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1. 发明授权

US08382524B2 Electrical connector having thick film layers 有权
标题翻译：具有厚膜层的电连接器
公开(公告)号：US08382524B2
公开(公告)日：2013-02-26
申请号：US13110215
申请日：2011-05-18
申请人： Leon Khilchenko , Mark W. Gailus
发明人： Leon Khilchenko , Mark W. Gailus
IPC分类号： H01R13/66
CPC分类号： H01R13/46 , H01R12/724 , H01R13/6473 , H01R13/6597 , H01R13/6616 , H01R13/6625 , H01R13/6633 , H01R13/719 , H01R43/24 , Y10T29/49224
摘要： An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
摘要翻译：电连接器电连接第一印刷电路板和第二印刷电路板，其中电连接器包括：（a）绝缘壳体; （b）多个信号导体，所述多个信号导体中的每一个的至少一部分设置在所述绝缘外壳内; （c）多个信号导体中的每一个具有第一接触端，第二接触端和它们之间的中间部分; 以及（d）无源电路元件，其电连接到所述多个信号导体中的每一个的中间部分，其中所述无源电路元件容纳在绝缘封装中并且包括至少一个电容器或电感器。

2. 发明申请

US20120094536A1 ELECTRICAL CONNECTOR HAVING THICK FILM LAYERS 有权
标题翻译：具有厚膜层的电连接器
公开(公告)号：US20120094536A1
公开(公告)日：2012-04-19
申请号：US13110215
申请日：2011-05-18
申请人： Leon KHILCHENKO , Mark W. Gailus
发明人： Leon KHILCHENKO , Mark W. Gailus
IPC分类号： H01R13/66
CPC分类号： H01R13/46 , H01R12/724 , H01R13/6473 , H01R13/6597 , H01R13/6616 , H01R13/6625 , H01R13/6633 , H01R13/719 , H01R43/24 , Y10T29/49224
摘要： An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
摘要翻译：电连接器电连接第一印刷电路板和第二印刷电路板，其中电连接器包括：（a）绝缘壳体; （b）多个信号导体，所述多个信号导体中的每一个的至少一部分设置在所述绝缘外壳内; （c）多个信号导体中的每一个具有第一接触端，第二接触端和它们之间的中间部分; 以及（d）无源电路元件，其电连接到所述多个信号导体中的每一个的中间部分，其中所述无源电路元件容纳在绝缘封装中并且包括至少一个电容器或电感器。

3. 发明申请

US20130112468A1 MIDPLANE ESPECIALLY APPLICABLE TO AN ORTHOGONAL ARCHITECTURE ELECTRONIC SYSTEM 有权
公开(公告)号：US20130112468A1
公开(公告)日：2013-05-09
申请号：US13553414
申请日：2012-07-19
申请人： Thomas S. COHEN , Marc B. Cartier, JR. , Mark W. Gailus
发明人： Thomas S. COHEN , Marc B. Cartier, JR. , Mark W. Gailus
IPC分类号： H05K1/11
CPC分类号： H01R13/646 , H01R13/514 , H01R13/6471 , H01R13/6587 , H01R23/688 , H05K1/0231 , H05K1/0237 , H05K1/115 , H05K1/116 , H05K1/14 , H05K3/429 , H05K7/1445 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

4. 发明授权

US08226438B2 Midplane especially applicable to an orthogonal architecture electronic system 有权
标题翻译：中平面特别适用于正交架构电子系统
公开(公告)号：US08226438B2
公开(公告)日：2012-07-24
申请号：US12789621
申请日：2010-05-28
申请人： Thomas S. Cohen , Marc B. Cartier, Jr. , Mark W. Gailus
发明人： Thomas S. Cohen , Marc B. Cartier, Jr. , Mark W. Gailus
IPC分类号： H01R13/648
CPC分类号： H05K7/1445 , H01R13/514 , H01R13/6587 , H01R13/6591 , H05K1/0231 , H05K1/0237 , H05K1/116 , H05K1/14 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
摘要翻译：中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。

5. 发明授权

US08115110B2 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor 有权
标题翻译：印刷电路板最小化通孔中的不期望的信号反射及其方法
公开(公告)号：US08115110B2
公开(公告)日：2012-02-14
申请号：US11822137
申请日：2007-07-02
申请人： Leon M. Khilchenko , Mark W. Gailus
发明人： Leon M. Khilchenko , Mark W. Gailus
IPC分类号： H05K1/11
CPC分类号： H05K3/4038 , H05K1/0298 , H05K3/321 , H05K3/3447 , H05K3/4046 , H05K3/4069 , H05K2201/0305 , H05K2201/0919 , H05K2201/10234 , H05K2201/1059 , H05K2201/10992 , H05K2203/041 , H05K2203/1446 , Y10T29/4913 , Y10T29/49139 , Y10T29/49147 , Y10T29/49165
摘要： What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to intersect the conductor. A conductive body in an activated state is introduced into the non-conductive via, and upon contacting the conductor, the activated state conductive body adheres to the conductor. The activated state conductive body is then effected to a deactivated state, wherein the conductive body is affixed to the conductor to provide an electrical connection thereto.
摘要翻译：提供的是具有多个堆叠的电介质层的多层PCB，设置在多个电介质层中的至少一个介质层上的导体，以及延伸穿过多个电介质层的至少一部分的非导电通孔，与导体相交。处于激活状态的导电体被引入到非导电通孔中，并且在与导体接触时，活化状态导电体粘附到导体。然后使激活状态的导电体进入去激活状态，其中导电体固定到导体以提供与其的电连接。

6. 发明申请

US20110230095A1 HIGH FREQUENCY ELECTRICAL CONNECTOR 有权
标题翻译：高频电气连接器
公开(公告)号：US20110230095A1
公开(公告)日：2011-09-22
申请号：US13029052
申请日：2011-02-16
申请人： Prescott B. Atkinson , Brian Kirk , Mark W. Gailus , David Manter , Thomas S. Cohen
发明人： Prescott B. Atkinson , Brian Kirk , Mark W. Gailus , David Manter , Thomas S. Cohen
IPC分类号： H01R13/648
CPC分类号： H01R13/6461 , H01R12/585 , H01R12/724 , H01R12/735 , H01R13/504 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/658 , H01R13/6585 , H01R13/6587 , H01R13/6598 , H01R24/62 , H01R24/68
摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair. By using material of relatively low loss, loss when the conductive members are used to carry signals is relatively low, but an appreciable attenuation of resonances is provided on pairs connected to ground. As a result, an overall improvement of signal to noise ratio is achieved.
摘要翻译：一个改进的宽边耦合，开放引脚现场连接器。当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。该材料还可以减少串扰和模式转换。选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。有损材料可以选择性地定位在导电构件的匹配接触部分附近。描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。有损耗材料可替代地位于一对导电构件的宽侧之间。通过使用相对较低损耗的材料，当导电构件用于承载信号时的损耗相对较低，但是在连接到地面的对上提供明显的谐振衰减。结果，实现了信噪比的全面提高。

7. 发明申请

US20110104948A1 SURFACE MOUNT FOOTPRINT IN-LINE CAPACITANCE 有权
标题翻译：表面贴装内置电容
公开(公告)号：US20110104948A1
公开(公告)日：2011-05-05
申请号：US12612510
申请日：2009-11-04
申请人： Donald A. Girard, JR. , Mark W. Gailus , Philip T. Stokoe
发明人： Donald A. Girard, JR. , Mark W. Gailus , Philip T. Stokoe
IPC分类号： H01R13/66 , H05K7/02 , H05K3/34 , H05K1/11 , H05K1/16
CPC分类号： H01R13/6466 , H01R13/6587 , H05K3/34 , Y10T29/49144
摘要： An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a contact tail of a conductive element in a connector. The shared pads are not connected through vias to internal circuit structures. Rather, a via, such as which would conventionally be formed as part of the connector mounting pad, is formed as part of a separate, adjacent pad. A second end of the capacitor is attached to the adjacent pad, forming an electrical connection between the conductive element and the via through the capacitor. Incorporating capacitors into the footprint reduces the number of vias required, which improves signal integrity. The capacitors may be placed on the printed circuit board separately from the connector or may be incorporated into the connector, allowing the connector and capacitors to be placed in one operation.
摘要翻译：具有集成到电连接器的印刷电路板占位面积的电容器的互连系统。每个电容器的一端在印刷电路板上与连接器中的导电元件的接触尾部共享焊盘。共享焊盘不通过过孔连接到内部电路结构。相反，通常形成为连接器安装垫的一部分的通孔形成为单独的相邻垫的一部分。电容器的第二端附接到相邻的焊盘，通过电容器在导电元件和通孔之间形成电连接。将电容器集成到占位面积中减少了所需的通孔数量，从而提高了信号完整性。电容器可以与连接器分开地放置在印刷电路板上，或者可以并入到连接器中，从而允许将连接器和电容器放置在一个操作中。

8. 发明申请

US20100124848A1 FILTERED POWER CONNECTOR 有权
标题翻译：过滤电源连接器
公开(公告)号：US20100124848A1
公开(公告)日：2010-05-20
申请号：US12618622
申请日：2009-11-13
申请人： Prescott Atkinson , Mark W. Gailus
发明人： Prescott Atkinson , Mark W. Gailus
IPC分类号： H01R13/66
CPC分类号： H01R13/719
摘要： An improved power connector provides improved signal integrity in an interconnection system. The connector includes a filter element between a supply contact and a return contact. The filter element may be primarily capacitive, but may also include a resistance and a ferrite member. For connectors that include multiple sets of supply and return contacts, a single filter element may be included, or multiple filter elements may be included between multiple pairs of power and return contacts. The filter element may be formed within a connector housing or otherwise incorporated when the connector is manufactured. Alternatively, the filter element may be inserted into a receptacle such that filtering may be selectively incorporated as the connectors are used. When connected to a conducting loop for carrying power supply, the filter element provides substantially zero attenuation at frequencies below about 50 MHz and in excess of 10 dB of attenuation over a range that extends above 500 MHz.
摘要翻译：改进的电源连接器在互连系统中提供改进的信号完整性。连接器包括在供电接点和返回接点之间的过滤元件。滤波器元件可以主要是电容的，但也可以包括电阻和铁氧体元件。对于包括多组电源和返回触点的连接器，可以包括单个滤波器元件，或者可以在多对电源和返回触点之间包括多个滤波器元件。当制造连接器时，过滤元件可以形成在连接器壳体内或以其它方式结合。或者，过滤元件可以插入到容器中，使得可以在使用连接器时选择性地结合过滤。当连接到用于承载电源的导电回路时，滤波器元件在低于约50MHz的频率处提供基本零衰减，并且在超过500MHz的范围上提供超过10dB的衰减。

9. 发明授权

US07630210B2 Lead(Pb)-free electronic component attachment 有权
标题翻译：无铅（Pb）电子元件附件
公开(公告)号：US07630210B2
公开(公告)日：2009-12-08
申请号：US11604710
申请日：2006-11-28
申请人： Mark W. Gailus , Leon M. Khilchenko
发明人： Mark W. Gailus , Leon M. Khilchenko
IPC分类号： H05K7/00
CPC分类号： H05K3/321 , H01L2924/0002 , H05K2201/10628 , H05K2201/10795 , H05K2201/10984 , H01L2924/00
摘要： A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.
摘要翻译：用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，其可以是无铅（Pb）。接触尾部被冲压，提供相对低的制造成本和高精度。接触尾部具有每单位长度具有大的表面积的远端部分。远端部分将导电粘合剂形成接头，将粘合剂保持在邻近引线的位置，用于更牢固的接头。此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。为了进一步有助于粘合剂的转移，接触尾部可以形成有凹部，其增加粘附到接触尾部的粘合剂的体积。通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

10. 发明授权

US07508681B2 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics 失效
标题翻译：用于高速，高密度电连接器的印刷电路板，具有改进的串扰最小化衰减和阻抗失配特性
公开(公告)号：US07508681B2
公开(公告)日：2009-03-24
申请号：US11808642
申请日：2007-06-12
申请人： Jason J. Payne , Mark W. Gailus , Leon M. Khilchenko , Huilin Ren
发明人： Jason J. Payne , Mark W. Gailus , Leon M. Khilchenko , Huilin Ren
IPC分类号： H05K1/11
CPC分类号： H01R13/6477 , H01R12/714 , H01R13/514 , H01R13/6471 , H01R13/6587 , H05K1/0219 , H05K1/112 , H05K3/429 , H05K2201/09381 , H05K2201/09627 , H05K2201/09709 , H05K2201/10189
摘要： In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal conductors and ground conductors. The printed circuit board includes a plurality of stacked dielectric layers, with a conductor disposed on at least one of the plurality of dielectric layers. The mating interface includes a plurality of conductive vias aligned in a plurality of rows, with the plurality of conductive vias extending through at least a portion of the plurality of dielectric layers, at least one of the plurality of conductive vias intersecting the conductor. The plurality of conductive vias includes signal conductor connecting conductive vias and ground conductor connecting conductive vias. For each of the plurality of rows of the conductive vias, there are at least twice as many ground conductor connecting conductive vias as signal conductor connecting conductive vias and the conductive vias are positioned relative to one another so that for each signal conductor connecting conductive via, there are ground conductor connecting conductive vias adjacent either side of the signal conductor connecting conductive via.
摘要翻译：在优选实施例中，公开了一种印刷电路板，其具有提供配合接口的表面，电连接器具有信号导体和接地导体。印刷电路板包括多个堆叠的电介质层，其中导体设置在多个电介质层中的至少一个上。配合接口包括以多行排列的多个导电通孔，多个导电通孔延伸穿过多个电介质层的至少一部分，多个导电通孔中的至少一个与导体相交。多个导电通孔包括连接导电通孔的信号导体和连接导电通孔的接地导体。对于导电通孔的多行中的每一行，存在至少两倍的接地导体，其连接导电通孔，作为连接导电通孔的信号导体，并且导电通孔相对于彼此定位，使得对于连接导电通孔的每个信号导体，有接地导体连接导电通孔，邻近信号导体的任一侧连接导电通孔。

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