专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08916798B2 Laser machining apparatus with switchable laser system and laser machining method 有权
标题翻译：具有可切换激光系统和激光加工方法的激光加工设备
公开(公告)号：US08916798B2
公开(公告)日：2014-12-23
申请号：US13372546
申请日：2012-02-14
申请人： Christoph Plüss
发明人： Christoph Plüss
IPC分类号： B23K26/36 , B23K26/42 , B23K26/06 , B23P25/00 , B23K26/30 , B23K26/38 , B23K26/08
CPC分类号： B23P25/006 , B23K26/0624 , B23K26/083 , B23K26/0853 , B23K26/0861 , B23K26/0884 , B23K26/36 , B23K26/361 , B23K26/38 , B23K26/70
摘要： A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.
摘要翻译：一种用于从工件生产具有切割边缘和侧面的旋转切削工具的激光加工设备和方法。激光加工设备有两种不同的工作模式。在第一操作模式中，第一激光头用于以相对于第一激光头的工件的高进给速度加工工件，以形成具有在纳秒范围内的持续时间的脉冲的粗略期望轮廓，从而导致激光熔融切割。随后，激光加工装置在第二工作模式下工作，产生脉冲持续时间在皮秒范围内的激光脉冲。在第二操作模式中，第二激光头通过光学扫描器系统激活，并将激光脉冲引导到工件表面上的二维脉冲区域上，通过激光烧蚀实现材料去除。

2. 发明授权

US08772670B2 Dual gas laser cutting of medical devices 有权
标题翻译：双气体激光切割医疗器械
公开(公告)号：US08772670B2
公开(公告)日：2014-07-08
申请号：US13544322
申请日：2012-07-09
申请人： Jeffrey W. Baxter , David Mackiewicz
发明人： Jeffrey W. Baxter , David Mackiewicz
IPC分类号： B23K26/14 , B23K26/38 , B23K26/08 , B23K26/42 , A61F2/91
CPC分类号： B23K26/14 , A61F2/91 , B23K26/0823 , B23K26/083 , B23K26/142 , B23K26/147 , B23K26/1476 , B23K26/38 , B23K26/704 , B23K2101/06 , B23K2103/08 , B23K2103/14 , B23K2103/26
摘要： A system prevents oxidation of a laser cut workpiece by utilizing a laser source that utilizes laser source with an inert gas, such as argon or helium, rather than air or oxygen, to create the slots or kerfs which form the pattern cut into the workpiece. The system introduces oxygen gas through the workpiece as it is being laser cut to oxidize any slag or dross created during the laser cutting process. Oxygen or a mixture of oxygen with other gases cools the slag and the workpiece while at the same time oxidizing the slag to either completely burn or partial burn the slag before it strikes an exposed surface of the tubular member.
摘要翻译：系统通过利用利用激光源与诸如氩或氦的惰性气体而不是空气或氧气的激光源来防止激光切割工件的氧化，以产生形成切割成工件的图案的槽或切口。该系统在激光切割时将氧气引入工件，以氧化在激光切割过程中产生的任何炉渣或渣滓。氧气或氧气与其他气体的混合物冷却炉渣和工件，同时氧化炉渣，以在炉渣撞击管状构件的暴露表面之前完全燃烧或部分燃烧炉渣。

3. 发明申请

US20130298744A1 WORKPIECE DIVIDING METHOD 有权
标题翻译：工作分歧方法
公开(公告)号：US20130298744A1
公开(公告)日：2013-11-14
申请号：US13871125
申请日：2013-04-26
申请人： DISCO CORPORATION
发明人： Satoshi KUMAZAWA
IPC分类号： B26D9/00 , B23K26/42 , B23K26/36
CPC分类号： B26D9/00 , B23K26/0093 , B23K26/364 , B23K26/40 , B23K26/60 , B23K2103/50 , H01L33/0095 , Y10T83/0215
摘要： A workpiece dividing method for dividing a platelike workpiece into a plurality of individual chips. The workpiece dividing method includes a workpiece preparing step of preparing the platelike workpiece, at least one side of the workpiece being formed as a mat surface, a holding step of holding the workpiece on a holding surface of a chuck table in the condition where the mat surface of the workpiece is exposed, a cut groove forming step of cutting the mat surface of the workpiece held on the holding surface of the chuck table by using a cutting blade to thereby form a cut groove with a remaining portion, and a laser cutting step of applying a laser beam to the workpiece along the cut groove to thereby cut the remaining portion.
摘要翻译：一种用于将板状工件分割成多个单独芯片的工件分割方法。工件分割方法包括：制备板状工件的工件准备步骤，工件的至少一侧形成为垫表面;保持工序，其将工件保持在卡盘的保持面上，露出工件的表面，切割槽形成步骤，通过使用切割刀片来切割保持在卡盘的保持表面上的工件的垫表面，从而形成具有剩余部分的切割槽，以及激光切割步骤沿着切割槽将激光束施加到工件，从而切割剩余部分。

4. 发明授权

US08552337B2 Weld defect detection systems and methods for laser hybrid welding 有权
公开(公告)号：US08552337B2
公开(公告)日：2013-10-08
申请号：US12776274
申请日：2010-05-07
申请人： Bruce Patrick Albrecht
发明人： Bruce Patrick Albrecht
IPC分类号： B23K9/095 , B23K26/42
CPC分类号： B23K26/348 , B23K9/0953 , B23K9/0956 , B23K26/032 , B23K26/20 , B23K28/02 , B23K31/12 , B23K31/125 , B23K37/00
摘要： Laser hybrid welding systems adapted to identify and/or fix a weld defect occurring during a laser hybrid welding process are provided. Embodiments of the laser hybrid welding system may include one or more devices that provide feedback to a controller regarding one or more weld parameters. One embodiment of the laser hybrid welding system includes sensors that are adapted to measure the weld voltage and/or amperage during the welding process and transmit the acquired data to the controller for processing. Another embodiment of the laser hybrid welding system includes a lead camera and a lag camera that film an area directly in front of the weld location and directly behind the weld location.

5. 发明授权

US08436273B2 Machining information supply equipment and supply system 有权
标题翻译：加工信息供应设备和供应系统
公开(公告)号：US08436273B2
公开(公告)日：2013-05-07
申请号：US12669230
申请日：2008-07-04
申请人： Takeshi Sakamoto
发明人： Takeshi Sakamoto
IPC分类号： B23K26/04 , B23K26/42 , G06F19/00
CPC分类号： B23K26/38 , B23K26/40 , B23K2103/50 , G05B2219/45031 , G05B2219/45041 , G05B2219/49104
摘要： A processing information supply apparatus 10 is prepared for a laser processing apparatus for forming a modified region, which becomes a starting point of cutting, along a line to cut within an object to be processed by irradiating the object with laser light while locating a light-converging point within the object. The processing information supply apparatus 10 includes an object information input unit 12 for inputting processing object information on the object to be processed, a processing condition database 19 in which data on processing conditions corresponding to the processing object information is accumulated, a processing condition setting unit 16 for referring to the processing condition data in the database 19 and setting the processing condition for the object based on the processing object information, and a condition information output unit 13 for outputting processing condition information for the set processing condition. Thus, the processing information supply apparatus and the supply system capable of favorably acquiring the processing information applied to the laser processing apparatus at a processing worker side are realized.
摘要翻译：准备处理信息提供装置10，用于激光处理装置，用于通过用激光照射物体，沿着待切割的物体中的切割线切割成为切割的起始点，形成改变区域，对象内的收敛点。处理信息提供装置10包括用于输入关于待处理对象的处理对象信息的对象信息输入单元12，其中累积与处理对象信息相对应的处理条件的数据的处理条件数据库19，处理条件设置单元用于参照数据库19中的处理条件数据和基于处理对象信息设置对象的处理条件的条件信息输出单元13以及用于输出处理条件信息的条件信息输出单元13。因此，可以实现能够有利地获取在处理工作者侧应用于激光加工装置的处理信息的处理信息提供装置和供给系统。

6. 发明申请

US20120325788A1 APPARATUS FOR LASER PEENING HIDDEN SURFACES 审中-公开
标题翻译：用于激光照射隐形表面的装置
公开(公告)号：US20120325788A1
公开(公告)日：2012-12-27
申请号：US13487212
申请日：2012-06-03
申请人： David W. Sokol , Jeff L. Dulaney , Nickolas K. McCoy
发明人： David W. Sokol , Jeff L. Dulaney , Nickolas K. McCoy
IPC分类号： B23K26/00 , B23K26/42 , B23K26/073
CPC分类号： B23K26/356 , B23K26/009 , B23K26/0648 , B23K26/0884 , B23K26/18
摘要： Methods, systems, and apparatuses are disclosed for laser peening hidden surfaces.
摘要翻译：公开了用于激光喷丸隐藏表面的方法，系统和装置。

7. 发明授权

US08263903B2 Method for stablizing an output of a pulsed laser system using pulse shaping 有权
标题翻译：使用脉冲整形来稳定脉冲激光系统的输出的方法
公开(公告)号：US08263903B2
公开(公告)日：2012-09-11
申请号：US12782458
申请日：2010-05-18
申请人： Pascal Deladurantaye , Louis Desbiens , Yves Taillon , Dany Lemieux , Brian W. Baird
发明人： Pascal Deladurantaye , Louis Desbiens , Yves Taillon , Dany Lemieux , Brian W. Baird
IPC分类号： B23K26/42 , B23K26/06 , B23K26/073
CPC分类号： H01S5/06835 , H01S3/06758 , H01S3/094003 , H01S5/0057 , H01S5/0428
摘要： A method for stabilizing an output of a pulsed laser system includes a directly modulated laser diode by mitigating the effect of switching transients on the temporal shape of the outputted pulses. The method includes controlling a pulse shaping signal to define, over time, processing and conditioning periods. During the processing periods, the pulse shaping signal has an amplitude profile tailored to produce the desired temporal shape of the output. Each conditioning period either immediately precedes or follows a processing period. During a given processing period, the amplitude profile of the pulse shaping signal is tailored so that the drive current of the laser diode is lower than its maximum value during the corresponding processing period, and is of the same order of magnitude as the laser threshold current of the laser diode. In this manner, the stability of the output during the corresponding processing period is improved.
摘要翻译：用于稳定脉冲激光系统的输出的方法包括通过减轻对输出脉冲的时间形状的切换瞬变的影响的直接调制的激光二极管。该方法包括控制脉冲整形信号以定义时间上的处理和调节周期。在处理周期期间，脉冲整形信号具有调整的幅度分布，以产生输出的期望时间形状。每个调理期间紧接在处理期之前或之后。在给定的处理周期期间，调整脉冲整形信号的幅度分布，使得激光二极管的驱动电流在相应的处理周期内低于其最大值，并且与激光阈值电流具有相同的数量级的激光二极管。以这种方式，提高了在相应处理期间输出的稳定性。

8. 发明授权

US08220697B2 Weldability of alloys with directionally-solidified grain structure 有权
标题翻译：具有定向凝固的晶粒结构的合金的可焊性
公开(公告)号：US08220697B2
公开(公告)日：2012-07-17
申请号：US11036991
申请日：2005-01-18
申请人： Srikanth C. Kottilingam , Peter J. Ditzel
发明人： Srikanth C. Kottilingam , Peter J. Ditzel
IPC分类号： C22F1/10 , B23K26/32 , B23K26/42
CPC分类号： C22C21/00 , B23K26/356
摘要： A method of welding alloys having directionally-solidified grain structure. The methods improve the weldability of these alloys by creating a localized region of fine grain structure, wherein the welding occurs in these localized regions. The localized regions are formed by applying strain energy using a variety of different methods, such as by hammer peening, laser peening or sand blasting. Then, a heat treatment step may be used to create recrystallized grains having the fine grain structure. The region of fine grain structure provides better weldability.
摘要翻译：焊接具有定向凝固的晶粒结构的合金的方法。该方法通过产生细晶粒结构的局部区域来改善这些合金的可焊性，其中焊接发生在这些局部区域中。通过使用各种不同的方法施加应变能来形成局部区域，例如通过锤击，激光喷丸或喷砂。然后，可以使用热处理步骤来产生具有细晶粒结构的再结晶晶粒。细晶粒结构区域提供更好的焊接性。

9. 发明授权

US07847215B2 Jet trapping in a cutting beam processing machine 有权
标题翻译：喷射捕获在切割梁加工机中
公开(公告)号：US07847215B2
公开(公告)日：2010-12-07
申请号：US12043369
申请日：2008-03-06
申请人： Martin Blaser , Martin Petera
发明人： Martin Blaser , Martin Petera
IPC分类号： B23K26/16 , B23K26/42 , B23K26/38
CPC分类号： B23K7/002 , B23K7/10 , B23K26/38 , B23K26/704 , B23K37/0461
摘要： A beam-catching device is provided for a cutting-beam processing machine configured to deliver a cutting beam to a workpiece. The beam-catching device includes a housing which has a line-like opening pointing toward the cutting beam, the cutting beam discharging from the underside of the workpiece during processing of the workpiece and entering the housing through the opening, and a solid medium disposed within the housing and configured to move relative to the opening of the housing in a direction crossing the cutting beam in order to absorb energy.
摘要翻译：为被配置为将切割光束传送到工件的切割光束处理机器提供了一种束捕获装置。束捕获装置包括具有指向切割梁的线状开口的壳体，切割工具在工件加工期间从工件的下侧排出并通过开口进入壳体，以及固体介质，其布置在壳体并且构造成在与切割梁交叉的方向上相对于壳体的开口移动以吸收能量。

10. 发明申请

US20100147814A1 METHOD OF CUTTING PLASTIC SUBSTRATE AND APPARATUS FOR CUTTING PLASTIC SUBSTRATE 审中-公开
标题翻译：切割塑料基板的方法和切割塑料基板的装置
公开(公告)号：US20100147814A1
公开(公告)日：2010-06-17
申请号：US12518453
申请日：2007-10-29
申请人： Noriko Watanabe
发明人： Noriko Watanabe
IPC分类号： B23K26/16 , B23K26/38 , B23K26/42
CPC分类号： B23K26/38 , B23K26/1224 , B23K26/16 , B23K2103/42 , B23K2103/50 , G02F1/133305 , G02F1/133351
摘要： A laser emitter arranged to face a plastic substrate makes relative movement along a surface of the plastic substrate, while it is emitting a laser, so as to laser-cut the plastic substrate. In this process, a shield member is arranged outside a laser irradiation region on the plastic substrate.
摘要翻译：布置成面对塑料基板的激光发射器在发射激光时沿着塑料基板的表面相对移动，以激光切割塑料基板。在该过程中，屏蔽部件布置在塑料基板上的激光照射区域的外部。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式