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1. 发明申请

US20180310419A1 Using a Partially Uncured Component Carrier for Manufacturing Component Carrier 审中-公开
公开(公告)号：US20180310419A1
公开(公告)日：2018-10-25
申请号：US15769476
申请日：2016-10-21
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gernot Grober , Sabine Liebfahrt , Marco Gavagnin
IPC分类号： H05K3/46 , H05K1/18 , H05K1/02
CPC分类号： H05K3/4614 , H05K1/0237 , H05K1/0271 , H05K1/14 , H05K1/185 , H05K3/36 , H05K3/4694 , H05K3/4697 , H05K2201/048 , H05K2201/086 , H05K2201/09136 , H05K2201/09163
摘要： A method of manufacturing a component carrier is disclosed. The method includes providing a first component carrier body having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, providing a second component carrier body having at least one second electrically insulating layer structure and at least one second electrically conductive layer structure, providing at least a part of at least one of the first component carrier body and the second component carrier body of an at least partially uncured material, and interconnecting the first component carrier body with the second component carrier body by curing the at least partially uncured material.

2. 发明申请

US20180065538A1 VEHICLE ACCESSORY CONTROL ARRANGEMENT 审中-公开
公开(公告)号：US20180065538A1
公开(公告)日：2018-03-08
申请号：US15808542
申请日：2017-11-09
申请人： UUSI, LLC
发明人： David W. Shank
IPC分类号： B60Q1/00 , H05B33/08 , H05K1/14 , H05B37/02
CPC分类号： B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
摘要： A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile.

3. 发明授权

US09853377B2 Connecting member for electronic device and electronic device including the same 有权
公开(公告)号：US09853377B2
公开(公告)日：2017-12-26
申请号：US15037612
申请日：2014-12-12
申请人： Samsung Electronics Co., Ltd.
发明人： Yeon Woo Kim , Kyung Gu Kim , Gyu Sub Kim , Se Hyun Park , Jin Woo Jung , Jae Bong Chun
IPC分类号： H01R12/00 , H01R12/70 , H05K3/32 , H05K1/02
CPC分类号： H01R12/7076 , H05K1/02 , H05K3/325 , H05K2201/09163 , H05K2201/09209 , H05K2201/10083 , H05K2201/10098 , H05K2201/10446
摘要： A connecting member for electrically connecting a circuit board and a component in an electronic device is provided. The connecting member includes at least one bending part configured to comprise elasticity, a pad part connected to the bending part and configured to be attached to one surface of the circuit board, and a fixing part extending from the pad part and configured to fix the connecting member to the circuit board.

4. 发明授权

US09840185B2 Vehicle accessory control arrangement 有权
公开(公告)号：US09840185B2
公开(公告)日：2017-12-12
申请号：US15362703
申请日：2016-11-28
申请人： UUSI, LLC
发明人： David W. Shank
IPC分类号： H01R12/62 , H05K1/02 , H05K1/16 , B60Q1/00 , H05K1/14 , H05B37/02 , H05B33/08 , H05K1/11
CPC分类号： B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
摘要： An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.

5. 发明授权

US09831144B2 Semiconductor die and package jigsaw submount 有权
公开(公告)号：US09831144B2
公开(公告)日：2017-11-28
申请号：US14428376
申请日：2013-08-28
申请人： QUBEICON LTD.
发明人： Shimon Podval
IPC分类号： H05K1/18 , H01L23/13 , H01L23/498 , H01L25/065 , H05K1/11 , H05K1/14 , H05K1/02 , H01L23/00 , H05K3/34
CPC分类号： H01L23/13 , H01L23/49838 , H01L23/49855 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05555 , H01L2224/06135 , H01L2224/131 , H01L2224/16225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48472 , H01L2224/49113 , H01L2224/49177 , H01L2224/73265 , H01L2224/81203 , H01L2224/81205 , H01L2224/81385 , H01L2924/00014 , H01L2924/15162 , H01L2924/15192 , H05K1/0204 , H05K1/117 , H05K1/141 , H05K3/3415 , H05K3/3442 , H05K2201/041 , H05K2201/09063 , H05K2201/09154 , H05K2201/09163 , H05K2201/0939 , H05K2201/09472 , Y02P70/613 , H01L2924/014 , H01L2224/32225 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

6. 发明授权

US09653826B2 Interface mounting device and printed circuit board assembly with the interface mounting device 有权
公开(公告)号：US09653826B2
公开(公告)日：2017-05-16
申请号：US14612978
申请日：2015-02-03
申请人： HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
发明人： Yong-Nian Chen , Li-Fu Xu , Chun-Wei Yang
IPC分类号： H05K7/02 , H05K7/04 , H01R12/70 , H05K1/18
CPC分类号： H01R12/7076 , H05K1/18 , H05K1/184 , H05K2201/09163 , H05K2201/10189 , H05K2201/10446
摘要： An interface mounting device includes a circuit board with a connector and a bracket configured to receive an interface device and including a hook. The circuit board defines an installation opening and a cutout extending from an edge of the installation opening. The bracket is received in the installation opening. The hook is engaged with the circuit board through the cutout. The bracket defines a guiding slot aligned with the connector. The guiding slot is configured for a coupling portion of the interface device to pass through and coupling to the connector. A printed circuit board assembly with the interface mounting device is also provided.

7. 发明申请

US20160102847A1 LIGHTING DEVICE, DISPLAY DEVICE, AND TELEVISION RECEIVING DEVICE 审中-公开
标题翻译：照明装置，显示装置和电视接收装置
公开(公告)号：US20160102847A1
公开(公告)日：2016-04-14
申请号：US14889787
申请日：2014-02-25
申请人： Sharp Kabushiki Kaisha
发明人： Akira GOTOU
IPC分类号： F21V19/00 , H04N5/64 , G02F1/1335 , F21V8/00 , F21V21/005 , F21V29/70
CPC分类号： F21V19/004 , F21V21/005 , F21V29/70 , G02B6/0073 , G02B6/009 , G02F1/1336 , G02F2001/133628 , H04N5/64 , H05K3/0061 , H05K2201/09063 , H05K2201/09163 , H05K2201/10106 , H05K2201/10128 , H05K2201/10409
摘要： An illumination device includes: a plurality of LED substrates having a rectangular plate shape, the plurality of LED substrates arranged in a row along a long side direction thereof, and each of the LED substrates having a plurality of LEDs on one surface thereof; and a heat-dissipating member abutting another surface of each of the LED substrates. A cutout portion is provided in each of the short sides, facing each other, of the LED substrates that are adjacent to each other. A fixing screw has a screw shaft that goes through the cutout portion from the mounting surface of the LED substrates and is fixed to the heat-dissipating member and a screw head that abuts the mounting surface of each of the LED substrates that are adjacent to each other.
摘要翻译：照明装置包括：多个LED基板，其具有矩形板状，所述多个LED基板沿着其长边方向排列成一排，并且每个所述LED基板在其一个表面上具有多个LED; 以及与每个所述LED基板的另一表面相邻的散热构件。在彼此相邻的LED基板的彼此面对的每个短边中设置有切口部。固定螺钉具有从LED基板的安装面穿过切口部分的螺钉轴，并固定到散热构件和与每个LED基板相邻的每个LED基板的安装表面邻接的螺钉头其他。

8. 发明申请

US20150131243A1 NOISE SUPPRESSION ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME 有权
标题翻译：噪声抑制装置和具有该噪声的电子装置
公开(公告)号：US20150131243A1
公开(公告)日：2015-05-14
申请号：US14248042
申请日：2014-04-08
申请人： Wistron Corp.
发明人： Chien-Ju CHEN , Po-Hsien CHU , Chun-Hsiang LEI , Yuan-Cheng SUN
IPC分类号： H05K1/02
CPC分类号： H05K1/0216 , H05K1/0243 , H05K3/3447 , H05K7/20009 , H05K2201/09163 , H05K2201/10446
摘要： An electronic device includes a circuit board, a connector and a noise suppression assembly. The circuit board includes a substrate having a surface layer. The connector is disposed on the circuit board and has at least one electrical pin. The noise suppression assembly includes a wiring area located on the surface layer and adjacent to the connector and a conductive cover member. The wiring area includes at least one electrical contact, a transmission circuit and at least one ground contact, the electrical contact is used for being in electrical contact with the electrical pin of the connector. The transmission circuit is electrically connected to the electrical contact. The ground contact is located around the wiring area. The conductive cover member has a cover plate and at least one lateral plate. The lateral plate is connected to the cover plate for forming a shielded space.
摘要翻译：电子设备包括电路板，连接器和噪声抑制组件。电路板包括具有表面层的基板。连接器设置在电路板上并且具有至少一个电引脚。噪声抑制组件包括位于表面层上并且邻近连接器的布线区域和导电盖构件。布线区域包括至少一个电触点，传输电路和至少一个接地触点，电触点用于与连接器的电引脚电接触。传输电路电连接到电触头。接地触点位于接线区域周围。导电盖构件具有盖板和至少一个侧板。侧板连接到盖板以形成屏蔽空间。

9. 发明授权

US08968026B2 High speed network interface 有权
标题翻译：高速网络接口
公开(公告)号：US08968026B2
公开(公告)日：2015-03-03
申请号：US13342929
申请日：2012-01-03
申请人： Mark W. Gailus , Stephen W. Ellsworth , Prescott B. Atkinson
发明人： Mark W. Gailus , Stephen W. Ellsworth , Prescott B. Atkinson
IPC分类号： H01R24/00 , H01R13/66 , H01R24/64 , H01R107/00 , H05K1/02
CPC分类号： H01R13/6633 , H01R24/64 , H01R2107/00 , H05K1/0243 , H05K2201/09163 , H05K2201/10189 , H05K2201/10446
摘要： A network interface adapted for high speed networks. The interface includes isolation circuits with a transformer containing two primary coils and two secondary coils. A wire making up each primary coil may be twisted with a wire making up a secondary. These two coils may then be co-wound on a common core. The transformer may be connected to a common mode choke. The isolation circuit may be packaged such that the transformer and coil are in a line, with isolation circuits for a plurality of pairs arranged in parallel. The interface circuit may be packaged in a connector housing, which also may be adapted for high speed performance. The housing may receive multiple isolation circuits in parallel. The housing may also include a mating contact portion in which mating contacts for signal conductors of each pair are positioned along the same side of a cavity.
摘要翻译：适用于高速网络的网络接口。该接口包括具有包含两个初级线圈和两个次级线圈的变压器的隔离电路。构成每个初级线圈的线可以用组成二次线的线扭绞。然后可以将这两个线圈共同缠绕在共同的芯上。变压器可以连接到共模扼流圈。隔离电路可以被封装成使得变压器和线圈处于一条直线上，并具有用于多个并联布置的隔离电路。接口电路可以封装在连接器壳体中，该壳体也可适用于高速性能。外壳可以并联接收多个隔离电路。壳体还可以包括配合接触部分，其中每对信号导体的配合触点沿着空腔的同一侧定位。

10. 发明申请

US20150035433A1 VEHICLE ACCESSORY CONTROL ARRANGEMENT 有权
标题翻译：车辆附件控制装置
公开(公告)号：US20150035433A1
公开(公告)日：2015-02-05
申请号：US14168036
申请日：2014-01-30
申请人： UUSI, LLC d/b/a NARTRON
发明人： David W. SHANK , John M. WASHELESKI , Edward J. COX, II
IPC分类号： B60R16/02 , B60Q3/00 , H05B33/08 , H05K1/02
CPC分类号： H05B33/0803 , H05B33/086 , H05K1/02 , H05K1/117 , H05K1/142 , H05K1/16 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10356
摘要： An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.
摘要翻译：车辆附件控制部件的说明性库存包括多个第一电路板和多个第二电路板。第一电路板各自具有支撑在基板上的多个电路元件的基板。第一电路板基板具有包括外缘轮廓和从外边缘轮廓的多个第一偏离的总体周边形状。第二电路板各自具有支撑在它们上的多个电路元件的基板。第二电路板基板具有包括与第一电路板基板相同的外边缘轮廓的整体周边形状。第二电路板基板包括与外边缘轮廓的多个第二偏差。第二偏差的至少一部分不同于第一电路板的第一偏差。

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