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61. 发明授权

US07240425B2 Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board 有权
标题翻译：与多层印刷电路板的内层上的导体电连接的方法
公开(公告)号：US07240425B2
公开(公告)日：2007-07-10
申请号：US10422515
申请日：2003-04-24
申请人： Leon M. Khilchenko , Mark W. Gailus
发明人： Leon M. Khilchenko , Mark W. Gailus
IPC分类号： H05K3/30
CPC分类号： H05K3/4038 , H05K1/0298 , H05K3/321 , H05K3/3447 , H05K3/4046 , H05K3/4069 , H05K2201/0305 , H05K2201/0919 , H05K2201/10234 , H05K2201/1059 , H05K2201/10992 , H05K2203/041 , H05K2203/1446 , Y10T29/4913 , Y10T29/49139 , Y10T29/49147 , Y10T29/49165
摘要： What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to intersect the conductor. A conductive body in an activated state is introduced into the non-conductive via, and upon contacting the conductor, the activated state conductive body adheres to the conductor. The activated state conductive body is then effected to a deactivated state, wherein the conductive body is affixed to the conductor to provide an electrical connection thereto.
摘要翻译：提供的是具有多个堆叠的电介质层的多层PCB，设置在多个电介质层中的至少一个介质层上的导体，以及延伸穿过多个电介质层的至少一部分的非导电通孔，与导体相交。处于激活状态的导电体被引入到非导电通孔中，并且在与导体接触时，活化状态导电体粘附到导体。然后使激活状态的导电体进入去激活状态，其中导电体固定到导体以提供与其的电连接。

62. 发明授权

US06593535B2 Direct inner layer interconnect for a high speed printed circuit board 有权
公开(公告)号：US06593535B2
公开(公告)日：2003-07-15
申请号：US09892045
申请日：2001-06-26
申请人： Mark W. Gailus
发明人： Mark W. Gailus
IPC分类号： H01R1204
CPC分类号： H01R12/523 , H01R12/585 , H01R13/658 , H05K3/308 , H05K3/325 , H05K3/4069
摘要： A multi-layer printed circuit board includes a non-conductive via which intersects a conductive trace on an inner layer of the board and is adapted to receive a conductive element configured to make direct contact with the conductive trace. The non-conductive via may extend through all or only a portion of the multi-layer board. Illustrative conductive elements include a press fit contact, such as an eye-of-the-needle contact of an electrical component, a wedge-shaped contact, and a conductive polymer stripe. Also described is a stepped non-conductive via having a reduced diameter portion intersecting an inner layer conductor and a larger diameter portion. The stepped via is adapted to receive a conductive element having a reduced diameter portion in contact with the conductor and a larger diameter portion press-fit into the larger diameter portion of the via in order to mechanically secure the conductive element to the board.

63. 发明授权

US06541712B1 High speed multi-layer printed circuit board via 失效
标题翻译：高速多层印刷电路板通过
公开(公告)号：US06541712B1
公开(公告)日：2003-04-01
申请号：US10007689
申请日：2001-12-04
申请人： Ellen M. Gately , Robert A. McGrath , Mark W. Gailus
发明人： Ellen M. Gately , Robert A. McGrath , Mark W. Gailus
IPC分类号： H01R909
CPC分类号： H05K1/115 , H05K3/429 , H05K2201/0187 , H05K2201/096 , H05K2201/09645 , H05K2201/09845 , H05K2201/10189 , H05K2203/0242 , H05K2203/175
摘要： A multi-layer printed circuit board includes a via having a conductive upper portion, a conductive lower portion, and an electrically insulating intermediate portion between the upper and lower portions. In one embodiment, the insulating intermediate portion of the via is provided by a non-platable layer of the circuit board, as may be comprised of PTFE. Vias having a continuous conductive coating may be formed through clearance holes in the non-platable layer which are provided with a platable inner surface, either by filling the hole with a platable material, such as epoxy resin, prior to laminating the board or by chemically conditioning the non-platable material to make it platable. In a further embodiment, the as insulating intermediate portion of the via has a narrower diameter than the conductive upper and lower portions.
摘要翻译：多层印刷电路板包括具有导电上部，导电下部和在上部和下部之间的电绝缘中间部的通孔。在一个实施例中，通孔的绝缘中间部分由电路板的不可镀层提供，可由PTFE构成。具有连续导电涂层的通孔可以通过非平板层中的间隙孔形成，该间隙设有可镀的内表面，或者通过在层压板之前用诸如环氧树脂的可镀材料填充孔调节不可镀材料以使其可镀。在另一个实施例中，通孔的绝缘中间部分具有比导电上部和下部更窄的直径。

64. 发明申请

US20140273627A1 DIFFERENTIAL ELECTRICAL CONNECTOR WITH IMPROVED SKEW CONTROL 有权
标题翻译：具有改进的SKEW控制的差分电气连接器
公开(公告)号：US20140273627A1
公开(公告)日：2014-09-18
申请号：US14209079
申请日：2014-03-13
申请人： Marc B. Cartier, JR. , Mark W. Gailus , Vysakh Sivarajan
发明人： Marc B. Cartier, JR. , Mark W. Gailus , Vysakh Sivarajan
IPC分类号： H01R13/502 , H01R13/658
CPC分类号： H01R13/658 , H01R12/724 , H01R13/514 , H01R13/6476 , H01R43/16 , H01R43/24
摘要： An improved electrical connector is provided by compensating for skew in signal conductors of a differential pair while ensuring a uniform impedance along the differential pair. Skew is equalized by regions of lower dielectric constant preferentially positioned adjacent the longer conductor of each pair. Impedance along the length of the signal conductor is equalized by a compensation portion in the first conductor that offsets for a change in impedance associated with the change in dielectric constant adjacent the longer conductor. The compensation portion may be a widening in the first conductive element relative to a nominal width of the conductive element. The skew compensation portion may be along a longer edge of the longer conductor and the impedance compensation portion may be along the shorter edge of the longer conductor.
摘要翻译：通过补偿差分对的信号导体中的偏斜而提供改进的电连接器，同时确保沿着差分对的均匀阻抗。偏移量通过优先位于每对较长导体附近的较低介电常数的区域来均衡。沿着信号导体的长度的阻抗由第一导体中的补偿部分相等，抵消与较长导体相邻的介电常数变化相关的阻抗变化。补偿部分可以相对于导电元件的标称宽度在第一导电元件中变宽。偏斜补偿部分可以沿着较长导体的较长边缘，并且阻抗补偿部分可以沿着较长导体的较短边缘。

65. 发明授权

US08382524B2 Electrical connector having thick film layers 有权
标题翻译：具有厚膜层的电连接器
公开(公告)号：US08382524B2
公开(公告)日：2013-02-26
申请号：US13110215
申请日：2011-05-18
申请人： Leon Khilchenko , Mark W. Gailus
发明人： Leon Khilchenko , Mark W. Gailus
IPC分类号： H01R13/66
CPC分类号： H01R13/46 , H01R12/724 , H01R13/6473 , H01R13/6597 , H01R13/6616 , H01R13/6625 , H01R13/6633 , H01R13/719 , H01R43/24 , Y10T29/49224
摘要： An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
摘要翻译：电连接器电连接第一印刷电路板和第二印刷电路板，其中电连接器包括：（a）绝缘壳体; （b）多个信号导体，所述多个信号导体中的每一个的至少一部分设置在所述绝缘外壳内; （c）多个信号导体中的每一个具有第一接触端，第二接触端和它们之间的中间部分; 以及（d）无源电路元件，其电连接到所述多个信号导体中的每一个的中间部分，其中所述无源电路元件容纳在绝缘封装中并且包括至少一个电容器或电感器。

66. 发明授权

US08272877B2 High density electrical connector and PCB footprint 有权
标题翻译：高密度电连接器和PCB占位面积
公开(公告)号：US08272877B2
公开(公告)日：2012-09-25
申请号：US13070324
申请日：2011-03-23
申请人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, Jr.
发明人： Philip T. Stokoe , Mark W. Gailus , Huilin Ren , Donald A. Girard, Jr.
IPC分类号： H01R12/00
CPC分类号： H01R12/721 , H01R13/6587
摘要： An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.
摘要翻译：一种互连系统，其包括子卡和背板电连接器，每个连接器以连接器占用面积安装到印刷电路板。背板连接器具有导电元件，其具有过渡区域，其允许配合接触部分以均匀的间距定位，而接触尾部可被成形以改善信号完整性或提供更紧凑和/或机械坚固的覆盖区。两个连接器中的导电元件构造成使得接地导体的接触尾部从列到列对准，但是一列中的接地导体的平面部分与另一列中的一对信号导体对准，这改善了机械和信号完整性。可以通过用跨接多列的接地导体的焊盘形成连接器覆盖区来改善机械完整性。

67. 发明申请

US20120176756A1 HIGH SPEED NETWORK INTERFACE 有权
标题翻译：高速网络接口
公开(公告)号：US20120176756A1
公开(公告)日：2012-07-12
申请号：US13342929
申请日：2012-01-03
申请人： Mark W. Gailus , Stephen W. Ellsworth , Prescott B. Atkinson
发明人： Mark W. Gailus , Stephen W. Ellsworth , Prescott B. Atkinson
IPC分类号： H05K7/00 , H05K1/18 , H01F27/28
CPC分类号： H01R13/6633 , H01R24/64 , H01R2107/00 , H05K1/0243 , H05K2201/09163 , H05K2201/10189 , H05K2201/10446
摘要： A network interface adapted for high speed networks. The interface includes isolation circuits with a transformer containing two primary coils and two secondary coils. A wire making up each primary coil may be twisted with a wire making up a secondary. These two coils may then be co-wound on a common core. The transformer may be connected to a common mode choke. The isolation circuit may be packaged such that the transformer and coil are in a line, with isolation circuits for a plurality of pairs arranged in parallel. The interface circuit may be packaged in a connector housing, which also may be adapted for high speed performance. The housing may receive multiple isolation circuits in parallel. The housing may also include a mating contact portion in which mating contacts for signal conductors of each pair are positioned along the same side of a cavity.
摘要翻译：适用于高速网络的网络接口。该接口包括具有包含两个初级线圈和两个次级线圈的变压器的隔离电路。构成每个初级线圈的线可以用组成二次线的线扭绞。然后可以将这两个线圈共同缠绕在共同的芯上。变压器可以连接到共模扼流圈。隔离电路可以被封装成使得变压器和线圈处于一条直线上，并具有用于多个并联布置的隔离电路。接口电路可以封装在连接器壳体中，该壳体也可适用于高速性能。外壳可以并联接收多个隔离电路。壳体还可以包括配合接触部分，其中每对信号导体的配合触点沿着空腔的同一侧定位。

68. 发明授权

US08182289B2 High density electrical connector with variable insertion and retention force 有权
标题翻译：具有可变插入和保持力的高密度电连接器
公开(公告)号：US08182289B2
公开(公告)日：2012-05-22
申请号：US13070343
申请日：2011-03-23
申请人： Philip T. Stokoe , Mark W. Gailus , Donald A. Girard, Jr. , Huilin Ren
发明人： Philip T. Stokoe , Mark W. Gailus , Donald A. Girard, Jr. , Huilin Ren
IPC分类号： H01R13/648
CPC分类号： H01R12/721 , H01R13/6587
摘要： An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the insertion force. Such a change in spring rate may be achieved by positioning the beam-shaped contacts adjacent a surface of a connector housing. That surface may include a projection that aligns with the beam-shaped contact. When the connectors are unmated, the beam-shaped contact may be spaced from the projection. As the connectors begin to mate, a central portion of the beam-shaped contact may be pressed against the projection, which has the effect of shortening the beam length and increasing its stiffness.
摘要翻译：一种互连系统，其包括在连接器覆盖区处安装到印刷电路板的子卡和背板电连接器。子卡连接器中的波束形触点的弹簧比率随着背板连接器的配合而增加，使得保持力可能大于插入力。弹簧速率的这种变化可以通过将梁状接触件邻近连接器壳体的表面定位来实现。该表面可以包括与梁状接触件对准的突起。当连接器不配合时，梁形接触件可以与突起物间隔开。当连接器开始配合时，梁形接触件的中心部分可以压靠在突起上，这具有缩短梁长度和增加其刚度的作用。

69. 发明申请

US20120094536A1 ELECTRICAL CONNECTOR HAVING THICK FILM LAYERS 有权
标题翻译：具有厚膜层的电连接器
公开(公告)号：US20120094536A1
公开(公告)日：2012-04-19
申请号：US13110215
申请日：2011-05-18
申请人： Leon KHILCHENKO , Mark W. Gailus
发明人： Leon KHILCHENKO , Mark W. Gailus
IPC分类号： H01R13/66
CPC分类号： H01R13/46 , H01R12/724 , H01R13/6473 , H01R13/6597 , H01R13/6616 , H01R13/6625 , H01R13/6633 , H01R13/719 , H01R43/24 , Y10T29/49224
摘要： An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
摘要翻译：电连接器电连接第一印刷电路板和第二印刷电路板，其中电连接器包括：（a）绝缘壳体; （b）多个信号导体，所述多个信号导体中的每一个的至少一部分设置在所述绝缘外壳内; （c）多个信号导体中的每一个具有第一接触端，第二接触端和它们之间的中间部分; 以及（d）无源电路元件，其电连接到所述多个信号导体中的每一个的中间部分，其中所述无源电路元件容纳在绝缘封装中并且包括至少一个电容器或电感器。

70. 发明授权

US08011963B2 Filtered power connector 有权
标题翻译：过滤电源连接器
公开(公告)号：US08011963B2
公开(公告)日：2011-09-06
申请号：US12618622
申请日：2009-11-13
申请人： Prescott Atkinson , Mark W. Gailus
发明人： Prescott Atkinson , Mark W. Gailus
IPC分类号： H01R13/66
CPC分类号： H01R13/719
摘要： An improved power connector provides improved signal integrity in an interconnection system. The connector includes a filter element between a supply contact and a return contact. The filter element may be primarily capacitive, but may also include a resistance and a ferrite member. For connectors that include multiple sets of supply and return contacts, a single filter element may be included, or multiple filter elements may be included between multiple pairs of power and return contacts. The filter element may be formed within a connector housing or otherwise incorporated when the connector is manufactured. Alternatively, the filter element may be inserted into a receptacle such that filtering may be selectively incorporated as the connectors are used. When connected to a conducting loop for carrying power supply, the filter element provides substantially zero attenuation at frequencies below about 50 MHz and in excess of 10 dB of attenuation over a range that extends above 500 MHz.
摘要翻译：改进的电源连接器在互连系统中提供改进的信号完整性。连接器包括在供电接点和返回接点之间的过滤元件。滤波器元件可以主要是电容的，但也可以包括电阻和铁氧体元件。对于包括多组电源和返回触点的连接器，可以包括单个滤波器元件，或者可以在多对电源和返回触点之间包括多个滤波器元件。当制造连接器时，过滤元件可以形成在连接器壳体内或以其它方式结合。或者，过滤元件可以插入到容器中，使得可以在使用连接器时选择性地结合过滤。当连接到用于承载电源的导电回路时，滤波器元件在低于约50MHz的频率处提供基本零衰减，并且在超过500MHz的范围上提供超过10dB的衰减。

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