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    • 51. 发明申请
    • Directed energy net shape method and apparatus
    • US20050173380A1
    • 2005-08-11
    • US11054770
    • 2005-02-09
    • Frank Carbone
    • Frank Carbone
    • B23K15/00B23K26/08B23K26/14B23K26/34
    • B22F3/1055B22F2003/1056B23K15/002B23K15/0046B23K15/0086B23K26/032B23K26/0853B23K26/1224B23K26/144B23K26/147B23K26/32B23K26/34B23K26/342B23K35/0244B23K2103/50B23P6/00B23P23/04Y02P10/295
    • An electron gun mounted on top of a vacuum chamber, the gun emitting an electron beam vertically downward towards a substrate placed upon a three axis movable stage, creating a molten pool on the substrate, which is translated along an automatically generated, pre-programmed path in a plane normal to the beam by an automated numerical controller. A wire feeder and spool surround the beam in an annular ring, providing continuous material feed and constant orientation of the wire to the beam and pool, producing a high rate of material deposition and near net shape geometry. Integrated machining and inspection heads sequentially machine each layer to net shape then non-destructively inspect each layer. A heat and microstructure management system employs chilled oil or liquid metal coolant circulating through a vat surrounding the movable stage, supported by an actuator that gradually submerges the substrate as the deposited layers grow, the circulating coolant removing heat and machine chips. An integrated system architecture including six subsystems ensures density (no voids), accuracy, reliability, repeatability and verifiability: an energy management system manages energy input, including beam density, diameter and position; a geometry acquisition and path planning system acquires the cross-sectional two dimensional geometry from a three dimensional computer generated mathematical model and computes numerical control paths for deposit, machining and inspection processes; a material deposition system controls the placement and rate of material deposited; an integrated machining system subtracts excess material from each layer; an inspection and repair system detects, removes, refills and remachines defective areas; a heat management system eliminates excess heat by controlling the temperature and flow of a liquid metal coolant, and improves the microstructure of the deposited material via transducer generated sonic frequencies; a supervisory control synchronizes and coordinates the interaction between the various subsystems.
    • 52. 发明申请
    • Method of making at least one hole in a transparent body and devices made by this method
    • 在透明体中制造至少一个孔的方法和通过该方法制造的装置
    • US20050025445A1
    • 2005-02-03
    • US10632364
    • 2003-07-31
    • Joseph SchoroederAlexander Streltsov
    • Joseph SchoroederAlexander Streltsov
    • B23K26/06B23K26/12B23K26/18B23K26/38B23K26/40C03B21/06C03B23/02C03B37/012C03C23/00G02B6/36G02B6/00
    • B23K26/009B23K26/064B23K26/0648B23K26/0665B23K26/1224B23K26/18B23K26/384B23K26/40B23K2103/172C03B21/06C03B23/02C03C23/0025G02B6/3636G02B6/3644G02B6/3652G02B6/3672G02B6/3688
    • A method of making an at least one hole in an optically transparent body comprises the following steps: (i) providing an ultrashort pulse laser for producing a laser output with a wavelength λ, the laser output having a subpicosecond laser pulse duration; (ii) providing a laser output focusing lens for focusing the laser output, the focusing lens having a numerical aperture NA; (iii) providing an optically transparent body, the optically transparent body having a transparency at λ of at least 90%/cm; (iv) providing a liquid filled container situated proximate to the optically transparent body, such that the optically transparent body is in direct contact with the liquid; and (v) directing the laser output through the focusing lens to produce a focused laser output with a subpicosecond laser pulse duration proximate the optically transparent body, wherein the focused laser output traces at least one hole track pattern through the transparent glass body while the optically transparent body and said focused laser output move relative to one another in X-Y-Z directions. The at least one hole track pattern is in contact with the liquid and the focused laser output, in conjunction with the liquid, creates at least one hole in the optically transparent body.
    • 在光学透明体中制造至少一个孔的方法包括以下步骤:(i)提供用于产生具有波长λ的激光输出的超短脉冲激光器,所述激光输出具有亚皮秒激光脉冲持续时间; (ii)提供用于聚焦激光输出的激光输出聚焦透镜,聚焦透镜具有数值孔径NA; (iii)提供光学透明体,所述光学透明体具有λ至少为90%/ cm 2的透明度; (iv)提供位于光学透明体附近的液体填充容器,使得光学透明体与液体直接接触; 和(v)通过聚焦透镜引导激光输出以产生具有邻近光学透明体的亚皮秒激光脉冲持续时间的聚焦激光输出,其中聚焦激光输出通过透明玻璃体追踪至少一个孔迹图案,而光学 透明体并且所述聚焦激光输出在XYZ方向上相对于彼此移动。 所述至少一个孔迹图案与液体接触并且聚焦的激光输出与液体一起在光学透明体中产生至少一个孔。
    • 54. 发明申请
    • Laser processing apparatus
    • 激光加工设备
    • US20040112882A1
    • 2004-06-17
    • US10654611
    • 2003-09-04
    • Hidekazu MiyairiYasuyuki Arai
    • B23K026/12
    • B23K26/1476B23K26/082B23K26/0821B23K26/0853B23K26/1224B23K26/123B23K26/142B23K26/40B23K2103/172B23K2103/50
    • The present invention provides a laser processing apparatus having a laser oscillator for outputting a pulsed laser beam; deflection unit for deflecting the pulsed laser beam to irradiate a object to be processed with the deflected pulsed laser beam; a mounting base on which the object is placed and which is movable in an axial direction or two-axial directions perpendicular to each other; and local shielding unit for controlling an atmosphere around the surface of the object to be processed which is irradiated with the laser beam. When a thin semiconductor film with a thickness of 1 nullm or less is formed over the surface, minute convex portions are formed, which causes a problem that characteristics of TFTs vary among elements. Minute particles generated and adhered to a main surface of a substrate through a laser processing, which is difficult to remove in general surface cleaning, become preventable by the invention.
    • 本发明提供一种具有用于输出脉冲激光束的激光振荡器的激光加工装置; 偏转单元,用于使脉冲激光束偏转以用偏转的脉冲激光束照射待处理的物体; 安装基座,物体被放置在该基座上并且可以在彼此垂直的轴向或双轴方向上移动; 以及局部屏蔽单元,用于控制被激光束照射的待处理物体表面周围的气氛。 当在表面上形成厚度为1μm或更小的薄的半导体膜时,形成微小的凸起部分,这导致TFT的特性在元件之间变化的问题。 本发明可以防止在通常的表面清洁中难以除去的通过激光加工产生并附着到基板主表面上的微粒子。