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    • 62. 发明授权
    • Substrate treating apparatus
    • 底物处理装置
    • US06227786B1
    • 2001-05-08
    • US09064783
    • 1998-04-23
    • Kiyohisa Tateyama
    • Kiyohisa Tateyama
    • B65H100
    • H01L21/67109Y10S414/135
    • A substrate treating apparatus for subjecting a substrate to a treatment including a heating or cooling treatment has a plate for heating or cooling the substrate. The plate has a plurality of holes formed therein and is arranged to be positioned under the substrate. A plurality of lifter pins for moving the substrate up and down are inserted in the holes, respectively, formed in the plate, and are incorporated with the plate to be movable up and down. A plurality of springs are arranged to bias the lifter pins downward, respectively. A push-up mechanism is used for pushing up the lifter pins while being in contact with bottom ends of the lifter pins. The push-up mechanism is arranged to be separable from the lifter pins. A driving mechanism is arranged to drive the push-up mechanism.
    • 用于对基材进行包括加热或冷却处理的处理的基板处理装置具有用于加热或冷却基板的板。 该板具有形成在其中的多个孔,并且被布置成位于基板下方。 多个用于上下移动基板的提升销分别插入形成在板中的孔中,并且与板结合以可上下移动。 多个弹簧被布置成分别向下偏压升降器销。 上推机构用于在升降器销的底端接触时推动升降销。 上推机构设置成可与升降销分开。 布置驱动机构来驱动上推机构。
    • 63. 发明授权
    • Coating apparatus for semiconductor process
    • 半导体工艺涂层装置
    • US6110282A
    • 2000-08-29
    • US917510
    • 1997-08-26
    • Kiyohisa TateyamaTetsu Kawasaki
    • Kiyohisa TateyamaTetsu Kawasaki
    • B05C5/02B05C13/00B05C13/02B65G13/00G03F7/16G03F7/30H01L21/00H01L21/027B05C5/00
    • H01L21/6715B05C13/00B05C5/0254G03F7/3042G03F7/3064G03F7/16
    • A coating apparatus for coating an LCD substrate with a developing liquid for a photo-resist has a conveyer mechanism for linearly conveying the substrate in a conveying direction. The conveyer mechanism has a plurality of lower conveyer rollers which are driving rollers, and a plurality of upper conveyer rollers which are driven rollers. A main support roller is arranged such that it replaces one of the lower conveyer rollers. A developing liquid supply nozzle is arranged above the main support roller for supplying a developing liquid onto the substrate when the substrate is passing over the main support roller. The supply nozzle has a supply port which is laterally long and narrow, so that the developing liquid is supplied onto the substrate from the supply nozzle as a band. This band extends over the entire width of a target region of the substrate, which is perpendicular to the conveying direction, and is supplied thereto all at once.
    • 用于用用于光刻胶的显影液涂覆LCD基板的涂布装置具有用于沿输送方向直线输送基板的输送机构。 输送机构具有作为驱动辊的多个下输送辊,以及作为从动辊的多个上输送辊。 主支撑辊布置成使得其替代下输送辊之一。 显影液供给喷嘴设置在主支撑辊上方,用于当基板通过主支撑辊时将显影液供给到基板上。 供给喷嘴具有横向长而窄的供给口,使得显影液从供给喷嘴作为带供给到基板上。 该带在垂直于输送方向的基板的目标区域的整个宽度上延伸,并一次性地供给到该区域。
    • 65. 发明授权
    • Cooling device and cooling method
    • 冷却装置及冷却方式
    • US5941083A
    • 1999-08-24
    • US588309
    • 1996-01-18
    • Tetsuya SadaOsamu HiroseKiyohisa Tateyama
    • Tetsuya SadaOsamu HiroseKiyohisa Tateyama
    • H01L21/304G05D23/00G05D23/19H01L21/00F25B29/00
    • H01L21/67109G05D23/1919
    • A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.
    • 用于将待处理物体冷却到目标温度的冷却装置包括安装在放置台上的多个接触构件,用于支撑物体,使得物体间隔着与放置台的顶面相对,用于输出的温度传感器 由接触构件支撑的物体的温度信息,用于将放置台冷却到低于目标温度的温度以冷却物体的第一冷却单元,用于将由第一冷却单元冷却的物体加热到第二冷却单元的温度 几乎等于目标温度;以及对比度电路,用于根据来自温度传感器的温度信息,通过第一冷却单元的冷却和由第二冷却单元进行加热之间进行切换操作。
    • 67. 发明授权
    • Heat treating apparatus
    • 热处理设备
    • US5834737A
    • 1998-11-10
    • US642898
    • 1996-05-06
    • Osamu HiroseKiyohisa Tateyama
    • Osamu HiroseKiyohisa Tateyama
    • G02F1/13B23Q3/18C03C17/00G02F1/1333G03F7/26H01L21/027C23C16/00
    • C03C17/001Y10S414/135
    • The present invention is a heat treating apparatus, including a support plate having an object to be treated disposed thereon, heating member for heating the object through the support plate, and support pins extending through the support plate so as to support the object, wherein the support plate is provided with holes each sized large enough to permit a horizontal movement of the support pin, and the support pin is movable in a horizontal direction within the hole made in the support plate. The present invention also is a heat treating apparatus, including a support plate arranged within a treating chamber and having an object to be treated disposed thereon, heating member for heating the object through the support plate, a cover member arranged in the treating chamber to define a treating space between the support plate and the cover member, a shutter member partitioning the treating space and capable of opening/closing the partitioned treating space, and a gap setting member disposed between the cover member and the shutter member.
    • 本发明是一种热处理装置,其特征在于,包括具有被处置物的支撑板,通过所述支撑板加热所述物体的加热构件,以及延伸穿过所述支撑板以支撑所述物体的支撑销,其中, 支撑板设置有各自的尺寸足​​够大以允许支撑销的水平移动的孔,并且支撑销可在支撑板中形成的孔内沿水平方向移动。 本发明还是一种热处理装置,其包括布置在处理室内并具有待处理物体的支撑板,用于通过支撑板加热物体的加热构件,布置在处理室中的盖构件,以限定 支撑板和盖构件之间的处理空间,分隔处理空间并能够打开/关闭分隔的处理空间的活门构件,以及设置在盖构件和活门构件之间的间隙设定构件。
    • 69. 发明授权
    • Cleaning apparatus
    • 清洁装置
    • US5685039A
    • 1997-11-11
    • US644811
    • 1996-05-10
    • Tomoko HamadaMitiaki MatsushitaKiyohisa TateyamaAkira Yonemizu
    • Tomoko HamadaMitiaki MatsushitaKiyohisa TateyamaAkira Yonemizu
    • A46B13/04
    • H01L21/67046A46B13/04
    • A cleaning apparatus includes a spin chuck for holding and rotating a wafer, a brush for rubbing the surface of the wafer, and an arm for supporting the brush. A support is coupled to the arm through a linear guide. The arm and the support moves together in a horizontal direction and can relatively displace in a vertical direction. A compression spring is arranged between the arm and the support and deformed in accordance with a relative displacement of the arm and the support in the vertical direction. When the brush contacts the wafer held by the spin chuck, a biasing force of the brush against the wafer is generated in correspondence with deformation of the compression spring. The biasing force of the brush is set by adjusting the downward moving amount of the support in the vertical direction.
    • 清洁装置包括用于保持和旋转晶片的旋转卡盘,用于摩擦晶片表面的刷子和用于支撑刷子的臂。 支撑件通过线性引导件与臂连接。 臂和支撑件在水平方向上一起移动并且可以在垂直方向上相对移位。 压缩弹簧布置在臂和支撑件之间,并且根据臂和支撑件在垂直方向上的相对位移而变形。 当电刷接触由旋转卡盘保持的晶片时,与压缩弹簧的变形相对应地产生刷对着晶片的偏置力。 通过调节支撑件在垂直方向上的向下移动量来设定刷子的偏置力。
    • 70. 发明授权
    • Coating apparatus with nozzle moving means
    • 带喷嘴移动装置的涂布装置
    • US5250114A
    • 1993-10-05
    • US755781
    • 1991-09-06
    • Nobuo KonishiHideyuki TakamoriMasami AkimotoKiyohisa Tateyama
    • Nobuo KonishiHideyuki TakamoriMasami AkimotoKiyohisa Tateyama
    • G03F7/16B05C11/08H01L21/00H01L21/027H01L21/30H01L21/68B05B3/00
    • H01L21/67173H01L21/6715H01L21/6719
    • A coating apparatus includes two spin chucks located in a single casing to support and rotate wafers. A waiting trench is located between the spin chucks to discharge that part of coating liquid which has been hardened at the tip of a nozzle. The wafers are loaded and unloaded to and from the spin chucks by a single carrying member located outside the casing. A coating liquid supply mechanism includes the single nozzle for dispensing coating liquid onto the wafers supported by the spin chucks. The nozzle is moved between the spin chucks by a moving arm. Processing cycles relative to the spin chucks are set for a same processing time and the processing cycle relative to one of the spin chucks is shifted from that relative to the other by a half cycle. The nozzle is rested on the waiting trench at the time when it does not dispense the coating liquid onto the wafers supported by the spin chucks.
    • 涂覆装置包括位于单个壳体中的两个旋转卡盘,以支撑和旋转晶片。 等离子沟槽位于旋转卡盘之间,以排出在喷嘴尖端已经硬化的涂布液的那部分。 通过位于壳体外部的单个承载构件将晶片装载和卸载到旋转卡盘。 涂布液供给机构包括用于将涂布液分配到由旋转卡盘支撑的晶片上的单个喷嘴。 喷嘴通过移动臂在旋转卡盘之间移动。 相对于旋转卡盘的处理循环被设定为相同的处理时间,并且相对于其中一个旋转卡盘的处理循环相对于另一旋转卡盘的处理循环相对于另一旋转卡盘偏移半个周期。 在不将涂布液分配到由旋转卡盘支撑的晶片上时,喷嘴搁置在等待的沟槽上。