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61. 外观设计

USD703142S1 Electric connector 有权
公开(公告)号：USD703142S1
公开(公告)日：2014-04-22
申请号：US29430583
申请日：2012-08-28
申请人： Hirokazu Hoshino , Taijiro Fujiwara , Masahiro Ono
设计人： Hirokazu Hoshino , Taijiro Fujiwara , Masahiro Ono

62. 发明授权

US08636093B2 Vehicle body lower portion structure 有权
标题翻译：车身下部结构
公开(公告)号：US08636093B2
公开(公告)日：2014-01-28
申请号：US13819317
申请日：2010-08-30
申请人： Yoshitaka Sotoyama , Koki Ikeda , Shigeru Inamori , Kazuhiro Seki , Hiroaki Iwamoto , Masahiro Ono , Sho Maeda
发明人： Yoshitaka Sotoyama , Koki Ikeda , Shigeru Inamori , Kazuhiro Seki , Hiroaki Iwamoto , Masahiro Ono , Sho Maeda
IPC分类号： B62D25/20
CPC分类号： B62D21/15 , B62D21/152 , B62D25/14 , B62D25/20
摘要： To obtain a vehicle body lower portion structure that can efficiently absorb and disperse load of a front or rear collision including an offset collision or an oblique collision, and transmit the load to an underbody. A vehicle body lower portion structure has an underbody at which a dash lower portion and a lower back portion are provided to stand from both ends in a vehicle front-rear direction at a floor portion, a suspension member the length direction thereof is along a vehicle transverse direction and is joined to the underbody in a state of planarly-contacting a front surface of the dash lower portion, and a front EA member a length direction thereof is along the vehicle transverse direction and is joined to a front wall of the suspension member.
摘要翻译：为了获得能够有效地吸收和分散包括偏移碰撞或倾斜碰撞的前后碰撞的负载的车身下部结构，并将负载传递到底部。车体下部结构具有底板，底面设置有仪表板下部和下后部，以便在地板部分沿车辆前后方向的两端支撑，其长度方向为沿着车辆并且在与前下面的前表面平面接触的状态下接合到底体，并且其前方EA构件的长度方向沿着车辆横向方向并且连接到悬架构件的前壁。

63. 发明申请

US20130202941A1 FUSE BOARD AND BATTERY BLOCK EQUIPPED WITH SAME 审中-公开
标题翻译：保险丝板和电池块配备
公开(公告)号：US20130202941A1
公开(公告)日：2013-08-08
申请号：US13880282
申请日：2012-05-25
申请人： Masahiro Ono , Takashi Nakagawa , Akira Takano
发明人： Masahiro Ono , Takashi Nakagawa , Akira Takano
IPC分类号： H01H85/00 , H01H69/02
CPC分类号： H01H85/00 , H01H69/02 , H01H85/0241 , H01H85/12 , H01H85/143 , H01H85/205 , H01M2/30 , H01M2/34 , H01M10/4207 , H01M10/425 , H01M2200/103 , Y10T29/49107
摘要： A fuse board including a metal plate, a connection portion connected to a cell, a fuse portion connecting the metal plate to the connection portion, and an insulating resin film bonded to the fuse portion, wherein a wiring pattern of the fuse portion has a bent portion, and the insulating resin film has a rectangular sheet-like shape that covers one surface of the fuse portion.
摘要翻译：一种熔断器板，包括金属板，连接到电池的连接部分，将金属板连接到连接部分的熔丝部分，以及与熔丝部分接合的绝缘树脂膜，其中熔丝部分的布线图案具有弯曲并且绝缘树脂膜具有覆盖保险丝部分的一个表面的矩形片状形状。

64. 发明授权

US08476449B2 Radioactive iodine labeled organic compound or salt thereof 失效
标题翻译：放射性碘标记的有机化合物或其盐
公开(公告)号：US08476449B2
公开(公告)日：2013-07-02
申请号：US13582047
申请日：2011-02-24
申请人： Hideo Saji , Masahiro Ono , Ikuya Seki
发明人： Hideo Saji , Masahiro Ono , Ikuya Seki
IPC分类号： C07D405/06 , C07D405/14 , C07D417/06 , C07D417/14 , C07F7/22
CPC分类号： C07D417/06 , A61K51/0453 , C07D405/06 , C07D405/14
摘要： The present invention is a compound represented by the following formula (1) or a salt thereof. Furthermore, the present invention is an imaging agent used for imaging a tau protein, the imaging agent containing a compound represented by the formula (1) below or a salt thereof. In the formula (1), R3 is a radioactive iodine.
摘要翻译：本发明是由下式（1）表示的化合物或其盐。此外，本发明是用于成像tau蛋白的成像剂，该成像剂含有下述式（1）表示的化合物或其盐。在式（1）中，R 3是放射性碘。

65. 发明申请

US20110235224A1 SEMICONDUCTOR INTEGRATED CIRCUIT 有权
标题翻译：半导体集成电路
公开(公告)号：US20110235224A1
公开(公告)日：2011-09-29
申请号：US13040891
申请日：2011-03-04
申请人： Kyouichi KASHIMA , Yoshitaka Fukushima , Masahiro Ono , Tetsuro Hirano
发明人： Kyouichi KASHIMA , Yoshitaka Fukushima , Masahiro Ono , Tetsuro Hirano
IPC分类号： H02H3/00
CPC分类号： H02J7/0016
摘要： A circuit device connected between a neighboring pair of terminals in a semiconductor integrated circuit is protected from electrostatic damage due to a surge voltage when the surge voltage is applied between the neighboring pair of terminals. The semiconductor integrated circuit is formed to include terminals P0-P14, MOS transistors MN0-MN15 in diode connection, protection diode circuits HD0-HD14, MOS transistors T1-T14 for discharging electricity from batteries, a battery voltage detection control circuit and a clamp circuit for overvoltage protection. Each of the MOS transistors T1-T14 for discharging electricity from the batteries is connected between each neighboring pair of the terminals P0-P14 through wirings. Each of the MOS transistors MN1-MN14 in diode connection is connected between each neighboring pair of the terminals.
摘要翻译：当在相邻的一对端子之间施加浪涌电压时，连接在半导体集成电路中的相邻的一对端子之间的电路装置被防止由于浪涌电压引起的静电损伤。半导体集成电路形成为包括端子P0-P14，二极管连接的MOS晶体管MN0-MN15，保护二极管电路HD0-HD14，用于从电池放电的MOS晶体管T1-T14，电池电压检测控制电路和钳位电路用于过电压保护。用于从电池放电的MOS晶体管T1-T14中的每一个通过布线连接在每个相邻的一对端子P0-P14之间。二极管连接的MOS晶体管MN1〜MN14中的每一个连接在每个相邻的一对端子之间。

66. 发明授权

US07985078B2 Electrode junction structure and manufacturing method thereof 有权
标题翻译：电极结结构及其制造方法
公开(公告)号：US07985078B2
公开(公告)日：2011-07-26
申请号：US12644571
申请日：2009-12-22
申请人： Kentaro Kumazawa , Masahiro Ono , Yoshihiro Tomura
发明人： Kentaro Kumazawa , Masahiro Ono , Yoshihiro Tomura
IPC分类号： H01R12/00
CPC分类号： H01R13/52 , H05K1/142 , H05K3/284 , H05K3/361 , H05K2201/10977
摘要： The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.
摘要翻译：电极结结构包括：玻璃基板; 多个柔性基板在平面图中布置成跨过玻璃基板的边缘并且被布置成沿着边缘彼此具有空间; 用于接合玻璃基板和每个柔性基板的粘合剂; 以及密封树脂，用于覆盖玻璃基板和每个柔性基板之间的接合部分，其中形成密封树脂的边缘，使得密封树脂的边缘在平面图中具有连续的波形部分，其中凸部并且与假想线交替的凹部作为中心轴，所述假想线平行于所述玻璃基板的边缘并位于所述玻璃基板的边缘的外侧，并且其中所述凸部形成为位于所述柔性底物。

67. 发明申请

US20110172212A1 AMINE-BASED COMPOUND AND USE THEREOF 审中-公开
标题翻译：基于胺的化合物及其用途
公开(公告)号：US20110172212A1
公开(公告)日：2011-07-14
申请号：US13051248
申请日：2011-03-18
申请人： Atsushi SAITOU , Shigeyuki Kikumoto , Masahiro Ono , Ryo Matsui , Masashi Yamamoto , Tomohiro Sawa , Shigeru Suzuki , Mikiro Yanaka
发明人： Atsushi SAITOU , Shigeyuki Kikumoto , Masahiro Ono , Ryo Matsui , Masashi Yamamoto , Tomohiro Sawa , Shigeru Suzuki , Mikiro Yanaka
IPC分类号： A61K31/4178 , C07D403/12 , C07D403/14 , A61K31/4184 , C07D233/64 , A61K31/417 , C07D403/06 , A61K31/5513 , C07D401/12 , A61K31/4439 , C07D401/14 , A61K31/4725 , C07D471/04 , A61K31/437 , A61K31/454 , A61K31/4709 , C07D413/14 , A61K31/5377 , C07D405/14 , A61P29/00 , A61P35/04 , A61P31/12 , A61P31/18
CPC分类号： C07D403/12 , C07D263/64 , C07D401/14 , C07D403/14 , C07D405/14 , C07D413/14 , C07D417/14 , C07D471/04
摘要： Novel amine compounds which are represented by the following formula (1) and efficacious against diseases such as a viral infectious disease with HIV, rheumatism, and cancer metastasis; typically, A1 and A2 represent a hydrogen atom or a substitutable monocyclic or polycyclic heteroaromatic ring and W represents a substitutable benzene ring or any group represented by the following formula (10) or (11): where X represents O, CH2, C(═O), NR11, or CHR35 and D represents a group represented by the following formula (6): [Formula 4] -Q-Y—B (6) where Q represents a single bond, NR12, or a group represented by the formula (13): and Y represents a group represented by the following formula (7): [Formula 6] —(CR18R19)m3- or —(CR20R21)m4-z-(CR22R23)m5- (7) where z represents a substitutable monocyclic or polycyclic aromatic ring; and B represents —NR25R26; and R1 to R26 in the above formulae represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group.
摘要翻译：由下式（1）表示的新型胺化合物，对HIV，风湿病，癌症转移等病毒感染性疾病有效; 通常，A1和A2表示氢原子或可取代的单环或多环杂芳环，W表示可取代的苯环或由下式（10）或（11）表示的任何基团：其中X表示O，CH 2，C（= O），NR 11或CHR 35，D表示由下式（6）表示的基团：[式4] -QY-B（6）其中Q表示单键，NR12或由式（13）表示的基团）：Y表示由下式（7）表示的基团：[式6] - （CR18R19）m3-或 - （CR20R21）m4-z-（CR22R23）m5-（7）其中z表示可取代的单环或多环芳环; B代表-NR25R26; 上式中的R 1至R 26表示氢原子，烷基，烯基或炔基。

68. 发明授权

US07768795B2 Electronic circuit device, electronic device using the same, and method for manufacturing the same 有权
标题翻译：电子电路装置，使用该电子装置的电子装置及其制造方法
公开(公告)号：US07768795B2
公开(公告)日：2010-08-03
申请号：US11660515
申请日：2005-08-31
申请人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
发明人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
IPC分类号： H01R12/16
CPC分类号： H01L25/18 , G11C5/04 , H01L23/5386 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/92 , H01L24/96 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2224/24137 , H01L2224/32145 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/01078 , H01L2924/15331 , H05K1/185 , H05K1/189 , H05K3/4614
摘要： Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.
摘要翻译：电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。该电子电路装置（100）分配母基板。此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。

69. 发明授权

US07762819B2 Substrate connecting member and connecting structure 失效
标题翻译：基板连接构件和连接结构
公开(公告)号：US07762819B2
公开(公告)日：2010-07-27
申请号：US11918121
申请日：2006-07-06
申请人： Masato Mori , Yoshihiko Yagi , Masahiro Ono , Yoshihiro Tomura , Kunio Hibino , Yasushi Nakagiri , Akihiro Miyashita , Kunio Sakurai
发明人： Masato Mori , Yoshihiko Yagi , Masahiro Ono , Yoshihiro Tomura , Kunio Hibino , Yasushi Nakagiri , Akihiro Miyashita , Kunio Sakurai
IPC分类号： H01R12/00
CPC分类号： H05K3/368 , H05K1/0271 , H05K1/144 , H05K1/145 , H05K2201/042 , H05K2201/09036 , H05K2201/09163 , H05K2201/2018
摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.
摘要翻译：衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

70. 发明申请

US20100020497A1 SUBSTRATE STRUCTURE 失效
标题翻译：基板结构
公开(公告)号：US20100020497A1
公开(公告)日：2010-01-28
申请号：US12065177
申请日：2006-02-20
申请人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
发明人： Haruo Hayakawa , Masahiro Ono , Seiji Yamaguchi , Yoshihiro Uda , Kazuhiro Shinchi , Satoru Tomekawa , Kiyoshi Nakanishi , Kosuke Kubota , Atsushi Katagiri , Motohisa Kotani , Kazuhiro Konishi , Eiji Nishimura , Takeo Matsuki
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： H05K3/284 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/0218 , H05K1/0274 , H05K7/20463 , H05K9/0047 , H05K9/0086 , H05K2201/0209 , H05K2201/0215 , H05K2201/10128 , H05K2201/10515 , H05K2201/2054 , H05K2203/1316 , H05K2203/1322 , H01L2224/0401
摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.
摘要翻译：旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

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