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1. 发明申请

US20190031311A1 ROV Propeller Tailhood, ROV Propeller And ROV 审中-公开
公开(公告)号：US20190031311A1
公开(公告)日：2019-01-31
申请号：US16074932
申请日：2017-10-17
申请人： Tianjin Deepfar Ocean Technology Co., LTD
发明人： Jiancang WEI , Chunhao CUI
IPC分类号： B63H21/17 , H05K5/03 , H05K7/20 , B63C11/48 , B63G8/08
CPC分类号： B63H21/17 , B63C11/48 , B63G8/08 , H05K5/03 , H05K7/2039 , H05K7/20463
摘要： Disclosed is an ROV propeller tailhood comprising a body a control circuit board, a heat block, a thermal silica gel and long rod screws. The heat sink is fixed to the bottom of the control circuit board and disposed between the control circuit board and the body. The heat sink and the body are provided respectively with apertures that are matching with the long rod screws for fixing the heat sink to the body. The cooling silica gel is provided between the control circuit board and the heat sink.

2. 发明申请

US20170065734A1 POWER SUPPLY UNIT 审中-公开
标题翻译：供电单元
公开(公告)号：US20170065734A1
公开(公告)日：2017-03-09
申请号：US15119966
申请日：2015-01-21
申请人： Tetra Laval Holdings & Finance S.A.
发明人： Iosif IZRAILIT
IPC分类号： A61L2/08 , B65B55/08 , H05K7/20
CPC分类号： A61L2/087 , B65B55/08 , H05K1/11 , H05K1/185 , H05K3/285 , H05K7/20463 , H05K2201/10 , H05K2201/10151 , H05K2203/1377
摘要： Power supply unit, in particular for a sterilization device, comprising at least one electric component, wherein, at least one of the electric components is at least partly covered with a solid insulation layer, wherein the solid insulation layer is adapted to provide an electric insulation.
摘要翻译：电源单元，特别是用于消毒装置，包括至少一个电气部件，其中，所述电气部件中的至少一个至少部分地被固体绝缘层覆盖，其中所述固体绝缘层适于提供电绝缘。

3. 发明申请

US20170020033A1 DOUBLE INSULATED HEAT SPREADER 审中-公开
标题翻译：双重绝热散热器
公开(公告)号：US20170020033A1
公开(公告)日：2017-01-19
申请号：US15280567
申请日：2016-09-29
申请人： Enphase Energy, Inc.
发明人： Ryan Linderman
IPC分类号： H05K7/20 , H01L33/64 , H05K1/18 , H02M7/00 , H05K1/02 , H01L33/48 , H02S40/42
CPC分类号： H05K7/20409 , H01F27/022 , H01F27/08 , H01F2027/065 , H01L33/483 , H01L33/642 , H02M7/003 , H02S40/42 , H05K1/0203 , H05K1/0204 , H05K1/0206 , H05K1/0209 , H05K1/181 , H05K5/064 , H05K7/2039 , H05K7/20418 , H05K7/20436 , H05K7/20463 , H05K7/20472 , H05K7/2049 , H05K7/205 , H05K7/209 , H05K2201/066
摘要： An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.
摘要翻译：一种用于电气设备的热管理装置。在一个实施例中，该装置包括设置在外壳内的主要散热器，其包含填充有至少一个电气部件的印刷电路板（PCB），其中所述主散热器是导热的，并且其中所述外壳的内部至少部分地填充有封装材料; 耦合到所述外壳的第一壁的外表面的二次散热器，其中所述二次散热器是导热的; 以及耦合在主头扩展器和PCB之间的热界面，其中该热界面是导热的并且是电绝缘的。

4. 发明授权

US09445532B2 Integrated electrical and thermal solution for inverter DC-link capacitor packaging 有权
标题翻译：用于逆变器直流电容器封装的集成电热解决方案
公开(公告)号：US09445532B2
公开(公告)日：2016-09-13
申请号：US13891167
申请日：2013-05-09
申请人： Ford Global Technologies, LLC
发明人： Lihua Chen , Chingchi Chen , Shahram Zarei
IPC分类号： H05K7/20
CPC分类号： H05K7/209 , H05K7/20463 , H05K7/20509
摘要： An improved capacitor packaging solution is presented that incorporates both thermal and electrical considerations. A package can include capacitor elements electrically coupled to a bus bar, and a thermally enhanced isolation layer between the bus bar and a case. The isolation layer can be provided adjacent a case base and sidewall portions. The bus bar can be disposed adjacent the isolation layer and be configured to extend along the package side and along the package length below the capacitor elements to provide an extended path for heat dissipation from the bus bar prior to its contact with capacitor elements. The enhanced isolation layer is configured to conduct heat away from the bus bar to the case to avoid the hotspot temperature of the capacitor. Reduced capacitor temperature allows use of smaller, cheaper capacitors, reducing inverter costs without compromising performance.
摘要翻译：提出了一种改进的电容器封装解决方案，其中兼顾了热和电的考虑。封装可以包括电耦合到母线的电容器元件，以及汇流条和外壳之间的热增强隔离层。隔离层可以邻近壳体基部和侧壁部分设置。母线可以邻近隔离层设置，并且被配置为沿着封装侧延伸并且沿电容器元件下方的封装长度延伸，以提供用于在与电容器元件接触之前从母线散热的延伸路径。增强的隔离层被配置为将热量从母线传导到壳体以避免电容器的热点温度。降低电容器温度允许使用更小，更便宜的电容器，从而降低变频器成本而不会影响性能。

5. 发明授权

US09247676B2 Electronic device cooling systems 有权
标题翻译：电子设备冷却系统
公开(公告)号：US09247676B2
公开(公告)日：2016-01-26
申请号：US13967011
申请日：2013-08-14
申请人： The DIRECTV Group, Inc.
发明人： Henry Derovanessian , Robin M. Mathews
IPC分类号： H05K7/20 , G06F1/20 , H05K9/00 , H05K5/00 , F28F7/00 , H01L23/34
CPC分类号： H05K7/20418 , F28F7/00 , G06F1/20 , H01L23/34 , H01L2924/0002 , H01L2924/10155 , H05K5/00 , H05K7/20 , H05K7/20463 , H05K9/00 , H01L2924/00
摘要： An electronic device includes: a housing having one or more interior surfaces; an electronic circuit that is disposed within the housing, that does not directly contact any of the one or more interior surfaces of the housing, and that includes at least one electrical component that consumes electrical power; and a thermally conductive material that surrounds the electronic circuit within the housing, that directly contacts both the at least one electrical component and the one or more interior surfaces of the housing, that absorbs heat from the at least one electrical component, and that transfers heat to the housing.
摘要翻译：电子设备包括：具有一个或多个内表面的外壳; 设置在所述壳体内的电子电路，其不直接接触所述壳体的所述一个或多个内表面中的任何一个，并且包括消耗电力的至少一个电部件; 以及导热材料，其围绕所述壳体内的所述电子电路，其直接接触所述至少一个电气部件和所述壳体的所述一个或多个内表面，所述内部表面吸收来自所述至少一个电气部件的热量，并且传递热量到房屋

6. 发明授权

US09204575B2 Apparatus for and method of cooling molded electronic circuits 有权
标题翻译：冷却模制电子电路的设备和方法
公开(公告)号：US09204575B2
公开(公告)日：2015-12-01
申请号：US13600115
申请日：2012-08-30
申请人： Bahman Sharifipour , Arian Jansen
发明人： Bahman Sharifipour , Arian Jansen
IPC分类号： H05K7/20
CPC分类号： H05K7/20463 , Y10T29/49117
摘要： An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.
摘要翻译：诸如AC / DC电源适配器的电子设备包括导电散热系统。该装置包含发热元件，并通过外部电源电路的电源引线供电。该装置还包括热传导质量块，其热耦合到发热部件和电源引线两者。当电源引线被耦合以从外部电源电路接收电力时，由器件产生的热量经由电源引线被热传导到外部电源电路中。

7. 发明申请

US20150163958A1 HEAT DISSIPATION STRUCTURE 审中-公开
标题翻译：散热结构
公开(公告)号：US20150163958A1
公开(公告)日：2015-06-11
申请号：US14407257
申请日：2013-06-06
申请人： KANEKA CORPORATION
发明人： Keisuke Oguma , Aki Koukami , Kazuo Hagiwara
IPC分类号： H05K7/20 , C08L71/02 , B29C73/02 , C08L33/00
CPC分类号： H05K7/2039 , B29C73/02 , C08L33/00 , C08L71/02 , H01L23/295 , H01L23/3121 , H01L23/3737 , H01L23/42 , H01L23/552 , H01L25/0655 , H01L2924/0002 , H01L2924/16151 , H01L2924/16251 , H01L2924/166 , H01L2924/3025 , H05K7/20463 , H05K9/0024 , H01L2924/00
摘要： The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.
摘要翻译：本发明提供一种散热结构，其不会引起电子部件的接触不良等问题，适用于高密度的电子部件。本发明还提供一种易于修复电子设备的方法。通过在其上安装有热密度为0.2W / cm 2至500W / cm 2的电子部件的基板上的电磁屏蔽壳体中填充和固化导热性固化性树脂组合物，获得散热结构，在23℃下的粘度为30Pa·s〜3000Pa·s，导热率为0.5W /（m·K）的含有固化型液态树脂（I）和导热性填料（II）的树脂组合物，或更多，并且可通过水分或热量固化。

8. 发明申请

US20150013956A1 HEAT RADIATION PLATE AND SUBMARINE APPARATUS 审中-公开
标题翻译：热辐射板和海底设备
公开(公告)号：US20150013956A1
公开(公告)日：2015-01-15
申请号：US14286118
申请日：2014-05-23
申请人： FUJITSU LIMITED
发明人： Takahisa Yoshizumi , Naoto Hoshiyama
IPC分类号： H05K7/20
CPC分类号： H05K7/20463 , H01L21/56 , H01L23/24 , H01L23/3675 , H01L23/3737 , H01L23/42 , H01L2924/0002 , H05K3/0061 , H05K3/284 , H05K7/20509 , H01L2924/00
摘要： A heat radiation plate includes a depressed portion into which thermally-conductive resin that transfers heat of an electronic component to the heat radiation plate is poured, and a plurality of check portions configured to be provided to the depressed portion and with an upper surface portion and a lower surface portion stepwise at positions lower than an outer edge portion of the depressed portion and higher than a bottom surface portion of the depressed portion so that a liquid level of the thermally-conductive resin is visually checkable, wherein when the thermally-conductive resin is normally filled in the depressed portion, each of the lower surface portions of the plurality of check portions is covered with the thermally-conductive resin and each of the upper surface portions of the plurality of check portions is exposed without being covered with the thermally-conductive resin.
摘要翻译：散热板包括凹陷部分，其中将传导电子部件的热量的导热树脂注入到散热板中，并且将多个检查部分配置成设置在凹部和上表面部分上，下表面部分在低于凹陷部分的外边缘部分的位置处并且高于凹陷部分的底表面部分的步骤，使得目视可以检查导热树脂的液位，其中当导热树脂通常填充在凹部中，多个检查部的每个下表面部分被导热树脂覆盖，并且多个检查部分的每个上表面部分都被暴露，导电树脂。

9. 发明申请

US20140256174A1 TERMINAL BOX FOR SOLAR CELL 审中-公开
标题翻译：太阳能电池终端盒
公开(公告)号：US20140256174A1
公开(公告)日：2014-09-11
申请号：US13941564
申请日：2013-07-15
申请人： ZHEJIANG JIAMING TIANHEYUAN PHOTOVOLTAIC TECHNOLOGY, LTD
发明人： WEI HUI WANG
IPC分类号： H01R13/00
CPC分类号： H01R13/00 , H02G3/16 , H02S40/345 , H05K7/20463
摘要： A terminal box for solar cell includes a box body, a bottom cover, a conducting component provided in the box body, and thermal conductive gel which is provided on the box body and the bottom cover and to embrace around the conducting component for heat dissipation. The conducting component includes four conducting elements constructed independently. The thermal conductive gel, embodied as thermal conductive silica gel, which is made from primarily organic silica gel mixed with additive fillers and thermal conductive polymer materials, providing better heat dissipating ability and electrical insulation property, reducing the heat accumulation in the conducting component, enhancing an effective sealing ability for the terminal box, and preventing the occurrence of higher operation temperature of the terminal box after it has been operated for a long period of time.
摘要翻译：太阳能电池用接线盒包括箱体，底盖，设置在箱体内的导电部件，以及设置在箱体和底盖上并围绕导电部件散热的导热性凝胶。导电组件包括独立构造的四个导电元件。导热凝胶体现为导热硅胶，由主要有机硅胶与添加剂填料和导热聚合物材料混合制成，提供更好的散热能力和电绝缘性能，减少导电组件中的热积聚，增强对接线盒有效的密封能力，并且能够防止接线盒在长时间运行之后发生较高的操作温度。

10. 发明授权

US08295048B2 Apparatus for and method of cooling electronic circuits 有权
标题翻译：电子电路冷却装置和冷却方法
公开(公告)号：US08295048B2
公开(公告)日：2012-10-23
申请号：US12973774
申请日：2010-12-20
申请人： Bahman Sharifipour , Arian Jansen
发明人： Bahman Sharifipour , Arian Jansen
IPC分类号： H05K7/20
CPC分类号： H05K7/20463 , Y10T29/49117
摘要： An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.
摘要翻译：诸如AC / DC电源适配器的电子设备包括导电散热系统。该装置包含发热元件，并通过外部电源电路的电源引线供电。该装置还包括热传导质量块，其热耦合到发热部件和电源引线。当电源引线被耦合以从外部电源电路接收电力时，由器件产生的热量经由电源引线被热传导到外部电源电路中。

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