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    • 3. 发明授权
    • Method for transferring wafers from one processing station to another
sequentially and system therefor
    • 将晶片从一个处理站传送到另一个处理站的方法,以及其系统
    • US5380684A
    • 1995-01-10
    • US115768
    • 1993-09-03
    • Yuji Ohkuma
    • Yuji Ohkuma
    • B01D46/52B65G49/07H01L21/02H01L21/304H01L21/306H01L21/677H01L21/00
    • H01L21/67757Y10S414/135Y10S414/136Y10S414/139Y10S414/141Y10S438/935Y10T29/41
    • A method for transferring wafers from one processing station to another station sequentially, utilizing a transfer system which is installed in a clean bench forming a downward flow of clean air. A plurality of stations is provided for processing wafers in the clean bench. The transfer system comprises at least a single transfer robot carrying a plurality of wafers, the transfer robot being movable from one station to another sequentially for processing, and an exhaust duct is provided along a path of the transfer robot movement, the duct having a plurality of inlets for exhausting the air. The method of the invention comprises (a) providing partition walls for each of the transfer robots, the walls surrounding the plurality of wafers and defining an air flow chamber and an air filter arranged on the top of the chamber, thereby forming a downward air flow in the surrounding chamber, and (b) controlling a total amount of clean air supplied to the transfer system so as to be less than an air supply amount to the clean bench.
    • 一种用于将晶片从一个处理站顺序地传送到另一个站的方法,利用安装在清洁工作台中的传送系统,其形成向下的清洁空气流。 提供了多个站来处理清洁工作台中的晶片。 所述传送系统至少包括承载多个晶片的单个传送机器人,所述传送机器人可以从一个站点依次移动到另一个站点以进行处理,并且沿传送机器人移动的路径设置排气管道,所述管道具有多个 用于排出空气的入口。 本发明的方法包括(a)为每个传送机器人提供分隔壁,围绕多个晶片的壁,并且限定一个布置在室顶部的空气流动室和空气过滤器,由此形成向下的空气流 在周围的室内,和(b)控制供给到输送系统的清洁空气的总量,以便小于清洁工作台的供气量。
    • 4. 发明授权
    • Apparatus for wet processing
    • 湿法加工设备
    • US4557785A
    • 1985-12-10
    • US625155
    • 1984-06-27
    • Yuji Ohkuma
    • Yuji Ohkuma
    • C23F1/08H01L21/306B44C1/22C03C15/00C23F1/00
    • C23F1/08H01L21/306Y10S134/902
    • An apparatus and system for wet processing a substrate, which can be used for chemical processing such as etching or washing a semiconductor substrate are disclosed. The apparatus has a processing chamber in which the substrate is wet processed. Processing liquid is injected into the processing chamber through an opening and nozzles, and the substrate is floated in the injected liquid and rotated about its center axis by streams of the injected liquid. The wet processing system is composed from a processing apparatus as mentioned above, a water bearing system which transfers the substrate by means of a water stream, and a spin dryer. The water bearing system also serves as a washing apparatus. Shutters are provided between the water bearing and the processing chamber or the spin dryer, the shutters controlling the water levels between these elements.
    • 公开了一种用于湿处理基板的装置和系统,其可用于化学处理,例如蚀刻或洗涤半导体基板。 该设备具有处理室,其中衬底被湿加工。 处理液体通过开口和喷嘴注入到处理室中,并且基板浮在注入的液体中并且通过喷射液体的流围绕其中心轴线旋转。 湿处理系统由上述处理装置,通过水流传送基板的水承载系统和旋转干燥机构成。 水承载系统还用作洗涤装置。 在水轴承和处理室或旋转干燥器之间提供百叶窗,百叶窗控制这些元件之间的水位。