara , Akio Takahashi , Motoyo Wajima , Toshikazu Narahara , Ryo Hiraga
IPC分类号： C08L25/04 , C08F8/00 , C08F12/22 , C08F290/12 , C08F299/00 , C08G59/34 , C08L63/08 , H05K1/03
CPC分类号： C08G59/027 , C08F290/124 , C08F299/00 , C08F8/00 , C08L63/08 , H05K1/034 , Y10S428/901 , Y10T428/24917 , Y10T428/31511 , Y10T428/31529 , Y10T428/31678 , Y10T428/31696 , Y10T442/674
摘要： A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.
摘要翻译：包含特殊聚（对 - 羟基苯乙烯）衍生物树脂和自由基聚合引发剂的热固性树脂组合物，并且如果需要，可以提供环氧改性聚丁二烯，可以提供具有低介电常数，较短的信号延迟时间，良好的耐热性和较短的信号延迟时间的预浸料和层压材料阻燃性，因此适用于生产多层印刷电路板。

80. 发明授权

US4607094A Thermosetting resin composition from aromatic cyanamide 失效
标题翻译：芳香族氰胺的热固性树脂组合物
公开(公告)号：US4607094A
公开(公告)日：1986-08-19
申请号：US697530
申请日：1985-02-01
申请人： Katuo Sugawara , Akio Takahashi , Masahiro Ono , Ritsuro Tada , Motoyo Wajima , Toshikazu Narahara , Akira Nagai
发明人： Katuo Sugawara , Akio Takahashi , Masahiro Ono , Ritsuro Tada , Motoyo Wajima , Toshikazu Narahara , Akira Nagai
IPC分类号： C08G73/00 , C08G73/06 , C08L79/04 , C08G69/14
CPC分类号： C08G73/0655
摘要： The thermosetting resin composition of the present invention is prepared by mixing an aromatic cyanamide compound with a cyclic ester compound and/or a cyclic amide compound. Although a solventless type composition is preferable, the present invention is not limited thereto. The cured product of the present invention can be prepared by heating and curing said thermosetting resin composition. The obtained cured product of the present invention usually contains melamine rings, isomelamine rings and linear polyester and/or a linear polyamide units.
摘要翻译：本发明的热固性树脂组合物通过将芳族氨基氰化合物与环状酯化合物和/或环状酰胺化合物混合来制备。虽然优选无溶剂型组合物，但本发明不限于此。本发明的固化物可以通过加热固化所述热固性树脂组合物来制备。得到的本发明的固化物通常含有三聚氰胺环，异质单胺环和线性聚酯和/或线性聚酰胺单元。

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