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1. 发明授权

US10014657B2 Laser-machined optical components and related methods for pick and bond assembly 有权
公开(公告)号：US10014657B2
公开(公告)日：2018-07-03
申请号：US15329436
申请日：2015-07-27
申请人： DOLBY LABORATORIES LICENSING CORPORATION
发明人： Gregory David Miller , Gennady Imeshev , James Thomas Triplett
IPC分类号： H01S5/02 , H01S5/022 , G02B3/00 , H01S5/00 , H01S5/026 , H01S5/40
CPC分类号： H01S5/02268 , G02B3/0012 , H01S5/005 , H01S5/02252 , H01S5/02256 , H01S5/02288 , H01S5/0261 , H01S5/4025
摘要： Methods and systems for optical assemblies are disclosed. Optical assemblies can comprise optical elements that may not require active alignment and allow for reduced performance variations. To allow for passive assembly with a machine like a bonder tool, assembly components can have bonding pads and/or fiducial markers that are fabricated using laser micromachining techniques.

2. 发明授权

US09728935B2 Chip-scale package and semiconductor device assembly 有权
公开(公告)号：US09728935B2
公开(公告)日：2017-08-08
申请号：US14731510
申请日：2015-06-05
申请人： Lumentum Operations LLC
发明人： Kong Weng Lee , Vincent V. Wong , Jay A. Skidmore , Jihua Du
IPC分类号： H01S3/04 , H01S5/022 , H01S5/024
CPC分类号： H01S5/02272 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/16151 , H01L2924/16152 , H01S5/022 , H01S5/02236 , H01S5/02256 , H01S5/02268 , H01S5/02276 , H01S5/02296 , H01S5/02469 , H01S5/02476 , H01L2924/00014
摘要： A chip-scale package for an edge-emitting semiconductor device and a semiconductor device assembly including such a chip-scale package are provided. The chip-scale package includes an edge-emitting semiconductor device chip, a top submount disposed on a top surface of the chip, and a bottom submount disposed on a bottom surface of the chip. The top-submount area and the bottom-submount area are each greater than the chip area and less than or equal to about 1.2 times the chip area.

3. 发明授权

US09543736B1 Optimized solder pads for solder induced alignment of opto-electronic chips 有权
标题翻译：优化的焊盘用于焊接引起的光电芯片对准
公开(公告)号：US09543736B1
公开(公告)日：2017-01-10
申请号：US14947621
申请日：2015-11-20
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Tymon Barwicz , Yves Martin
IPC分类号： H01S5/022 , H01S5/30 , H01S5/024 , G02B6/13 , G02B6/12
CPC分类号： G02B6/4232 , G02B6/12002 , G02B6/12004 , H01L2224/83192 , H01S5/0224 , H01S5/02268 , H01S5/02272 , H01S5/02469
摘要： A technique relates to assembling a multi-chip system. A first chip stack element having two major surfaces and a first solder pad, a first vertical stop, a first lateral stop and a first waveguiding element is provided. A second chip stack element having two major surfaces and including a second solder pad, a flow resistor connected to the second solder pad, a second vertical stop, a second lateral stop, a reservoir pad connected to the flow resistor, and a second waveguiding element is provided. A solder material is plated to form a plated solder pad. A technique includes pre-aligning the first chip stack element and the second chip stack element, raising the temperature to a temperature above the melting temperature of the solder material, and flowing solder through the flow resistor. Aspects include aligning the first and second waveguiding elements and cooling the connected assembly to re-solidify the solder material.
摘要翻译：技术涉及组装多芯片系统。提供具有两个主表面的第一芯片堆叠元件和第一焊盘，第一垂直止动器，第一横向止动器和第一波导元件。具有两个主表面并且包括第二焊盘的第二芯片堆叠元件，连接到第二焊盘的流阻器，第二垂直止动器，第二横向止动器，连接到流阻器的储存器衬垫，以及第二波导元件被提供。焊接材料被镀覆以形成镀覆的焊盘。一种技术包括预先对准第一芯片堆叠元件和第二芯片堆叠元件，将温度升高到高于焊料材料的熔化温度的温度，并使焊料流过流阻器。方面包括对准第一和第二波导元件并冷却连接的组件以重新固化焊料材料。

4. 发明申请

US20160329679A1 BEAM PROJECTION FOR FAST AXIS EXPANSION 审中-公开
标题翻译：用于快速轴扩展的波束投影
公开(公告)号：US20160329679A1
公开(公告)日：2016-11-10
申请号：US14705327
申请日：2015-05-06
申请人： Microsoft Technology Licensing, LLC
发明人： David Bohn
IPC分类号： H01S5/00 , G02B5/06 , G02B5/02 , H01S5/022 , G02B27/09
CPC分类号： H01S5/0071 , G02B5/0278 , G02B5/0294 , G02B5/06 , G02B27/095 , H01S5/02244 , H01S5/02248 , H01S5/02268 , H01S5/02272 , H01S5/02276
摘要： A light projection system disclosed herein provides fast axis expansion of a light beam for high optical performance despite sizing constraints of a device into which the light projection system is integrated. In one implementation, the light projection system includes a diffuser, an edge-emitting semiconductor laser diode, and a printed circuit board. The diffuser defines a diffuser plane and is oriented to be substantially parallel to least a portion of the printed circuit board. The edge-emitting semiconductor laser diode emits laser light having a fast axis and a slow axis, with the fast axis of the laser light defining a fast axis plane corresponding to a path the laser light travels from the edge-emitting semiconductor laser diode. The edge-emitting semiconductor laser diode is oriented such that the fast axis plane is substantially parallel the diffuser plane between the diffuser and at least the parallel portion of the printed circuit board.
摘要翻译：本文公开的光投射系统提供了用于高光学性能的光束的快速轴扩展，尽管光投射系统被集成到其中的装置的尺寸限制。在一个实施方案中，光投射系统包括扩散器，边缘发射半导体激光二极管和印刷电路板。漫射器限定漫射器平面并且被定向成基本上平行于印刷电路板的至少一部分。边缘发射半导体激光二极管发射具有快轴和慢轴的激光，其中激光的快轴定义对应于激光从边缘发射半导体激光二极管行进的路径的快轴平面。边缘发射半导体激光二极管被定向成使得快轴平面基本上平行于扩散器与印刷电路板的至少平行部分之间的扩散器平面。

5. 发明授权

US09466942B2 Optical element module 有权
标题翻译：光学元件模块
公开(公告)号：US09466942B2
公开(公告)日：2016-10-11
申请号：US14564270
申请日：2014-12-09
申请人： FURUKAWA ELECTRIC CO., LTD.
发明人： Tetsuya Matsuyama , Maiko Ariga , Toshio Sugaya , Toshio Kimura
IPC分类号： H01S3/04 , H01S5/024 , H01S5/12 , H01S5/022 , H01S5/0683 , H01S5/0687 , H01S5/00 , H01S5/026
CPC分类号： H01S5/02415 , H01S5/0064 , H01S5/02208 , H01S5/0222 , H01S5/02248 , H01S5/02268 , H01S5/02284 , H01S5/02438 , H01S5/02446 , H01S5/026 , H01S5/0265 , H01S5/0683 , H01S5/0687 , H01S5/12
摘要： An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.
摘要翻译：光学元件模块包括具有底板的壳体，温度调节单元安装在壳体中的底板上，并且至少具有下层部分和位于下层部分上方的上层部分，在壳体中的温度调节单元上，并且半导体激光元件安装在支撑构件上并向前侧输出激光。温度调节单元的上层部分相对于下层部分在半导体激光元件的后侧突出。

6. 发明授权

US09130335B2 Light beam emission apparatus, optical scanning apparatus including the light beam emission apparatus, and image forming apparatus including the optical scanning apparatus 有权
标题翻译：光束发射装置，包括光束发射装置的光学扫描装置和包括光学扫描装置的图像形成装置
公开(公告)号：US09130335B2
公开(公告)日：2015-09-08
申请号：US13526793
申请日：2012-06-19
申请人： Toshiki Momoka
发明人： Toshiki Momoka
IPC分类号： G02B7/02 , H01S5/022 , B41J2/44 , B41J2/47 , G03G15/04 , G02B26/12 , G03G15/043
CPC分类号： H01S5/02268 , B41J2/442 , B41J2/473 , G02B7/022 , G02B26/123 , G03G15/04036 , G03G15/0435 , H01S5/02252 , H01S5/02288
摘要： In a light beam emission apparatus, the height of an elastic member configured to fill a clearance between a laser element and a laser holder is longer than the distance from a start position of press fitting of the laser element to a surface of the laser holder with which the elastic member comes into contact.
摘要翻译：在光束发射装置中，构成为填充激光元件与激光保持器之间的间隙的弹性部件的高度比从激光元件的压入开始位置到激光器保持器的表面的距离长，弹性构件接触。

7. 发明申请

US20150229106A1 LASER LIGHT SOURCE MODULE AND LASER LIGHT SOURCE DEVICE 有权
标题翻译：激光光源模块和激光光源设备
公开(公告)号：US20150229106A1
公开(公告)日：2015-08-13
申请号：US14475914
申请日：2014-09-03
申请人： Mitsubishi Electric Corporation
发明人： Mitoru YABE
IPC分类号： H01S5/40 , H01S5/022
CPC分类号： H01S5/02252 , H01S5/02208 , H01S5/02248 , H01S5/02256 , H01S5/02268 , H01S5/02272 , H01S5/02276 , H01S5/02284 , H01S5/02288 , H01S5/02469 , H01S5/02476 , H01S5/4012 , H01S5/4031 , H01S5/4043 , H01S5/405
摘要： A laser light source module includes: a plate-shaped stem; a power supply lead pin having an upper end protruding from an upper surface being one of main surfaces of the stem and a lower end penetrating to extend toward a lower surface side, the lower surface being the other of the main surface of the stem; a block fixed to the upper surface of the stem; a submount substrate that is fixed to a surface of the block and includes the semiconductor laser array mounted thereon, the surface being parallel to the upper surface of the stem; the semiconductor laser array located on the submount substrate such that a light emitting direction is parallel to the upper surface of the stem; and a collimator lens array that is located on a front surface of the semiconductor laser array and converts an output light beam of the semiconductor laser array into a parallel light beam.
摘要翻译：激光光源模块包括：板状杆; 电源引脚，其具有从上表面突出的上端，所述上端是所述杆的主表面之一，并且下端穿透以朝向下表面侧延伸，所述下表面是所述杆的主表面中的另一个; 固定在所述杆的上表面的块; 固定到所述块的表面并且包括安装在其上的所述半导体激光器阵列的所述表面平行于所述杆的上表面的副安装座基板; 所述半导体激光器阵列位于所述副安装座基板上，使得发光方向平行于所述杆的上表面; 以及位于半导体激光器阵列的前表面上并将半导体激光器阵列的输出光束转换为平行光束的准直透镜阵列。

8. 发明授权

US09083136B1 Semiconductor laser light source 有权
标题翻译：半导体激光光源
公开(公告)号：US09083136B1
公开(公告)日：2015-07-14
申请号：US14558366
申请日：2014-12-02
申请人： Mitsubishi Electric Corporation
发明人： Yuki Hasegawa , Mitsuaki Futami , Toru Yoshihara
IPC分类号： H01S5/022 , H01S5/40
CPC分类号： H01S5/02208 , H01S5/022 , H01S5/02236 , H01S5/02268 , H01S5/40 , H01S5/4025 , H01S5/4037 , H01S5/4087
摘要： A semiconductor laser light source includes a semiconductor laser block mounted on a stem which is a support base, the semiconductor laser block which is a block has a plurality of surfaces, and a plurality of semiconductor laser chips emit laser light beams of different wavelengths, respectively. Each of the semiconductor laser chips is mounted on each surface of the semiconductor laser block.
摘要翻译：半导体激光源包括安装在作为支撑基座的杆上的半导体激光器块，作为块的半导体激光器块具有多个表面，并且多个半导体激光器芯片分别发射不同波长的激光束。每个半导体激光芯片安装在半导体激光器块的每个表面上。

9. 发明授权

US09008138B2 Laser diode device 有权
标题翻译：激光二极管装置
公开(公告)号：US09008138B2
公开(公告)日：2015-04-14
申请号：US13859446
申请日：2013-04-09
申请人： OSRAM Opto Semiconductors GmbH
发明人： Uwe Strauss , Soenke Tautz , Alfred Lell , Clemens Vierheilig
IPC分类号： H01S5/00 , H01S5/022 , H01S5/024 , H01S5/028 , H01S5/22
CPC分类号： H01S5/02236 , H01S5/02268 , H01S5/02272 , H01S5/02461 , H01S5/02469 , H01S5/028 , H01S5/22 , H01S2301/176
摘要： A laser diode device is specified, comprising a housing having a mounting part and a laser diode chip based on a nitride compound semiconductor material in the housing on the mounting part, wherein the laser diode chip is mounted directly on the mounting part using a solder layer, and the solder layer has a thickness of greater than or equal to 3 μm.
摘要翻译：一种激光二极管装置，其特征在于，包括具有安装部的壳体和基于安装部上的壳体中的氮化物化合物半导体材料的激光二极管芯片，其中，使用焊料层将激光二极管芯片直接安装在安装部上焊料层的厚度大于或等于3μm。

10. 发明申请

US20150097211A1 STRUCTURES FOR BONDING A DIRECT-BANDGAP CHIP TO A SILICON PHOTONIC DEVICE 有权
标题翻译：将直接带状芯片连接到硅光电器件的结构
公开(公告)号：US20150097211A1
公开(公告)日：2015-04-09
申请号：US14509979
申请日：2014-10-08
申请人： Skorpios Technologies, Inc.
发明人： Stephen B. Krasulick , John Dallesasse , Amit Mizrahi , Timothy Creazzo , Elton Marchena , John Y. Spann
IPC分类号： H01L31/109 , H01L31/0203 , H01L31/0232 , H01L31/0304
CPC分类号： H01L31/02327 , G02B6/423 , H01S5/0207 , H01S5/021 , H01S5/0217 , H01S5/0218 , H01S5/0224 , H01S5/02248 , H01S5/02252 , H01S5/02268 , H01S5/02272 , H01S5/02469 , H01S5/026 , H01S5/3013 , H01S2301/176
摘要： A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.
摘要翻译：复合光子器件包括平台，芯片和接触层。该平台包括硅。该芯片由III-V材料制成。接触层具有凹陷以帮助在平台与芯片的接合期间控制焊料的流动。在一些实施例中，基座放置在光路下方以防止焊料在光路处在芯片和平台之间流动。

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