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51. 发明申请

US20030069711A1 Data processing system, method, and product for automatically tracking insertions of integrated circuit devices 失效
标题翻译：用于自动跟踪集成电路器件插入的数据处理系统，方法和产品
公开(公告)号：US20030069711A1
公开(公告)日：2003-04-10
申请号：US09971144
申请日：2001-10-04
申请人： International Business Machines Corporation
发明人： George Henry Ahrens JR. , Susan L. Caunt , Alongkorn Kitamorn , Leo C. Mooney
IPC分类号： G06F015/00
CPC分类号： G05B19/41805 , G05B2219/37002 , G05B2219/45026 , Y02P90/04
摘要： A data processing system, method, and computer program product are disclosed for automatically tracking insertions of integrated circuit devices into receptacle devices. An insertion of an integrated circuit device is automatically detected utilizing the data processing system. An insertion count that is associated with the integrated circuit device is automatically incremented in response to a detection of an insertion of the integrated circuit device. The insertion count is used to track insertions of the integrated circuit device.
摘要翻译：公开了一种数据处理系统，方法和计算机程序产品，用于自动跟踪将集成电路装置插入到插座装置中。使用数据处理系统自动检测集成电路装置的插入。响应于集成电路装置的插入的检测，与集成电路装置相关联的插入计数自动递增。插入计数用于跟踪集成电路器件的插入。

52. 发明申请

US20030060931A1 Robotic system control 失效
公开(公告)号：US20030060931A1
公开(公告)日：2003-03-27
申请号：US10193926
申请日：2002-07-12
申请人： Natarajan Ramanan to FSI International
发明人： Subodha Kumar , Natarajan Ramanan , Chelliah Sriskandarajah
IPC分类号： G06F019/00
CPC分类号： B25J9/1656 , G05B19/41815 , G05B19/41865 , G05B2219/32091 , G05B2219/40384 , G05B2219/40519 , G05B2219/45026 , G06N3/126 , Y02P90/08 , Y02P90/20 , Y10S700/90
摘要： In an automated processing system, a system controller uses a meta-heuristic technique for identifying an optimal or near-optimal control schedule for controlling movements and operations of a robot. In particular embodiments, the system controller uses a genetic algorithm to breed a control schedule for the robot. In particular embodiments, the system controller dynamically updates the control schedule based on system operation.

53. 发明申请

US20020156548A1 Computer integrated manufacturing techniques 有权
标题翻译：计算机集成制造技术
公开(公告)号：US20020156548A1
公开(公告)日：2002-10-24
申请号：US10084092
申请日：2002-02-28
申请人： Applied Materials, Inc.
发明人： John F. Arackaparambil , Tom Chi , Billy Chow , Patrick M. D'Souza , Parris Hawkins , Charles Huang , Jett Jensen , Badri N. Krishnamurthy , Pradeep M. Kulkarni , Prakash M. Kulkarni , Wen Fong Lin , Shantha Mohan , Bishnu Nandy , Huey-Shin Yuan
IPC分类号： G06F155/00 , G06F019/00
CPC分类号： G05B19/41845 , G05B2219/31018 , G05B2219/31202 , G05B2219/45026 , Y02P90/20 , Y02P90/24 , Y02P90/26 , Y02P90/86
摘要： The present invention provides a novel distributed factory system framework including a novel factory automation lifecycle (200) having lifecycle activities for SW developing and integrating (210), installing and administrating (220), factory modeling (230), manufacturing planning (240), manufacturing controlling, monitoring and tracking (250) and analyzing of manufacturing results (260). The factory lifecycle comprises framework components. The distributed factory system framework also includes application components and building blocks. The framework components are adapted to for managing the application components, while the application components are utilized to provide instructions for managing a process such as a wafer fab. The building blocks are adapted for forming or modifying framework and application components. The distributed factory system framework provides computer implemented methods for integrating processing systems and facilitates process and equipment changes.
摘要翻译：本发明提供了一种新颖的分布式工厂系统框架，其包括具有SW开发和集成（210），安装和管理（220），工厂建模（230），制造计划（240），制造控制，监控和跟踪（250）和制造结果分析（260）。工厂生命周期包括框架组件。分布式工厂系统框架还包括应用程序组件和构建块。框架组件适于用于管理应用组件，同时使用应用组件来提供用于管理诸如晶圆厂的过程的指令。构建块适用于形成或修改框架和应用程序组件。分布式工厂系统框架提供计算机实现的整合处理系统的方法，并促进过程和设备更改。

54. 发明授权

US06464564B2 System for real-time control of semiconductor wafer polishing 有权
公开(公告)号：US06464564B2
公开(公告)日：2002-10-15
申请号：US09838298
申请日：2001-04-18
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B24B100
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

55. 发明申请

US20020099473A1 Integrated computer-aided design (CAD) and robotic systems for rapid prototyping and manufacture of smart cards 审中-公开
标题翻译：集成计算机辅助设计（CAD）和智能卡快速原型制造的机器人系统
公开(公告)号：US20020099473A1
公开(公告)日：2002-07-25
申请号：US09976680
申请日：2001-10-12
发明人： Paul Amadeo , Jose Flores
IPC分类号： G05B019/04
CPC分类号： G05B19/04 , G05B19/00 , G05B19/4097 , G05B2219/40033 , G05B2219/45026 , Y02P90/265
摘要： A contactless smart card manufacturing system integrates computer-aided design (CAD) system and robotic systems to enable rapid set up for a new production design and rapid prototyping of a smart card designs. A user generates a CAD drawing representative of a desired smart card design. A robotic system uses the information in the CAD drawing file, e.g., Cartesian coordinates representative of desired feature dimensions and locations on the card, to control robotic systems to produce the desired feature in a smart card assembly.
摘要翻译：非接触智能卡制造系统集成了计算机辅助设计（CAD）系统和机器人系统，以便能够快速设置智能卡设计的新生产设计和快速原型设计。用户生成代表所需智能卡设计的CAD图。机器人系统使用CAD绘图文件中的信息，例如代表所需特征尺寸的笛卡尔坐标和卡上的位置，以控制机器人系统在智能卡组件中产生期望的特征。

56. 再颁专利

USRE37622E1 Wafer polishing method and apparatus 失效
标题翻译：晶圆抛光方法及装置
公开(公告)号：USRE37622E1
公开(公告)日：2002-04-02
申请号：US08792936
申请日：1997-01-24
申请人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi
发明人： Chris E. Karlsrud , Anthony G. Van Woerkom , Shigeru Odagiri , Isao Nagahashi
IPC分类号： B24B3704
CPC分类号： H01L21/6838 , B24B37/08 , B24B37/345 , B24B49/16 , B24B51/00 , G05B19/41825 , G05B2219/37399 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49356 , G05B2219/49361 , G05B2219/50007 , G05B2219/50362 , G05B2219/50371 , G05B2219/50381 , G05B2219/50388 , H01L21/67745 , H01L21/67751 , Y02P90/087
摘要： A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
摘要翻译：晶片抛光装置包括具有多个晶片载体的晶片抛光组件，用于基本上同时抛光多个晶片抵靠旋转的抛光表面。待研磨的多个晶片通过分度台的晶片保持装置基本上同时装载到多个晶片载体中。类似地，多个晶片载体基本上同时卸载到索引表的晶片保持装置中。晶片载体被单独计算机控制以精确抛光，并且不同的抛光要求可以通过不同的晶片载体同时满足。

57. 发明授权

US5975736A Scrubber control system 失效
标题翻译：洗衣机控制系统
公开(公告)号：US5975736A
公开(公告)日：1999-11-02
申请号：US687977
申请日：1996-07-29
申请人： Mark A. Simmons , Martin J. McGrath , David L. Thrasher
发明人： Mark A. Simmons , Martin J. McGrath , David L. Thrasher
IPC分类号： G05B19/418 , G05B15/00 , G06F17/00
CPC分类号： G05B19/4185 , G05B19/41855 , G05B2219/31226 , G05B2219/31234 , G05B2219/33136 , G05B2219/33161 , G05B2219/33168 , G05B2219/45026 , G05B2219/45232 , Y02P90/14 , Y02P90/185
摘要： A control system. An apparatus having a motor; a host processor for generating a message containing motor control information; a control board for receiving the message and for transmitting a command, corresponding to the message, to the motor; and a communications medium coupling the host processor and the control board. The communications medium supports a first communications path and a second communications path. The first communications path is for transmitting messages from the host processor to the control board. The second communications path is for transmitting messages from the control board to the host processor.
摘要翻译：控制系统。具有马达的装置; 主机处理器，用于生成包含电机控制信息的消息; 用于接收所述消息并将与所述消息对应的命令发送到所述电动机的控制板; 以及耦合主处理器和控制板的通信介质。通信介质支持第一通信路径和第二通信路径。第一通信路径用于将消息从主处理器发送到控制板。第二通信路径用于将消息从控制板传送到主机处理器。

58. 发明授权

US5856923A Method for continuous, non lot-based integrated circuit manufacturing 失效
标题翻译：连续，非批量集成电路制造方法
公开(公告)号：US5856923A
公开(公告)日：1999-01-05
申请号：US822731
申请日：1997-03-24
申请人： Mark L. Jones , Gregory A. Barnett
发明人： Mark L. Jones , Gregory A. Barnett
IPC分类号： G06Q50/00 , G05B19/12 , G06F11/00 , H01L21/02 , H01L27/02 , G06F19/00 , G06F7/64 , G06F7/66
CPC分类号： G05B19/128 , G01R31/31718 , G06F11/006 , H01L27/0207 , G05B2219/31296 , G05B2219/45026 , H01L2223/5444 , Y02P90/10
摘要： An inventive method for continuous, non lot-based manufacturing of integrated circuit (IC) devices of the type to each have a unique fuse identification (ID) includes: reading the fuse ID of each of the IC devices; advancing multiple lots of the IC devices through, for example, a test step in the manufacturing process in a substantially continuous manner; generating data, such as test data, related to the advancement of each of the IC devices through the step in the process; and associating the data generated for each of the IC devices with the fuse ID of its associated IC device. By associating the data with the fuse ID's, the inventive method allows the IC devices to be tracked through the step in the process. Further, because multiple lots of the IC devices can advance through the step in the process continuously, manufacturing resources are used more efficiently. In addition, because the fuse ID's and associated data read and generated using the inventive method need not physically accompany IC devices as they progress through the manufacturing process, the inventive method is more reliable than conventional tracking procedures.
摘要翻译：一种用于连续的，非批量地制造这种类型的集成电路（IC）装置的发明方法，每个具有唯一的熔丝识别（ID）包括：读取每个IC器件的熔丝ID; 通过例如基本上连续的制造过程中的测试步骤来推进多批IC器件; 通过该过程中的步骤生成与每个IC设备的进步相关的数据，例如测试数据; 并且将针对每个IC设备生成的数据与其相关联的IC设备的熔丝ID相关联。通过将数据与保险丝ID相关联，本发明的方法允许通过该过程中的步骤跟踪IC设备。此外，因为多个IC器件可以连续地延续该过程中的步骤，所以更有效地使用制造资源。另外，由于使用本发明的方法读取和产生的熔丝ID和相关数据在IC器件进行制造过程时不需要物理上伴随，所以本发明的方法比传统的跟踪程序更可靠。

59. 发明授权

US5751581A Material movement server 失效
标题翻译：物料搬运服务器
公开(公告)号：US5751581A
公开(公告)日：1998-05-12
申请号：US558962
申请日：1995-11-13
申请人： Lok L. Tau , Michael R. Conboy , Thomas P. Jackson
发明人： Lok L. Tau , Michael R. Conboy , Thomas P. Jackson
IPC分类号： G05B19/418 , H01L21/00 , H01L21/677 , G06F19/00
CPC分类号： G05B19/4183 , G05B2219/31296 , G05B2219/31312 , G05B2219/45026 , H01L21/67276 , H01L21/67294 , Y02P90/10 , Y02P90/18
摘要： A method for tracking products within a sequence of processes. The products are moved in carriers through the sequence and the products are initially arranged in groups. The products may be moved between different carriers during the sequence. The method includes the steps of: (a) assigning a first set of identification numbers to the products, a second set of identification numbers to the groups, and a third set of identification numbers to the carriers; and (b) tracking the movement of products through the sequence using the second set of identification numbers, tracking the movement of carriers using the third set of identification numbers, and synchronizing the movement of the products and the carriers.
摘要翻译：一种在一系列过程中跟踪产品的方法。产品通过顺序移动到承运人中，产品最初按组排列。在序列期间，产品可以在不同载体之间移动。该方法包括以下步骤：（a）向产品分配第一组标识号，向组分配第二组标识号，以及向载波分配第三组标识号; 和（b）使用第二组识别号码通过序列跟踪产品的移动，使用第三组识别号跟踪载体的移动，并使产品和载体的移动同步。

60. 发明授权

US5700180A System for real-time control of semiconductor wafer polishing 失效
标题翻译：半导体晶圆抛光实时控制系统
公开(公告)号：US5700180A
公开(公告)日：1997-12-23
申请号：US547529
申请日：1995-10-24
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/10 , B24B37/12 , B24B37/20 , B24B49/00 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B49/14 , B24B57/02 , G05B19/404 , B24B17/00
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.
摘要翻译：一种用于抛光半导体晶片的系统，所述系统包括用于以抛光速率抛光半导体晶片的表面和抛光均匀性的晶片抛光组件，所述晶片抛光组件包括限定抛光区域的压板子组件和选择性地抛光支撑半导体晶片并且保持半导体晶片的与压板子组件接触的面以抛光晶片表面; 以及控制器，在晶片抛光期间选择性地调整多个可调抛光参数之一。

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