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    • 61. 发明授权
    • Chemical bath apparatus and support assembly
    • 化学浴装置和支撑组件
    • US4578137A
    • 1986-03-25
    • US572940
    • 1984-01-23
    • Charles J. Kring
    • Charles J. Kring
    • C23F1/08C23F3/02
    • C23F1/08Y10S220/917Y10S220/918
    • A chemical bath apparatus is disclosed in which an open topped beaker having a heater mounted to the exterior wall thereof is supported in an open topped surrounding housing or shell by a support assembly, the beaker being in spaced relation to the shell. The support assembly includes a sleeve mounted in sealed relation around the heater so as to isolate the same from corrosive fumes and a resilient pad extending over a substantial area of the bottom wall of the beaker for support of substantially the entire weight of the beaker and chemical substance through the bottom wall. Vent openings for convection cooling between the shell and sleeve are also provided.
    • 公开了一种化学浴装置,其中具有安装在其外壁上的加热器的开口顶部烧杯通过支撑组件支撑在敞开的顶部周围的壳体或壳体中,所述烧杯与壳体间隔开。 支撑组件包括以围绕加热器的密封关系安装的套筒,以将其与腐蚀性烟雾隔离,并且弹性垫在烧杯的底壁的大部分区域上延伸,用于基本上支撑烧杯和化学品的整个重量 物质通过底壁。 还提供了用于壳体和套筒之间的对流冷却的通风口。
    • 62. 发明授权
    • Apparatus for wet processing
    • 湿法加工设备
    • US4557785A
    • 1985-12-10
    • US625155
    • 1984-06-27
    • Yuji Ohkuma
    • Yuji Ohkuma
    • C23F1/08H01L21/306B44C1/22C03C15/00C23F1/00
    • C23F1/08H01L21/306Y10S134/902
    • An apparatus and system for wet processing a substrate, which can be used for chemical processing such as etching or washing a semiconductor substrate are disclosed. The apparatus has a processing chamber in which the substrate is wet processed. Processing liquid is injected into the processing chamber through an opening and nozzles, and the substrate is floated in the injected liquid and rotated about its center axis by streams of the injected liquid. The wet processing system is composed from a processing apparatus as mentioned above, a water bearing system which transfers the substrate by means of a water stream, and a spin dryer. The water bearing system also serves as a washing apparatus. Shutters are provided between the water bearing and the processing chamber or the spin dryer, the shutters controlling the water levels between these elements.
    • 公开了一种用于湿处理基板的装置和系统,其可用于化学处理,例如蚀刻或洗涤半导体基板。 该设备具有处理室,其中衬底被湿加工。 处理液体通过开口和喷嘴注入到处理室中,并且基板浮在注入的液体中并且通过喷射液体的流围绕其中心轴线旋转。 湿处理系统由上述处理装置,通过水流传送基板的水承载系统和旋转干燥机构成。 水承载系统还用作洗涤装置。 在水轴承和处理室或旋转干燥器之间提供百叶窗,百叶窗控制这些元件之间的水位。
    • 65. 发明授权
    • Method and apparatus of chemical milling of chemical materials
    • 化学材料化学研磨的方法和装置
    • US4440594A
    • 1984-04-03
    • US427734
    • 1982-09-29
    • Llewelyn B. Stearns
    • Llewelyn B. Stearns
    • C23F1/08C23F1/00
    • C23F1/08
    • The field of this invention relates to an improved apparatus and method for chemical treatment or milling of materials that provides complete control of gases generated during the milling phase. The apparatus consists of a vapor-tight containment for all procedures before, during, and after treatment, i.e., milling which might result in the generation of noxious fumes.To facilitate the treatment of nitrogen oxide gases, air dilution of off-gases is minimized, thus enhancing the reaction transforming the gases to the water soluble form. Reaction kinetics are improved so that near-perfect scrubber efficiency can be achieved.The entire enclosure means is compartmentalized, yet substantially completely vapor-tight to provide a safe environment for personnel (i.e., during handling and inspection of workpieces) and to provide areas for other treatment of the workpieces (i.e., activation of workpiece surfaces by spraying with HCl acid). Workpieces can be transported from one compartment to the next while preserving the integrity of each compartment via a substantially vapor-tight track system between compartments. Each compartment is separated from adjacent compartments by substantially vapor-tight doors.The generation of the greater volume of noxious gases during immersion milling will take place at the immersion tank. The airspace over the tank is delimited by the cover attached to the workpiece holder. This airspace is connected through a venting means to a scrubber system which may separately or in combination treat fumes from the other compartments of the apparatus.
    • 本发明的领域涉及一种用于化学处理或研磨材料的改进的装置和方法,其提供在研磨阶段期间产生的气体的完全控制。 该设备由处理之前,期间和之后的所有程序的蒸汽密封容器组成,即可能导致产生有害烟雾的研磨。 为了促进氮氧化物气体的处理,废气的空气稀释最小化,从而增强将气体转化为水溶性形式的反应。 反应动力学得到改善,从而可以实现接近完美的洗涤器效率。 整个外壳装置是分隔的,但基本上完全是气密的,为人员提供安全的环境(即在工件的处理和检查期间),并为工件的其他处理提供区域(即通过喷涂来激活工件表面 HCl酸)。 工件可以从一个隔间运输到下一个隔间,同时通过隔室之间的基本上气密的轨道系统保持每个隔室的完整性。 每个隔室通过基本上气密的门与相邻的隔室分开。 浸入式研磨过程中会产生较大量的有害气体, 坦克上方的空域由附着在工件支架上的盖子界定。 该空气空间通过排气装置连接到洗涤器系统,洗涤器系统可以单独地或组合地处理来自装置的其它隔室的烟雾。