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    • 51. 发明授权
    • Two-wavelength semiconductor laser device and its fabricating method
    • 双波长半导体激光器件及其制造方法
    • US07809042B2
    • 2010-10-05
    • US12269583
    • 2008-11-12
    • Kouji MakitaTakayuki Kashima
    • Kouji MakitaTakayuki Kashima
    • H01S5/00
    • H01S5/4031B82Y20/00H01S5/162H01S5/2004H01S5/2201H01S5/2231H01S5/3202H01S5/34313H01S5/34326H01S5/4087H01S2301/185
    • A two-wavelength semiconductor laser device includes a first semiconductor laser device including a first-conductivity type first cladding layer, a first guide layer made of AlGaAs mixed crystal, a first quantum well active layer having a barrier layer made of AlGaAs mixed crystal, a second guide layer made of AlGaAs mixed crystal, and a second-conductivity type second cladding layer, and a second semiconductor laser device including a first-conductivity type third cladding layer, a third guide layer made of AlGaInP mixed crystal, a second quantum well active layer having a barrier layer made of AlGaInP mixed crystal, a fourth guide layer made of AlGaInP mixed crystal, and a second-conductivity type fourth cladding layer. At least the barrier layer included in the first quantum well active layer, the first guide layer, and the second guide layer each have an Al molar ratio of more than 0.47 and 0.60 or less.
    • 双波长半导体激光器件包括:第一半导体激光器件,包括第一导电型第一包层,由AlGaAs混晶构成的第一引导层;具有由AlGaAs混晶构成的阻挡层的第一量子阱有源层; 由AlGaAs混晶构成的第二引导层和第二导电型第二覆层,以及包括第一导电型第三覆层,由AlGaInP混晶构成的第三引导层的第二半导体激光器件,第二量子阱活性 具有由AlGaInP混晶构成的阻挡层的层,由AlGaInP混晶构成的第四引导层和第二导电型第四覆层。 至少包含在第一量子阱活性层,第一引导层和第二引导层中的阻挡层各自具有大于0.47和0.60或更小的Al摩尔比。
    • 57. 发明授权
    • Method of fabricating nitride-based semiconductor laser diode
    • 制造氮化物基半导体激光二极管的方法
    • US07736925B2
    • 2010-06-15
    • US11448800
    • 2006-06-08
    • Tan SakongYoun-joon SungHo-sun Paek
    • Tan SakongYoun-joon SungHo-sun Paek
    • H01L21/00
    • H01S5/22B82Y20/00H01S5/0213H01S5/16H01S5/2201H01S5/34333H01S2304/12
    • A method of manufacturing a nitride-based semiconductor laser diode that can minimize optical absorption on a cavity mirror plane and improve the surface roughness of the cavity mirror plane is provided. The method includes the steps of: forming on a (0001) GaN (gallium nitride) substrate having at least two masks spaced apart by a distance equal to a laser cavity length in stripes that extend along the direction; growing an n-GaN layer on the GaN substrate between the masks so that two (1-100) edges of the n-GaN layer are thicker than the remaining regions thereof; sequentially stacking an n-clad layer, an active layer, and a p-clad layer on the n-GaN layer to form an edge-emitting laser cavity structure in which laser light generated in the active layer passes through a region of the n-clad layer aligned laterally with the active layer and is output; and etching a (1-100) plane of the laser cavity structure to form a cavity mirror plane.
    • 提供一种制造氮化物基半导体激光二极管的方法,其可以使腔镜面上的光吸收最小化并且改善腔镜面的表面粗糙度。 该方法包括以下步骤:在(0001)GaN(氮化镓)衬底上形成具有至少两个掩模,该掩模间隔开等于沿着<11-20>方向延伸的条纹的激光器腔长度的距离; 在掩模之间的GaN衬底上生长n-GaN层,使得n-GaN层的两个(1-100)边缘比其余区域厚; 顺序地在n-GaN层上层叠n包覆层,有源层和p覆盖层,以形成边缘发射激光器腔结构,其中在有源层中产生的激光穿过n-GaN层的区域, 包层与活性层横向排列并被输出; 并蚀刻激光腔结构的(1-100)面以形成腔镜面。
    • 58. 发明申请
    • NITRIDE-BASED SEMICONDUCTOR LASER DEVICE AND OPTICAL PICKUP
    • 基于氮化物的半导体激光器件和光学拾取器
    • US20100127154A1
    • 2010-05-27
    • US12620252
    • 2009-11-17
    • Shingo Kameyama
    • Shingo Kameyama
    • G01J1/20H01S5/026
    • H01S5/34333B82Y20/00H01S5/02212H01S5/028H01S5/0282H01S5/0287H01S5/2009H01S5/2201H01S5/305H01S5/3063
    • A nitride-based semiconductor laser device includes a facet coating film including an alteration preventing layer formed on a light reflecting side facet of a nitride-based semiconductor element layer and a reflectance control layer formed on the alteration preventing layer. The reflectance control layer is formed by a high refractive index layer and a low refractive index layer which are alternately stacked, the alteration preventing layer is constituted by stacking at least two layers, each of which is formed by a dielectric layer made of a nitride, an oxide or an oxynitride. The alteration preventing layer has a first layer made of a nitride in contact with the light reflecting side facet, and a thickness of each of the layers constituting the alteration preventing layer is smaller than that of the high refractive index layer and is smaller than that of the low refractive index layer.
    • 氮化物系半导体激光装置包括:具有形成在氮化物系半导体元件层的反射侧面上的防变色层和形成在防变色层上的反射率控制层的面涂膜。 反射控制层由交替堆叠的高折射率层和低折射率层形成,防变色层由至少两层构成,每层由由氮化物构成的电介质层形成, 氧化物或氧氮化物。 防变色层具有由与光反射侧面接触的氮化物构成的第一层,构成防变色层的各层的厚度小于高折射率层的厚度,小于高折射率层的厚度 低折射率层。
    • 59. 发明授权
    • Nitride semiconductor light-emitting device
    • 氮化物半导体发光器件
    • US07700963B2
    • 2010-04-20
    • US12216533
    • 2008-07-07
    • Teruyoshi TakakuraShigetoshi ItoTakeshi Kamikawa
    • Teruyoshi TakakuraShigetoshi ItoTakeshi Kamikawa
    • H01L33/00
    • H01S5/3202B82Y20/00H01L33/007H01S5/0202H01S5/0207H01S5/0211H01S5/0425H01S5/2201H01S5/2214H01S5/34333
    • In a method for producing a nitride semiconductor light-emitting device according to the present invention, first, a nitride semiconductor substrate having groove portions formed is prepared. An underlying layer comprising nitride semiconductor is formed on the nitride semiconductor substrate including the side walls of the groove portions, in such a manner that the underlying layer has a crystal surface in each of the groove portions and the crystal surface is tilted at an angle of from 53.5° to 63.4° with respect to the surface of the substrate. Over the underlying layer, a light-emitting-device structure composed of a lower cladding layer containing Al, an active layer, and an upper cladding layer containing Al is formed. According to the present invention, thickness nonuniformity and lack of surface flatness, which occur when accumulating a layer with light-emitting-device structure of nitride semiconductor over the nitride semiconductor substrate, are alleviated while inhibiting occurrence of cracking.
    • 在本发明的氮化物半导体发光元件的制造方法中,首先,准备形成有槽部的氮化物半导体基板。 在包括沟槽部分的侧壁的氮化物半导体衬底上形成包括氮化物半导体的下层,使得下层在每个沟槽部分中具有晶体表面,并且晶体表面以 相对于基板的表面为53.5°〜63.4°。 在下层之上,形成由包含Al的下包层,有源层和含有Al的上包层组成的发光器件结构。 根据本发明,在氮化物半导体衬底上堆积具有氮化物半导体的发光器件结构的层时发生的厚度不均匀性和表面平坦度不足,同时抑制裂纹的发生。